CA2914616A1 - Ion complex material having function of inhibiting adhesion of biological substance and method for manufacturing the same - Google Patents
Ion complex material having function of inhibiting adhesion of biological substance and method for manufacturing the same Download PDFInfo
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Abstract
Description
ION COMPLEX MATERIAL HAVING FUNCTION OF INHIBITING ADHESION
OF BIOLOGICAL SUBSTANCE AND METHOD FOR MANUFACTURING THE
SAME
TECHNICAL FIELD
[0001] The present invention relates to an ion complex material having a function of inhibiting adhesion of a biological substance and a method for manufacturing the same.
The present invention specifically relates to a coating film having a function of inhibiting adhesion of a biological substance, a method for manufacturing the coating film, a copolymer obtainable by polymerizing a specific monomer mixture, a composition for forming a coating film having a specific composition, a method for producing a varnish containing a copolymer to be used as a raw material of the composition for forming a coating film which is used for forming said film, and a sol for forming the coating film.
BACKGROUND ART
In addition, it has been proposed a coating material using such a function, and various reports have been made on the fixation or immobilization method to glass or a polymer substrate, etc.
For example, in Non-Patent Document 2, it has been reported that surface modification was accomplished by chemical adhesion with a glass substrate using a polymer obtained by copolymerizing 2-methacryloyloxyethyl phosphorylcholine (MPC) having a similar molecular structure to a phospholipid as a charge neutralization unit and 3-(trimethoxysilyl)propyl methacrylate having a silane coupling group. On the other hand, it has also been reported that onto a polymer substrate, a polymer into which butyl mefhacrylate has been copolymerized is to be fixed onto the substrate by aiming physical adhesion due to hydrophobic interaction. However, according to these methods, it is necessary to select a kind of the polymer depending on a kind of the substrate.
to around 1% in many examples, and there is disclosed that if an amount is larger, the product is gelled.
coating liquid has been disclosed.
PRIOR ART DOCUMENTS
Patent Documents
Patent Document 2: JP 2007-63459A
Patent Document 3: JP Hei.6-92979A
Patent Document 4: JP 2010-233999A
Non-Patent Documents
39, No. 1, pp. 77 (2010) Non-Patent Document 2: Japanese Journal of Polymer Science and Technology, Vol. 65, No. 3, pp. 228 (2008) SUMMARY OF 'THE INVENTION
Problems to be Solved by the Invention
Means for Solving the Problems
¨P¨OUal (a) OUa2 tip1 Ubl ¨N or ¨N-1.---Ub3 An- (b) \Ub2 ub2
represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion) and a solvent onto a substrate; and a process of drying at a temperature of -200 C to 200 C, as the second aspect, the coating film described in the first aspect, wherein the solvent contains water or an alcohol, as the third aspect, the coating film described in the first aspect or the second aspect, wherein a concentration of the copolymer in the composition for forming a coating film is 0.01% by mass to 4% by mass, as the fourth aspect, the coating film described in any one of the first aspect to the third aspect, wherein the substrate is selected from the group consisting of glass, a metal containing compound, a semi-metal containing compound and a resin, as the fifth aspect, the coating film described in any one of the first aspect to the fourth aspect, wherein the film has a function of inhibiting adhesion of a biological substance, = = - 5 -_ as the sixth aspect, the coating film described in any one of the first aspect to the fifth aspect, wherein the copolymer contains recurring units of the following formula (al) and the formula (bl):
¨EcH2c+- (al) , , QatRa-0-r-P¨OUal n7 I
OUa2 -rb -rb +CH2c __________________________________ ubi or ¨E-CH2 UM
C _____________________________________________________ (b1) z +/
Q1b¨Rb¨N¨Ub3 An \ ub2 \Ub2
¨P¨OUal (a) OUa2 ybl /Ubl ¨N or ¨N----Ub3 An (b) U b2 b2
, Qa fRa-0)--PII¨OUal (A) OUa2 ,ubl Ubl +/
ob_Rb___147 or An (B) \ub2 \ ub2
_
ooR Ox0 (0) -rc 0 0 0 I 0 Ox0 (0) Oud -r
¨P¨Oual (a) OUa2 ybl Ubl ¨N or ¨N+¨Ub3 An- (b) \Ub2 Ub2
as the thirteenth aspect, the composition described in the twelfth aspect, wherein the copolymer contains recurring units of the following formula (al) and the formula (bl):
Ta ¨ÃCH2C ____________ 0 (al) , QatRa-01¨P¨OUal m I
OUa2 ________ Tb Tb CH2C _______________ zubi _____________ or +CH2c zubl (bl ) CP¨R"¨N \ ub2 Qb_Rb___N___ub3 An \Ub2
"=====k\,....,/7.8 Qa-{Ra-014¨OUa1 (A) m I
OUa2 /Ubl /ubl +
Qb_w_N\ or An (B) ub2 \ub2
CHRa-0-1--P¨OUa1 (A) m OUa2 ubi ubl Qb_Rk k +/
or An (B) \ub2 \ ub2
a, Tb, ual, ua2, ubl, ub2 and ÷b3 u each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, Qa and Qb each independently represent a single bond, an ester bond or an amide bond, le and =
= - 10 -Rb each independently represent a linear or branched allcylene group having 1 to 10 carbon atoms which may be substituted by a halogen atom(s), An represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion, and m is an integer of 0 to 6), a solvent and a polymerization initiator, by adding the mixture dropwise into a solvent maintained at a temperature higher than 10-hr half-life temperature of the polymerization initiator.
