CA924259A - Copper electroplating - Google Patents

Copper electroplating

Info

Publication number
CA924259A
CA924259A CA050039A CA50039A CA924259A CA 924259 A CA924259 A CA 924259A CA 050039 A CA050039 A CA 050039A CA 50039 A CA50039 A CA 50039A CA 924259 A CA924259 A CA 924259A
Authority
CA
Canada
Prior art keywords
copper electroplating
electroplating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA050039A
Other languages
English (en)
Other versions
CA50039S (en
Inventor
Kardos Otto
B. Durham Hugh
A. Arcilesi Donald
J. Tomson Arthur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Application granted granted Critical
Publication of CA924259A publication Critical patent/CA924259A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C255/00—Carboxylic acid nitriles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CA050039A 1968-04-29 1969-04-29 Copper electroplating Expired CA924259A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72520968A 1968-04-29 1968-04-29

Publications (1)

Publication Number Publication Date
CA924259A true CA924259A (en) 1973-04-10

Family

ID=24913601

Family Applications (1)

Application Number Title Priority Date Filing Date
CA050039A Expired CA924259A (en) 1968-04-29 1969-04-29 Copper electroplating

Country Status (12)

Country Link
US (1) US3542655A (enrdf_load_stackoverflow)
JP (1) JPS4934887B1 (enrdf_load_stackoverflow)
BE (1) BE732051A (enrdf_load_stackoverflow)
BR (1) BR6908411D0 (enrdf_load_stackoverflow)
CA (1) CA924259A (enrdf_load_stackoverflow)
CH (1) CH537462A (enrdf_load_stackoverflow)
DE (1) DE1921845C3 (enrdf_load_stackoverflow)
ES (1) ES366560A1 (enrdf_load_stackoverflow)
FR (1) FR2007169A1 (enrdf_load_stackoverflow)
GB (1) GB1213097A (enrdf_load_stackoverflow)
NL (1) NL165513C (enrdf_load_stackoverflow)
SE (1) SE357771B (enrdf_load_stackoverflow)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715289A (en) * 1971-02-08 1973-02-06 Stauffer Chemical Co Brightener composition for acid copper electroplating baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
US3804729A (en) * 1972-06-19 1974-04-16 M & T Chemicals Inc Electrolyte and process for electro-depositing copper
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4781801A (en) * 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
EP0469724B1 (en) * 1990-08-03 1995-06-07 Mcgean-Rohco, Inc. Copper plating of gravure rolls
TWI330587B (en) * 2002-07-26 2010-09-21 Clopay Plastic Prod Co Breathable materials comprising low-elongation fabrics, and methods
EP1422320A1 (en) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
EP2537962A1 (en) * 2011-06-22 2012-12-26 Atotech Deutschland GmbH Method for copper plating
US10060034B2 (en) * 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
CN109778264A (zh) * 2017-11-10 2019-05-21 丹阳市金地生态园林发展有限公司 一种含环氧氯丙烷金属合金抗静电电镀液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2663684A (en) * 1952-06-02 1953-12-22 Houdaille Hershey Corp Method of and composition for plating copper
US2700020A (en) * 1952-06-02 1955-01-18 Houdaille Hershey Corp Plating copper
US2840518A (en) * 1954-07-19 1958-06-24 Westinghouse Electric Corp Acid copper addition agents and plating electrolytes embodying the same
NL291575A (enrdf_load_stackoverflow) * 1962-04-16
US3288690A (en) * 1962-04-16 1966-11-29 Udylite Corp Electrodeposition of copper from acidic baths
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths

Also Published As

Publication number Publication date
GB1213097A (en) 1970-11-18
DE1921845A1 (de) 1969-11-06
CH537462A (de) 1973-05-31
BE732051A (enrdf_load_stackoverflow) 1969-10-01
FR2007169A1 (enrdf_load_stackoverflow) 1970-01-02
JPS4934887B1 (enrdf_load_stackoverflow) 1974-09-18
NL6906599A (enrdf_load_stackoverflow) 1969-10-31
BR6908411D0 (pt) 1973-01-09
SE357771B (enrdf_load_stackoverflow) 1973-07-09
NL165513B (nl) 1980-11-17
DE1921845C3 (de) 1980-07-31
NL165513C (nl) 1981-04-15
ES366560A1 (es) 1971-07-16
US3542655A (en) 1970-11-24
DE1921845B2 (de) 1979-11-15

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