CA982699A - Method of depositing electrode leads - Google Patents

Method of depositing electrode leads

Info

Publication number
CA982699A
CA982699A CA172,813A CA172813A CA982699A CA 982699 A CA982699 A CA 982699A CA 172813 A CA172813 A CA 172813A CA 982699 A CA982699 A CA 982699A
Authority
CA
Canada
Prior art keywords
electrode leads
depositing electrode
depositing
leads
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA172,813A
Other languages
English (en)
Other versions
CA172813S (en
Inventor
Ram S. Ronen
Edward A. James
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Application granted granted Critical
Publication of CA982699A publication Critical patent/CA982699A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
CA172,813A 1972-06-23 1973-05-31 Method of depositing electrode leads Expired CA982699A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26555072A 1972-06-23 1972-06-23

Publications (1)

Publication Number Publication Date
CA982699A true CA982699A (en) 1976-01-27

Family

ID=23010926

Family Applications (1)

Application Number Title Priority Date Filing Date
CA172,813A Expired CA982699A (en) 1972-06-23 1973-05-31 Method of depositing electrode leads

Country Status (10)

Country Link
US (1) US3801477A (fr)
JP (1) JPS4957373A (fr)
BE (1) BE801196A (fr)
CA (1) CA982699A (fr)
DE (1) DE2331534A1 (fr)
FR (1) FR2189873B1 (fr)
GB (1) GB1416650A (fr)
IT (1) IT989353B (fr)
NL (1) NL7308737A (fr)
SE (1) SE381777B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983284A (en) * 1972-06-02 1976-09-28 Thomson-Csf Flat connection for a semiconductor multilayer structure
US4022930A (en) * 1975-05-30 1977-05-10 Bell Telephone Laboratories, Incorporated Multilevel metallization for integrated circuits
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
JP4815771B2 (ja) * 2004-09-01 2011-11-16 住友電気工業株式会社 電気部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495324A (en) * 1967-11-13 1970-02-17 Sperry Rand Corp Ohmic contact for planar devices
GB1250248A (fr) * 1969-06-12 1971-10-20

Also Published As

Publication number Publication date
AU5724073A (en) 1975-01-09
NL7308737A (fr) 1973-12-27
FR2189873A1 (fr) 1974-01-25
JPS4957373A (fr) 1974-06-04
IT989353B (it) 1975-05-20
SE381777B (sv) 1975-12-15
FR2189873B1 (fr) 1977-09-09
US3801477A (en) 1974-04-02
BE801196A (fr) 1973-10-15
GB1416650A (en) 1975-12-03
DE2331534A1 (de) 1974-01-17

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