_p_oual (a) OUa2 ybl Ubl ¨N or ¨N4----Ub3 An (b) \ U42 Ub2
Effect of the Invention
Further, when the copolymer contained in the composition for forming a coating film of the present invention is to be synthesized, a phosphoric acid ester group which is a side chain of the copolymer has been known, for example, as disclosed in Patent Document 3, to have strong association property so that it sometimes gelled depending on the polymerization conditions, but in the present invention, a method for manufacturing a transparent varnish containing a copolymer can be provided by controlling the total concentration of the compound for synthesizing the copolymer in the reaction solvent to 4% by mass or less, or controlling an order of addition of a reactant and a reagent, or an addition temperature without gelation. According to this method, even if a polymer containing, for example, around 50mol% of a recurring unit having a phosphoric acid ester group in the copolymer according to the present invention is used, a transparent varnish containing a copolymer can be manufactured without gelation. The varnish containing a copolymer can be used as a composition for forming a coating film for forming the coating film of the present invention, or a raw material for preparing the same.
EMBODIMENTS TO CARRY OUT THE INVENTION
¨P¨OUal (a) OUa2 ubl ybl ¨N or ¨l4t--Ub3 An- (b) \Ub2 I b2
In the present invention, "an inorganic acid ion" means a carbonate ion, a sulfate ion, a phosphate ion, a hydrogen phosphate ion, a dihydrogen phosphate ion, a nitrate ion, a perchlorate ion or a borate ion.
As the above-mentioned An, preferred are a halide ion, a sulfate ion, a phosphate ion, a hydroxide ion and an isothiocyanate ion, and particularly preferred is a halide ion.
-butanol, 2-methyl-2-butanol (t-amyl alcohol), 3-methyl-1-butanol, 3-methyl-3-pentanol, cyclopentanol, 1-hexanol, 2-hexanol, 3-hexanol, 2,3-dimethy1-2-butanol, 3,3-dimethy1-1-butanol, 3,3-dimethy1-2-butanol, 2-ethyl-1-butanol, 2-methyl-1-pentanol, 2-methyl-2-pentanol, 2-methyl-3-pentanol, 3-methyl-1-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol, 4-methyl-1-pentanol, 4-methyl-2-pentanol, 4-methyl-3-pentanol and cyclohexanol. The solvent may be used alone or a mixed solvent of these combinations, and in the viewpoint of dissolution of the copolymer, it is preferably selected from water, PBS and ethanol.
by mass, particularly preferably 0.01 to 2% by mass, more preferably 0.01 to 1% by mass. If the concentration of the copolymer is 0.01% by mass or less, the concentration of the copolymer of the obtainable composition for forming a coating film is too low so that a coating film having a sufficient film thickness cannot be formed, while if it is 4% by mass or more, storage stability of the composition for forming a coating film is poor, and there is a possibility of causing deposition of the dissolved material or gelation thereof.
