CA989523A - Process for the manufacture of semiconductor structural elements - Google Patents

Process for the manufacture of semiconductor structural elements

Info

Publication number
CA989523A
CA989523A CA170,224A CA170224A CA989523A CA 989523 A CA989523 A CA 989523A CA 170224 A CA170224 A CA 170224A CA 989523 A CA989523 A CA 989523A
Authority
CA
Canada
Prior art keywords
manufacture
structural elements
semiconductor structural
semiconductor
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA170,224A
Other languages
English (en)
Other versions
CA170224S (en
Inventor
Heinz Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722221673 external-priority patent/DE2221673C3/de
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of CA989523A publication Critical patent/CA989523A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
CA170,224A 1972-05-03 1973-05-02 Process for the manufacture of semiconductor structural elements Expired CA989523A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722221673 DE2221673C3 (de) 1972-05-03 Verfahren zum Herstellen eines Halbleiterbauelementes

Publications (1)

Publication Number Publication Date
CA989523A true CA989523A (en) 1976-05-18

Family

ID=5843952

Family Applications (1)

Application Number Title Priority Date Filing Date
CA170,224A Expired CA989523A (en) 1972-05-03 1973-05-02 Process for the manufacture of semiconductor structural elements

Country Status (10)

Country Link
JP (2) JPS4956587A (it)
AT (1) AT339374B (it)
BE (1) BE799037A (it)
CA (1) CA989523A (it)
CH (1) CH548669A (it)
ES (1) ES410341A1 (it)
FR (1) FR2182791B1 (it)
GB (1) GB1362942A (it)
IT (1) IT984159B (it)
NL (1) NL7306175A (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8928492D0 (en) * 1989-12-18 1990-02-21 Westinghouse Brake & Signal Housings for semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL264049A (it) * 1960-04-29
JPS5128505B2 (it) * 1972-02-03 1976-08-19
JPS5128505A (ja) * 1974-09-04 1976-03-10 Nippon Steel Corp Yokoro

Also Published As

Publication number Publication date
ES410341A1 (es) 1976-01-01
CH548669A (de) 1974-04-30
AT339374B (de) 1977-10-10
ATA1062072A (de) 1977-02-15
DE2221673B2 (de) 1977-04-14
DE2221673A1 (de) 1973-11-15
NL7306175A (it) 1973-11-06
FR2182791A1 (it) 1973-12-14
BE799037A (fr) 1973-11-05
IT984159B (it) 1974-11-20
GB1362942A (en) 1974-08-07
FR2182791B1 (it) 1977-12-30
JPS5778648U (it) 1982-05-15
JPS4956587A (it) 1974-06-01

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