CA3258202A1 - COOLING SYSTEM FOR LIQUID IMMERSION COOLING OF ELECTRONIC COMPONENTS - Google Patents

COOLING SYSTEM FOR LIQUID IMMERSION COOLING OF ELECTRONIC COMPONENTS

Info

Publication number
CA3258202A1
CA3258202A1 CA3258202A CA3258202A CA3258202A1 CA 3258202 A1 CA3258202 A1 CA 3258202A1 CA 3258202 A CA3258202 A CA 3258202A CA 3258202 A CA3258202 A CA 3258202A CA 3258202 A1 CA3258202 A1 CA 3258202A1
Authority
CA
Canada
Prior art keywords
vessel
heat transfer
condenser unit
cooling system
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3258202A
Other languages
English (en)
French (fr)
Inventor
Achim Gotterbarm
Harald Gaibler
Gunter Fetzer
Verena Obst
Alexander Reuter
Heribert ROSCH
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Publication of CA3258202A1 publication Critical patent/CA3258202A1/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CA3258202A 2022-07-25 2023-06-30 COOLING SYSTEM FOR LIQUID IMMERSION COOLING OF ELECTRONIC COMPONENTS Pending CA3258202A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102022002696.1A DE102022002696B3 (de) 2022-07-25 2022-07-25 Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
DE102022002696.1 2022-07-25
PCT/EP2023/000042 WO2024022606A1 (de) 2022-07-25 2023-06-30 Kühlsystem zur flüssigkeitsimmersionskühlung von elektronischen bauteilen

Publications (1)

Publication Number Publication Date
CA3258202A1 true CA3258202A1 (en) 2025-04-08

Family

ID=85476964

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3258202A Pending CA3258202A1 (en) 2022-07-25 2023-06-30 COOLING SYSTEM FOR LIQUID IMMERSION COOLING OF ELECTRONIC COMPONENTS

Country Status (10)

Country Link
US (1) US20260107416A1 (enExample)
EP (1) EP4562980A1 (enExample)
JP (1) JP2025524883A (enExample)
KR (1) KR20250042706A (enExample)
CN (1) CN119318213A (enExample)
CA (1) CA3258202A1 (enExample)
DE (1) DE102022002696B3 (enExample)
MX (1) MX2024015423A (enExample)
TW (1) TW202423231A (enExample)
WO (1) WO2024022606A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12363862B2 (en) * 2022-09-06 2025-07-15 Delta Electronics, Inc. Two-phase immersion cooling system, working fluid recovery device and method
WO2024237947A1 (en) * 2023-05-16 2024-11-21 MTS IP Holdings Ltd Bellows for immersion cooling
DE102023002672B3 (de) * 2023-06-30 2024-08-29 Wieland-Werke Aktiengesellschaft Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
CN116723685B (zh) 2023-08-08 2023-11-03 苏州浪潮智能科技有限公司 液冷散热系统
US20260020183A1 (en) * 2024-07-09 2026-01-15 Quanta Computer Inc. Immersion cooling system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10512192B2 (en) 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
GB2549946A (en) 2016-05-03 2017-11-08 Bitfury Group Ltd Immersion cooling
US11102912B2 (en) 2018-09-19 2021-08-24 TMGCore, LLC Liquid immersion cooling platform
US11076508B2 (en) 2019-11-14 2021-07-27 Baidu Usa Llc Cooling systems for immersion cooled IT equipment
US11076505B2 (en) * 2019-12-13 2021-07-27 Baidu Usa Llc Cooling system for edge computing device
JP7421176B2 (ja) 2020-01-07 2024-01-24 大成建設株式会社 液浸冷却システム
US10966349B1 (en) 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management
US20210410320A1 (en) * 2021-09-13 2021-12-30 Intel Corporation Immersion cooling system with coolant boiling point reduction for increased cooling capacity

Also Published As

Publication number Publication date
MX2024015423A (es) 2025-02-10
TW202423231A (zh) 2024-06-01
JP2025524883A (ja) 2025-08-01
KR20250042706A (ko) 2025-03-27
EP4562980A1 (de) 2025-06-04
CN119318213A (zh) 2025-01-14
DE102022002696B3 (de) 2023-03-30
WO2024022606A1 (de) 2024-02-01
US20260107416A1 (en) 2026-04-16

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