Examples of the pH adjusting agent include an organic amine such as ammonia, diethanolamine, pyridine, N-methyl-D-glucamine, tris(hydroxymethypaminomethane;
an alkali metal hydroxide such as potassium hydroxide, sodium hydroxide; an alkali metal halide such as potassium chloride, sodium chloride; an inorganic acid such as sulfuric acid, phosphoric acid, hydrochloric acid, carbonic acid or an alkali metal salt thereof; a quaternary ammonium cation such as choline or a mixture thereof (for example, a buffer such as a phosphate buffered physiological saline). Among these, ammonia, diethanolamine, sodium hydroxide, choline, N-methyl-D-glucamine and tris(hydroxymethypaminomethane are preferred, and ammonia, diethanolamine, sodium hydroxide and choline are particularly preferred.
unit containing an organic group of the formula (a) and the above-mentioned recurring unit containing an organic group of the formula (b), (ii) a solvent, and (iii) a pH
adjusting agent. Specific examples of the copolymer, the solvent and the pH
adjusting agent are as mentioned above.
The sol of the present invention preferably further contains a pH adjusting agent. Specific examples of the pH adjusting agent are as mentioned above. The sol of the present invention is more preferably a sol for forming a coating film, and is one embodiment of the composition for forming a coating film.
The substrate for forming the coating film of the present invention may be mentioned glass, a metal containing compound or a semi-metal containing compound, activated charcoal or a resin. The metal containing compound or the semi-metal containing compound may be mentioned, for example, ceramics comprising a metal oxide as a basic component, which are a sintered body baked by a heat treatment at a high temperature, a semiconductor such as silicon, an inorganic solid material including molded product of an inorganic compound such as a metal oxide or a semimetal oxide (silicon oxide, alumina, etc.), a metal carbide or a semi-metal carbide, a metal nitride or a semi-metal nitride (silicon nitride, etc.), a metal boride or a semi-metal boride, aluminum, nickel-titanium, stainless (SUS304, SUS316, SUS316L, etc.).
The coating film of the present invention can be formed by a low temperature drying, so that it can be applied to a resin having low heat resistance, etc.
to 95 C.
The aqueous solution containing an electrolyte is preferably PBS, a physiological saline (a solution containing sodium chloride alone), a Dulbecco's phosphate buffered physiological saline, a Tris buffered physiological saline, a HEPES buffered physiological saline and a Veronal buffered physiological saline, and PBS is particularly preferred. After fixation, even when the coating film is washed with water, PBS and an alcohol, etc., it does not elute and is still firmly fixed to the substrate.
Even when a biological substance is adhered to the formed coating film, it can be easily removed thereafter by washing, etc., and the surface of the substrate on which the coating film of the present invention has been formed has a function of inhibiting adhesion of a biological substance.
For example, when a coating film for a filter of an artificial dialyzer is to be manufactured, a liquid of the composition for forming a coating film according to the present invention is flown through the inside of the filter prepared by the above-mentioned raw material, for example, having a hollow fiber shape with a diameter of 0.1 to 500 gm, thereafter, subjecting to a drying process and a washing process (hot water (for example, 40 C to 95 C) washing, etc.) to manufacture the film.
If necessary, there is a case where a treatment with y ray, ethylene oxide, an autoclave, etc., is carried out for sterilization.
lymphocytes, neutrophils, red blood cells, platelets, macrophages, monocytes, bone cells, bone marrow cells, perithelial cells, dendritic cells, keratinocytes, fat cells, mesenchymal cells, epithelial cells, epidermal cells, endothelial cells, vascular endothelial cells, hepatic parenchymal cells, cartilage cells, cumulus cells, neural cells, glial cells, neurons, oligodendrocyte, microglia, astroglial cells, heart cells, esophagus cells, muscle cells (for example, smooth muscle cells or skeletal muscle cells), pancreatic beta cells, melanocytes, hematopoietic precursor cells, mononuclear cells, embryonic stem cells (ES cell), embryonic tumor cells, embryonic germline stem cells, induced pluripotent stem cells (iPS cell), neural stem cells, hematopoietic stem cells, mesenchymal stem cells, liver stem cells, pancreatic stem cells, muscle stem cells, germline stem cells, intestinal stem cells, cancer stem cells, hair follicle stem cells, and various kinds of cell lines (for example, HCT116, Huh7, HEK293 (human embryonic kidney cell), HeLa (human cervical cancer cell lines), HepG2 (human liver cancer cell lines), UT7/TPO (human leukemia cell lines), CHO (Chinese hamster ovary cell lines), MDCK, MDBK, BHK, C-33A, HT-29, AE-1, 3D9, Ns0/1, Jurkat, NI113T3, PC12, S2, Sf9, Sf21, High Five, Vero), etc., and the coating film of the present invention has a particularly high fimction of inhibiting adhesion to platelets. Also, the coating film of the present invention has a particularly high function of inhibiting adhesion against a serum in which a protein or a saccharide is mixed.
