TW202423231A - 用於電子器件之液體浸入式冷卻的冷卻系統 - Google Patents

用於電子器件之液體浸入式冷卻的冷卻系統 Download PDF

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Publication number
TW202423231A
TW202423231A TW112114822A TW112114822A TW202423231A TW 202423231 A TW202423231 A TW 202423231A TW 112114822 A TW112114822 A TW 112114822A TW 112114822 A TW112114822 A TW 112114822A TW 202423231 A TW202423231 A TW 202423231A
Authority
TW
Taiwan
Prior art keywords
container
heat transfer
transfer fluid
condensing unit
cooling
Prior art date
Application number
TW112114822A
Other languages
English (en)
Chinese (zh)
Inventor
剛特 費澤
阿勤 構特巴姆
哈拉德 蓋柏勒
亞歷山大 路特
賀里伯特 羅斯曲
維雷納 奧布斯特
Original Assignee
德商威蘭 握克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商威蘭 握克公司 filed Critical 德商威蘭 握克公司
Publication of TW202423231A publication Critical patent/TW202423231A/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW112114822A 2022-07-25 2023-04-20 用於電子器件之液體浸入式冷卻的冷卻系統 TW202423231A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102022002696.1A DE102022002696B3 (de) 2022-07-25 2022-07-25 Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
DE102022002696.1 2022-07-25

Publications (1)

Publication Number Publication Date
TW202423231A true TW202423231A (zh) 2024-06-01

Family

ID=85476964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112114822A TW202423231A (zh) 2022-07-25 2023-04-20 用於電子器件之液體浸入式冷卻的冷卻系統

Country Status (10)

Country Link
US (1) US20260107416A1 (enExample)
EP (1) EP4562980A1 (enExample)
JP (1) JP2025524883A (enExample)
KR (1) KR20250042706A (enExample)
CN (1) CN119318213A (enExample)
CA (1) CA3258202A1 (enExample)
DE (1) DE102022002696B3 (enExample)
MX (1) MX2024015423A (enExample)
TW (1) TW202423231A (enExample)
WO (1) WO2024022606A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI908339B (zh) * 2024-07-09 2025-12-11 廣達電腦股份有限公司 浸沒冷卻系統

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12363862B2 (en) * 2022-09-06 2025-07-15 Delta Electronics, Inc. Two-phase immersion cooling system, working fluid recovery device and method
WO2024237947A1 (en) * 2023-05-16 2024-11-21 MTS IP Holdings Ltd Bellows for immersion cooling
DE102023002672B3 (de) * 2023-06-30 2024-08-29 Wieland-Werke Aktiengesellschaft Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
CN116723685B (zh) 2023-08-08 2023-11-03 苏州浪潮智能科技有限公司 液冷散热系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10512192B2 (en) 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
GB2549946A (en) 2016-05-03 2017-11-08 Bitfury Group Ltd Immersion cooling
US11102912B2 (en) 2018-09-19 2021-08-24 TMGCore, LLC Liquid immersion cooling platform
US11076508B2 (en) 2019-11-14 2021-07-27 Baidu Usa Llc Cooling systems for immersion cooled IT equipment
US11076505B2 (en) * 2019-12-13 2021-07-27 Baidu Usa Llc Cooling system for edge computing device
JP7421176B2 (ja) 2020-01-07 2024-01-24 大成建設株式会社 液浸冷却システム
US10966349B1 (en) 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management
US20210410320A1 (en) * 2021-09-13 2021-12-30 Intel Corporation Immersion cooling system with coolant boiling point reduction for increased cooling capacity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI908339B (zh) * 2024-07-09 2025-12-11 廣達電腦股份有限公司 浸沒冷卻系統

Also Published As

Publication number Publication date
MX2024015423A (es) 2025-02-10
JP2025524883A (ja) 2025-08-01
CA3258202A1 (en) 2025-04-08
KR20250042706A (ko) 2025-03-27
EP4562980A1 (de) 2025-06-04
CN119318213A (zh) 2025-01-14
DE102022002696B3 (de) 2023-03-30
WO2024022606A1 (de) 2024-02-01
US20260107416A1 (en) 2026-04-16

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