CA2984214A1 - Integration de micro-dispositifs dans un substrat de systeme - Google Patents
Integration de micro-dispositifs dans un substrat de systeme Download PDFInfo
- Publication number
- CA2984214A1 CA2984214A1 CA2984214A CA2984214A CA2984214A1 CA 2984214 A1 CA2984214 A1 CA 2984214A1 CA 2984214 A CA2984214 A CA 2984214A CA 2984214 A CA2984214 A CA 2984214A CA 2984214 A1 CA2984214 A1 CA 2984214A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- devices
- layer
- cartridge
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2984214A CA2984214A1 (fr) | 2017-10-30 | 2017-10-30 | Integration de micro-dispositifs dans un substrat de systeme |
| PCT/IB2017/057310 WO2018096455A1 (fr) | 2016-11-25 | 2017-11-22 | Intégration de micro-dispositifs dans un substrat de système |
| KR1020197017985A KR102438882B1 (ko) | 2016-11-25 | 2017-11-22 | 시스템 기판으로의 마이크로 디바이스의 집적 |
| US15/820,683 US10468472B2 (en) | 2016-11-25 | 2017-11-22 | Integration of micro-devices into system substrate |
| KR1020227029727A KR20220123750A (ko) | 2016-11-25 | 2017-11-22 | 시스템 기판으로의 마이크로 디바이스의 집적 |
| CN201780072978.0A CN110036492B (zh) | 2016-11-25 | 2017-11-22 | 将微装置集成到系统衬底中 |
| US16/206,393 US10916523B2 (en) | 2016-11-25 | 2018-11-30 | Microdevice transfer setup and integration of micro-devices into system substrate |
| US16/542,010 US10978530B2 (en) | 2016-11-25 | 2019-08-15 | Integration of microdevices into system substrate |
| US16/542,019 US10998352B2 (en) | 2016-11-25 | 2019-08-15 | Integration of microdevices into system substrate |
| US17/017,071 US20200411471A1 (en) | 2016-11-25 | 2020-09-10 | Microdevice transfer setup and integration of micro-devices into system substrate |
| US17/083,403 US20210074573A1 (en) | 2016-11-25 | 2020-10-29 | Integration of microdevices into system substrate |
| US17/218,589 US20210242287A1 (en) | 2016-11-25 | 2021-03-31 | Integration of microdevices into system substrate |
| US18/053,901 US20230078708A1 (en) | 2016-11-25 | 2022-11-09 | Integration of microdevices into system substrate |
| US18/209,105 US20230326937A1 (en) | 2016-11-25 | 2023-06-13 | Integration of microdevices into system substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2984214A CA2984214A1 (fr) | 2017-10-30 | 2017-10-30 | Integration de micro-dispositifs dans un substrat de systeme |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2984214A1 true CA2984214A1 (fr) | 2019-04-30 |
Family
ID=66329164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2984214A Abandoned CA2984214A1 (fr) | 2016-11-25 | 2017-10-30 | Integration de micro-dispositifs dans un substrat de systeme |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2984214A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021108903A1 (fr) * | 2019-12-02 | 2021-06-10 | Vuereal Inc. | Création de stadification dans un fond de panier pour l'intégration de micro-dispositifs |
| CN112967976A (zh) * | 2020-06-19 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | 一种巨量转移装置及转移方法 |
| US11777059B2 (en) | 2019-11-20 | 2023-10-03 | Lumileds Llc | Pixelated light-emitting diode for self-aligned photoresist patterning |
-
2017
- 2017-10-30 CA CA2984214A patent/CA2984214A1/fr not_active Abandoned
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11777059B2 (en) | 2019-11-20 | 2023-10-03 | Lumileds Llc | Pixelated light-emitting diode for self-aligned photoresist patterning |
| WO2021108903A1 (fr) * | 2019-12-02 | 2021-06-10 | Vuereal Inc. | Création de stadification dans un fond de panier pour l'intégration de micro-dispositifs |
| CN112967976A (zh) * | 2020-06-19 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | 一种巨量转移装置及转移方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |
Effective date: 20210831 |
|
| FZDE | Discontinued |
Effective date: 20210831 |