Also, the coating film of the present invention is useful as a coating film of a cell culture vessel such as a flask, a dish, a plate, etc., or various kinds of equipments for research in which adhesion of a protein is suppressed.
Further, the coating film of the present invention is also useful as a material for cosmetics, a material for a contact lens care article, a fiber finishing agent for skin care, a material for a diagnostic agent for biochemical research, a blocking agent for suppressing non-specific adhesion in an enzyme-linked immunosorbent assay (ELISA) method or a latex aggregation method which has widely been used in the clinical diagnosis, a stabilizer for stabilizing a protein such as an enzyme and an antibody, etc.
Moreover, the coating film of the present invention is also useful as a coating film for toiletry, a personally care product, a detergent, a pharmaceutical product, a quasi-drug, fiber and an antifouling material.
0 (al) , QatRa-01¨P¨OUal n' I
OUa2 -rb -rb --EcH2 zUbl c _____________________ or +CH2C _______________ (bl) +/Ubl Qb¨Rb¨N¨Ub3 An \ ub2 \ub2
Here, "the linear or branched alkylene group having 1 to 10 carbon atoms" is a divalent organic group corresponding to the above-mentioned alkyl group and may be mentioned, for example, a methylene group, an ethylene group, a propylene group, a trirnethylene group, a tetramethylene group, a 1-methylpropylene group, a 2-methylpropylene group, a dimethylethylene group, an ethylethylene group, a pentamethylene group, a =
=
1-methyl-tetramethylene group, a 2-methyl-tetramethylene group, a 1,1-dimethyl-trimethylene group, a 1,2-dimethyl-trimethylene group, a 2,2-dimethyl-trirnethylene group, a 1-ethyl-trimethylene group, a hexamethylene group, an octamethylene group and a decamethylene group, etc., and among these, an ethylene group, a propylene group, an octamethylene group and a decamethylene group are preferred, a linear or branched alkylene group having 1 to 5 carbon atoms including, for example, an ethylene group, a propylene group, a trimethylene group and a tetramethylene group are more preferred, and an ethylene group or a propylene group is particularly preferred. "The linear or branched alkylene group having 1 to 10 carbon atoms substituted by one or more halogen atoms" means a group in which one or more optional hydrogen atoms of the above-mentioned alkylene group is/are substituted by a halogen atom(s), and particularly preferred is a group in which a part or whole of the hydrogen atoms of an ethylene group or a propylene group is/are substituted by a halogen atom(s).
to 70 mol%, more preferably 40 mol% to 60 mol%. Further, the copolymer according to the present invention may contain two or more kinds of the recurring units of the formula (al).
II
QqRa-01¨P¨OUal (A) m I
OUa2 /Ubl /Ubl +
Qb_Rb N \ ub2 or An (B) \ ub2 , ual ua2, ubl, ub2 and , U,b3
_ O=P¨OH (A-1) 11 (A-2) 1 0 0¨CH2 ¨CH2-0¨P¨OH
OH
11 (A-3) n I
OH
n=4-5
(8-1) (8-2) (B-3) H (B-4)
copolymerized, and a part of the polymer may be partially three-dimensionally crosslinked. Such a third component may be mentioned, for example, a bifunctional monomer of the following formula (C) or (D):
0 oxo (c) 0 (D) OLP
X Td
=
phosphate, bis[(2-metharry1oy1oxy)propy1] phosphate, etc.
(CA ) (D-1) OH
A ratio of the third component in the above-mentioned copolymer, for example, cross-linked structure derived from the bifunctional monomer of the above-mentioned formula (C) or (D) is 0 mol% to 50 mol%.
to 70 mol%, more preferably 40 mol% to 60 mol%. In addition, the compound of the formula (A) may be two or more kinds.
