CA978660A - Beam-lead semiconductor component - Google Patents

Beam-lead semiconductor component

Info

Publication number
CA978660A
CA978660A CA154,887A CA154887A CA978660A CA 978660 A CA978660 A CA 978660A CA 154887 A CA154887 A CA 154887A CA 978660 A CA978660 A CA 978660A
Authority
CA
Canada
Prior art keywords
semiconductor component
lead semiconductor
lead
component
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA154,887A
Other languages
English (en)
Other versions
CA154887S (en
Inventor
Hermann Kniepkamp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712153889 external-priority patent/DE2153889C3/de
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of CA978660A publication Critical patent/CA978660A/en
Expired legal-status Critical Current

Links

Classifications

    • H10P14/46—
    • H10W72/00—
    • H10W72/60—
CA154,887A 1971-10-28 1972-10-26 Beam-lead semiconductor component Expired CA978660A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712153889 DE2153889C3 (de) 1971-10-28 Beam-lead-Halbleiterbauelement und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
CA978660A true CA978660A (en) 1975-11-25

Family

ID=5823693

Family Applications (1)

Application Number Title Priority Date Filing Date
CA154,887A Expired CA978660A (en) 1971-10-28 1972-10-26 Beam-lead semiconductor component

Country Status (11)

Country Link
US (1) US3808470A (enExample)
JP (1) JPS5630701B2 (enExample)
BE (1) BE790652A (enExample)
CA (1) CA978660A (enExample)
CH (1) CH546482A (enExample)
FR (1) FR2158019B1 (enExample)
GB (1) GB1359780A (enExample)
IT (1) IT969931B (enExample)
LU (1) LU66376A1 (enExample)
NL (1) NL7214432A (enExample)
SE (1) SE376115B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4143384A (en) * 1975-12-11 1979-03-06 Raytheon Company Low parasitic capacitance diode
US4238763A (en) * 1977-08-10 1980-12-09 National Research Development Corporation Solid state microwave devices with small active contact and large passive contact
US4467521A (en) * 1983-08-15 1984-08-28 Sperry Corporation Selective epitaxial growth of gallium arsenide with selective orientation
US4499656A (en) * 1983-08-15 1985-02-19 Sperry Corporation Deep mesa process for fabricating monolithic integrated Schottky barrier diode for millimeter wave mixers
US4912540A (en) * 1986-12-17 1990-03-27 Advanced Micro Devices, Inc. Reduced area butting contact structure
US5021840A (en) * 1987-08-18 1991-06-04 Texas Instruments Incorporated Schottky or PN diode with composite sidewall
US5280194A (en) * 1988-11-21 1994-01-18 Micro Technology Partners Electrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device
US5403729A (en) * 1992-05-27 1995-04-04 Micro Technology Partners Fabricating a semiconductor with an insulative coating
US5521420A (en) * 1992-05-27 1996-05-28 Micro Technology Partners Fabricating a semiconductor with an insulative coating
US5656547A (en) * 1994-05-11 1997-08-12 Chipscale, Inc. Method for making a leadless surface mounted device with wrap-around flange interface contacts
AU2659995A (en) * 1994-06-09 1996-01-04 Chipscale, Inc. Resistor fabrication
US6100194A (en) * 1998-06-22 2000-08-08 Stmicroelectronics, Inc. Silver metallization by damascene method
ITTO20011038A1 (it) * 2001-10-30 2003-04-30 St Microelectronics Srl Procedimento per la fabbricazione di una fetta semiconduttrice integrante dispositivi elettronici e una struttura per il disaccoppiamento el
EP2307584A4 (en) * 2008-07-07 2011-08-10 Sandvik Intellectual Property SILVER ALLOY ANTI-TERNISSURE

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290565A (en) * 1963-10-24 1966-12-06 Philco Corp Glass enclosed, passivated semiconductor with contact means of alternate layers of chromium, silver and chromium
NL6701136A (enExample) * 1967-01-25 1968-07-26

Also Published As

Publication number Publication date
NL7214432A (enExample) 1973-05-02
CH546482A (de) 1974-02-28
IT969931B (it) 1974-04-10
LU66376A1 (enExample) 1973-01-23
DE2153889B2 (de) 1977-04-28
FR2158019A1 (enExample) 1973-06-08
DE2153889A1 (de) 1973-05-03
US3808470A (en) 1974-04-30
SE376115B (enExample) 1975-05-05
JPS5630701B2 (enExample) 1981-07-16
GB1359780A (en) 1974-07-10
BE790652A (fr) 1973-02-15
FR2158019B1 (enExample) 1976-08-20
JPS4853674A (enExample) 1973-07-27

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