CA2986503A1 - Parametrage de transfert de microdispositif - Google Patents

Parametrage de transfert de microdispositif Download PDF

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Publication number
CA2986503A1
CA2986503A1 CA2986503A CA2986503A CA2986503A1 CA 2986503 A1 CA2986503 A1 CA 2986503A1 CA 2986503 A CA2986503 A CA 2986503A CA 2986503 A CA2986503 A CA 2986503A CA 2986503 A1 CA2986503 A1 CA 2986503A1
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CA
Canada
Prior art keywords
substrate
devices
cartridge
layer
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA2986503A
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English (en)
Inventor
Reza Chaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vuereal Inc
Original Assignee
Vuereal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vuereal Inc filed Critical Vuereal Inc
Priority to CA2986503A priority Critical patent/CA2986503A1/fr
Priority to CN202310686145.0A priority patent/CN116682777A/zh
Priority to TW107141925A priority patent/TWI686919B/zh
Priority to CN201811405946.0A priority patent/CN109830455B/zh
Priority to US16/206,393 priority patent/US10916523B2/en
Priority to DE102019101489.1A priority patent/DE102019101489A1/de
Publication of CA2986503A1 publication Critical patent/CA2986503A1/fr
Priority to US17/017,071 priority patent/US20200411471A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
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    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0095Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L33/0093Wafer bonding; Removal of the growth substrate

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
CA2986503A 2016-11-25 2017-11-23 Parametrage de transfert de microdispositif Abandoned CA2986503A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CA2986503A CA2986503A1 (fr) 2017-11-23 2017-11-23 Parametrage de transfert de microdispositif
CN202310686145.0A CN116682777A (zh) 2017-11-23 2018-11-23 微器件转移到系统衬底中的方法
TW107141925A TWI686919B (zh) 2017-11-23 2018-11-23 微裝置傳送設置及微裝置於系統基板中之整合
CN201811405946.0A CN109830455B (zh) 2017-11-23 2018-11-23 微器件转移到系统衬底中的方法
US16/206,393 US10916523B2 (en) 2016-11-25 2018-11-30 Microdevice transfer setup and integration of micro-devices into system substrate
DE102019101489.1A DE102019101489A1 (de) 2017-11-23 2019-01-22 Mikrovorrichtungsübertragungsaufbau und integration von mikrovorrichtungen in ein systemsubstrat
US17/017,071 US20200411471A1 (en) 2016-11-25 2020-09-10 Microdevice transfer setup and integration of micro-devices into system substrate

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WO2023015382A1 (fr) * 2021-08-09 2023-02-16 Vuereal Inc. Libération sélective de microdispositifs

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DE102019101489A1 (de) 2017-11-23 2019-05-23 Vuereal Inc. Mikrovorrichtungsübertragungsaufbau und integration von mikrovorrichtungen in ein systemsubstrat
US20220254950A1 (en) * 2019-05-24 2022-08-11 Vuereal Inc. Selective release and transfer of micro devices
WO2020252577A1 (fr) * 2019-06-18 2020-12-24 Vuereal Inc. Procédé de micro-impression à haut rendement
WO2023015382A1 (fr) * 2021-08-09 2023-02-16 Vuereal Inc. Libération sélective de microdispositifs

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TW201926633A (zh) 2019-07-01

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