A ratio of the compound of the formula (B) based on the whole monomers forming the above-mentioned copolymer may be the whole remainder subtracting the ratio of the above-mentioned formula (A) from the whole of the copolymer, or may be the remainder subtracting the total ratio of the above-mentioned formula (A) and the above-mentioned third component from the same. In addition, the compound of the formula (B) may be two or more kinds.
polymerization, the cation polymerization, etc., which are general synthetic method of an acrylic polymer or a methacrylic polymer, etc., and a copolymer can be synthesized.
As the reaction form thereof, various methods such as solution polymerization, suspension polymerization, emulsion polymerization, bulk polymerization, etc., may be employed.
The composition for forming a coating film according to the present invention may be prepared by diluting a desired the copolymer with a desired solvent and a desired concentration.
Further, the composition for forming a coating film according to the present invention may be prepared from the varnish containing the copolymer of the present invention. As one of the embodiments, the varnish containing the copolymer of the present invention can be prepared by the manufacturing method containing a process of reacting (polymerizing) the compounds of the above-mentioned formulae (A) and (B) in a solvent with a total concentration of the both compounds of 0.01% by mass to 4% by mass.
Further, it is preferred to contain water or ethanol in an amount of 10% by mass or more and 100%
by mass or less. Moreover, it is preferred to contain water or ethanol in an amount of 50% by mass or more and 100% by mass or less. Furthermore, it is preferred to contain water or ethanol in an amount of 80% by mass or more and 100% by mass or less. Still further, it is preferred to contain water or ethanol in an amount of 90% by mass or more and 100% by mass or less. A total amount of water and ethanol is preferably 100% by mass.
The concentration is more preferably 0.01% by mass to 3% by mass, for example, 3%
by mass or 2% by mass.
(1)
86 C), benzoyl peroxide (BPO), 2,2'-azobis(N-(2-carboxyethyl)-2-methylpropionamidine) n-hydrate (Wako Pure Chemical Industries, Ltd., product name; VA-057, 10-hr half-life temperature; 57 C), 4,4'-azobis(4-cyanopentanoic acid) (Wako Pure Chemical Industries, Ltd., product name; VA-501), 2,2'-azobis[2-(2-imidazolidin-2-yl)propane]
dihydrochloride (Wako Pure Chemical Industries, Ltd., product name; VA-044, 10-hr half-life temperature; 44 C), 2,2'-azobis[2-(2-imidazolidin-2-yl)propane]disulfate dihydrate (Wako Pure Chemical Industries, Ltd., product name; VA-046B, 10-hr half-life temperature; 46 C), 2,2'-azobis[2-(2-imida7o1idin-2-y1)propane]
(Wako Pure Chemical Industries, Ltd., product name; VA-061, 10-hr half-life temperature;
61 C), 2,2'-azobis(2-amidinopropane) dihydrochloride (Wako Pure Chemical Industries, Ltd., = 27 product name; V-50, 10-hr half-life temperature; 56 C), peroxodisulfate or t-butyl hydroperoxide, etc., and among these, taking ion balance and solubility in water into consideration, it is desired to use any of 2,2' -azobis[2-methyl-N-(2-hydroxyethyl)propionamide], 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionarnidine] n-hydrate, 4,4'-azobis(4-cyanopentanoic acid), 2,2'-azobis[2-(2-imidazolidin-2-yl)propane]
dihydrochloride, 2,2'-azobis[2-(2-imidazolidin-2-yl)propane]disulfate dihydrate, 2,2' -azobis[2-(2-imidazolidin-2-yl)propane], 2,2'-azobis(2-amidinopropane) dihydrochloride and peroxodisulfate.
It is more preferably 10,000 to 2,000,000. Also, it may be either of a random copolymer, a block copolymer or a graft copolymer, there is no specific limitation in the copolymerization reaction itself for manufacturing the copolymer, and a conventionally known method synthesized in a solution such as radical polymerization, ion polymerization, or polymerization utilizing photopolymerization, macromer or emulsion polymerization can be used. Depending on the purposes thereof to be used, any one of the copolymers of the present invention may be solely used, or plural kinds of the copolymers may be used by mixing with appropriately changing the ratios thereof.
