CH393545A - Verfahren zum grossflächigen Verbinden einer Elektrode einer Halbleiteranordnung mit einem Kontaktteil - Google Patents
Verfahren zum grossflächigen Verbinden einer Elektrode einer Halbleiteranordnung mit einem KontaktteilInfo
- Publication number
- CH393545A CH393545A CH1139561A CH1139561A CH393545A CH 393545 A CH393545 A CH 393545A CH 1139561 A CH1139561 A CH 1139561A CH 1139561 A CH1139561 A CH 1139561A CH 393545 A CH393545 A CH 393545A
- Authority
- CH
- Switzerland
- Prior art keywords
- electrode
- large area
- contact part
- part over
- semiconductor arrangement
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/0105—Tin [Sn]
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- H01L2924/01051—Antimony [Sb]
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- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0071282 | 1960-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH393545A true CH393545A (de) | 1965-06-15 |
Family
ID=7502355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1139561A CH393545A (de) | 1960-11-16 | 1961-10-02 | Verfahren zum grossflächigen Verbinden einer Elektrode einer Halbleiteranordnung mit einem Kontaktteil |
Country Status (5)
Country | Link |
---|---|
US (1) | US3254393A (de) |
CH (1) | CH393545A (de) |
DE (1) | DE1439056A1 (de) |
GB (1) | GB930352A (de) |
NL (1) | NL270559A (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3492545A (en) * | 1968-03-18 | 1970-01-27 | Westinghouse Electric Corp | Electrically and thermally conductive malleable layer embodying lead foil |
US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
US4529836A (en) * | 1983-07-15 | 1985-07-16 | Sperry Corporation | Stress absorption matrix |
DE3446780A1 (de) * | 1984-12-21 | 1986-07-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen |
US5436407A (en) * | 1994-06-13 | 1995-07-25 | Integrated Packaging Assembly Corporation | Metal semiconductor package with an external plastic seal |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2258681A (en) * | 1939-04-15 | 1941-10-14 | Aluminum Co Of America | Method of joining |
US2362893A (en) * | 1942-04-04 | 1944-11-14 | Metals & Controls Corp | Solder |
US2497665A (en) * | 1945-02-07 | 1950-02-14 | Brush Dev Co | Piezoelectric device |
US2530110A (en) * | 1944-06-02 | 1950-11-14 | Sperry Corp | Nonlinear circuit device utilizing germanium |
US2623273A (en) * | 1945-05-05 | 1952-12-30 | Indium Corp America | Soldered joint and method of making same |
US2474643A (en) * | 1947-06-04 | 1949-06-28 | Carboloy Company Inc | Method of brazing cemented carbides to steel |
DE1071847B (de) * | 1956-03-07 | 1959-12-24 | Western Electric Company, Incorporated, New York, N. Y. (V. St. A.) | Verfahren zur Herstellung einer im wesentlichen nicht gleichrichtenden flächenhaften Elektrode an dem Halbleiterkörper einer Halbleiteranordnung durch Legierung |
US2922092A (en) * | 1957-05-09 | 1960-01-19 | Westinghouse Electric Corp | Base contact members for semiconductor devices |
US2917686A (en) * | 1957-08-19 | 1959-12-15 | Westinghouse Electric Corp | Semiconductor rectifier device |
US3089067A (en) * | 1957-09-30 | 1963-05-07 | Gen Motors Corp | Semiconductor device |
US3046651A (en) * | 1958-03-14 | 1962-07-31 | Honeywell Regulator Co | Soldering technique |
US2982892A (en) * | 1958-06-11 | 1961-05-02 | Hughes Aircraft Co | Semiconductor device and method of making the same |
NL241491A (de) * | 1958-07-21 | |||
US3020454A (en) * | 1959-11-09 | 1962-02-06 | Solid State Products Inc | Sealing of electrical semiconductor devices |
-
0
- NL NL270559D patent/NL270559A/xx unknown
-
1960
- 1960-11-16 DE DE19601439056 patent/DE1439056A1/de active Pending
-
1961
- 1961-10-02 CH CH1139561A patent/CH393545A/de unknown
- 1961-10-31 US US148958A patent/US3254393A/en not_active Expired - Lifetime
- 1961-11-16 GB GB41021/61A patent/GB930352A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL270559A (de) | 1900-01-01 |
GB930352A (en) | 1963-07-03 |
DE1439056A1 (de) | 1969-10-16 |
US3254393A (en) | 1966-06-07 |
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