EXAMPLES
= Device: Prominence (manufactured by Shimadzu Corporation) GFC column: TSKgel GMPWXL (7.8 mm I.D. x 30 cm) x 2 = Flow rate: 1.0 ml/min = Eluent: ionic aqueous solution = Column temperature: 40 C
= Detector: RI
Injection concentration: Polymer solid content 0.1% by mass = Injection amount: 100 uL
= Calibration curve: Cubic approximate curve = Standard sample: Polyethylene oxide (available from Agilent Technologies Japan, Ltd.)x 10 kinds
Measurement of a concentration (% by mass) of each phosphorous-containing compound which is a raw material containing a phosphorous-containing compound was carried out by 31P-NMR. An absolute concentration (absolute % by mass) of each phosphorous-containing compound contained in the raw materials was calculated by using the following standard substance.
6.00 g of acid phosphoxy ethyl methacrylate (the compound of the formula (A-2), Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)), 4.12 g of 2-(dimethylamino)ethyl methacrylate (the compound of the formula (B-2), available from Tokyo Chemical Industry Co., Ltd.) and 0.24 g of 2,2'-azo(2-methyl-N-(2-hydroxyethyl)propionamide) (Product name; VA-086, available from Wako Pure Chemical Industries, Ltd.) were dissolved in 446.34 g of pure water and 49.59 g of ethanol, and charged in a recovery flask, and subjected to nitrogen purge by blowing nitrogen thereinto, and then subjected to polymerization reaction in an oil bath at 100 C for 24 hours to obtain 506.05 g of a varnish containing a copolymer with a solid content of 2% by mass.
6.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyl-oxy)ethyl] phosphate (28.6% by mass) and other substances (27.2% by mass)), 4.12 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.24 g of 2,2'-azo(2-methyl-N-(2-hydroxyethyl)propionamide) (Product name; VA-086, available from Wako Pure Chemical Industries, Ltd.) were dissolved in 490.87 g of pure water, and charged in a recovery flask, and subjected to nitrogen purge by blowing nitrogen thereinto, and then subjected to polymerization reaction in an oil bath at 100 C for 24 hours to obtain 506.05 g of a varnish containing a copolymer with a solid content of 3%
by mass.
6.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl] phosphate (28.6% by mass) and other substances (27.2% by mass)), 4.12 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.24 g of 2,2'-azo(2-methyl-N-(2-hydroxyethyl)propionamide) (Product name; VA-086, available from Wako Pure Chemical Industries, Ltd.) were dissolved in 490.87 g of PBS
(phosphate buffered physiological saline, available from Sigma-Aldrich Co.
LLC.), and charged in a recovery flask, and subjected to nitrogen purge by blowing nitrogen thereinto, and then subjected to polymerization reaction in an oil bath at 100 C for 24 hours to obtain 506.05 g of a varnish containing a copolymer with a solid content of 3%
by mass.
0.3 g of pure water was added to 1.50 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)), into the mixture while stirring at 60 C was added dropvvise 1.03 g of 2-(thmethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) over 3 hours, and the resulting mixture was then stirred at 70 C for 12 hours to prepare a half salt hydrate.
The above-mentioned half salt hydrate was heated to 60 C by an evaporator to evaporate water, and a material a water content of which became 1% or less was made 2-(dimethylamino)ethyl methacrylate half salt (the compound of the formula (1)) of the acid phosphoxy ethyl methacrylate. To the half salt was added 0.03 g of 2,2'-azo(2-methyl-N-(2-hydroxyethyl)propionamide (Product name; VA-086, available from Wako Pure Chemical Industries, Ltd.), and dissolved in 73.63 g of pure water and 8.18 g of ethanol, the mixture was charged in a recovery flask, and subjected to nitrogen purge by blowing nitrogen thereinto, and then subjected to polymerization reaction in an oil bath at 100 C for 24 hours to obtain 84.34 g of a varnish containing a copolymer with a solid content of 3% by mass.
12.40 g of pure water was added to 6.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 12.40 g of ethanol, 4.12 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.10 g of 2,2'-azo(2-methyl-N-(2-hydroxyethyl)propionamide) (Product name; VA-086, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 471.13 g of pure water and 37.20 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 506.05 g of a transparent polymer solution with a solid content of about 2% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 810,000.
68.88 g of pure water was added to 10.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 29.52 g of ethanol, 7.63 g of 2-(dirnethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.09 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 373.89 g of pure water and 29.52 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 509.60 g of a transparent polymer solution with a solid content of about 3.5% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 280,000.
56.56 g of pure water was added to 12.00 g of acid phosphoxy ethyl _ methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 24.24 g of ethanol, 9.16 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.11 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 307.05 g of pure water and 116A6 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 425.28 g of a transparent polymer solution with a solid content of about 5% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 610,000.
54.41 g of pure water was added to 14.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 23.32 g of ethanol, 10.68 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.12 g of 2,2'-azobis[N-(2-carboxyethy1)-2-methy1propionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 295.38 g of pure water and 15.55 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, =
and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 413.47 g of a transparent polymer solution with a solid content of about 6% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 1,010,000.
7.63 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) was added to 10.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)), and the mixture was stirred at room temperature until it became 30 C or lower for about 1 hour. Then, 59.24 g of pure water, 25.39 g of ethanol and 0.09 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 321.61 g of pure water and 16.93 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 440.80 g of a transparent polymer solution with a solid content of about 4% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 500,000.
51.32 g of pure water was added to 2.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacry1oy1oxy)ethy1]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 21.99 g of ethanol, 1.53 g of 2-(climethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.18 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 278.59 g of pure water and 14.66 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 370.10 g of a transparent polymer solution with a solid content of about 1% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 38,000.
50.93 g of pure water was added to 6.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 21.83 g of ethanol, 9.16 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.08 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 276.49 g of pure water and 14.55 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 378.96 g of a transparent polymer solution with a solid content of about 4% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 720,000.
64.03 g of pure water was added to 10.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 27.44 g of ethanol, 8.96 g of 2-(diethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.09 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 347.60 g of pure water and 18.29 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropvvise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 476.33 g of a transparent polymer solution with a solid content of about 4% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 290,000.
56.58 g of pure water was added to 7.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 47.15 g of ethanol, 12.55 g of 2-(diethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.10 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 367.75 g of pure water was separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 491.02 g of a slightly turbid polymer solution with a solid content of about 4% by mass.
A weight average molecular weight of the obtained liquid by GFC after filtration was about 300,000.
60.64 g of pure water was added to 9.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 17.33 g of ethanol, 11.31 g of 80% methacryloylcholine chloride aqueous solution (available from Tokyo Chemical Industry Co., Ltd.) and 0.10 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 326.94 g of pure water and 17.33 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 453.48 g of a transparent polymer solution with a solid content of about 4% by mass.
A weight average molecular weight of the obtained transparent liquid by GFC
was about 130,000.
56.95 g of pure water was added to 10.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichenaical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 24.41 g of ethanol, 6.95 g of 2-(dimethylamino)ethyl acrylate (the compound of the formula (B-1), available from Tokyo Chemical Industry Co., Ltd.) and 0.0848 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name;
VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 56.95 g of pure water and 16.27 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring.
While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 423.77 g of a transparent polymer solution with a solid content of about 4% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 150,000.
59.89 g of pure water was added to 10.00 g of acid phosphoxy ethyl methacrylate (Product name; LIGHT ESTER P-1M, available from Kyoeisha Chemical Co., Ltd., a mixture of acid phosphoxy ethyl methacrylate (42.2% by mass), bis[2-(methacryloyloxy)ethyl] phosphate (16.9% by mass) and other substances (40.9%
by mass)) and sufficiently dissolved, then, 25.67 g of ethanol, 7.83 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.09 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine]
(Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of LIGHT ESTER P-1M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 325.13 g of pure water and 17.11 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 445.63 g of a transparent polymer solution with a solid content of about 4% by mass. A
weight average molecular weight of the obtained transparent liquid by GFC was about 410,000.
47.84 g of pure water was added to 10.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 15.95 g of ethanol, 7.63 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.09 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 95.69 g of pure water was separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 1 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 177.11 g of a transparent polymer solution with a solid content of about 10%
by mass.
A weight average molecular weight of the obtained transparent liquid by GFC
was about 582,000.
=
25.39 g of pure water was added to 5.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 10.88 g of ethanol, 4.50 g of 2-((t-butylarnino)ethyl methacrylate (available from Sigma-Aldrich Co. LLC.) and 0.05 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionarnidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 137.82 g of pure water and 7.25 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 190.84 g of a transparent polymer solution with a solid content of about 5% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 225,000.
19.54 g of pure water was added to 5.00 g of acid phosphoxypolyoxyethylene glycol monomethacrylate (Product name; Phosmer PE, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour:
94.9%) and sufficiently dissolved, then, 8.37 g of ethanol, 2.31 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.04 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer PE while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping ftumel. On =the other hand, 106.05 g of pure water and 5.58 g of ethanol were separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the =
dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 146.84 g of a transparent polymer solution with a solid content of about 5% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 146,000.
To 43.73 g of pure water was added 0.12 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) while maintaining at 20 C
or lower, and the VA-057 aqueous solution which has been uniform by sufficiently stirring was introduced into a dropping funnel. On the other hand, 174.92 g of pure water was separately added to 10.00 g of vinyl phosphonic acid (the compound of the formula (A-1), available from Tokyo Chemical Industry Co., Ltd.) and sufficiently dissolved, then, 14.17 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) was further added and dissolved therein by sufficiently stirring.
The mixed solution was charged into a three-necked flask equipped with a condenser, subjected to nitrogen flow, and raised the temperature to 60 C under stirring.
While maintaining the state, the dropping funnel into which the above-mentioned VA-aqueous solution had been introduced was set, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 0.5 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance for 24 hours to obtain 242.83 g of a transparent polymer solution with a solid content of about 10% by mass. A weight average molecular weight of the obtained transparent liquid by GFC was about 535,000.
In 58.20 g of pure water and 6.47 g of ethanol were dissolved 2.00 g of 2-methacryloyloxyethyl phosphorylcholine (available from Tokyo Chemical Industry Co., Ltd.) and 0.02 g of 2,2'-azo(2-methyl-N-(2-hydroxyethyl)propionamide) (Product name; VA-086, available from Wako Pure Chemical Industries, Ltd.) were dissolved in 58.20 g of pure water and 6.47 g of ethanol, and charged in a recovery flask, and subjected to nitrogen purge by blowing nitrogen thereinto, and then subjected to polymerization reaction in an oil bath at 100 C for 24 hours to obtain 506.05 g of a varnish containing a copolymer with a solid content of 3% by mass.
=
6.00 g of acid phosphoxy ethyl methacrylate (the compound of the formula (A-2), Product name; Phosmer M, available from Unichenaical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)), 4.12 g of 2-(dimethylamino)ethyl methacrylate (the compound of the formula (B-2), available from Tokyo Chemical Industry Co., Ltd.) and 0.24 g of 2,2'-azo(2-methyl-N-(2-hydroxyethyl)propionamide (Product name; VA-086, available from Wako Pure Chemical Industries, Ltd.) were dissolved in 173.07 g of pure water and 19.23 g of ethanol, and charged in a recovery flask, and subjected to nitrogen purge by blowing nitrogen thereinto, and then subjected to polymerization reaction in an oil bath at 100 C for 24 hours to expect to obtain a varnish containing a copolymer with a solid content of 5% by mass, but the obtained material was a turbid gel-state solution a solid of which was attached to the edge of the flask.
0.3 g of pure water was added to 1.50 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)), into the mixture while stirring at 60 C, 1.03 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) was added dropwise over 3 hours, and the resulting mixture was thereafter stirred at 70 C for 12 hours to prepare a half salt hydrate. The above-mentioned half salt hydrate was heated up to 60 C by an evaporator to evaporate water, and a material a water content of which became 1% or less was made 2-(dimethylamino)ethyl methacrylate half salt (the compound of the formula (1)) of the acid phosphoxy ethyl methacrylate. To 2.53 g of the half salt was added 0.03 g of 2,2'-azo(2-methyl-N-(2-hydroxyethyl)propionamide) (Product name; VA-086, available from Wako Pure Chemical Industries, Ltd.), and dissolved in 43.27 g of pure water and 4.81 g of ethanol, the mixture was charged in a recovery flask, and subjected to nitrogen purge by blowing nitrogen thereinto, and then subjected to polymerization reaction in an oil bath at 100 C for 24 hours to expect to obtain a varnish containing a copolymer with a solid content of 5% by mass, but the obtained material was a turbid gel-state solution a solid of which was attached to the edge of the flask.
38.98 g of pure water was added to 10.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 12.99 g of ethanol, 7.63 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.09 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were further successively added to the aqueous solution of Phosmer M while maintaining at 20 C or lower. The mixed solution into which the above-mentioned all materials have been entered which had been sufficiently stirred to become uniform was introduced into a dropping funnel. On the other hand, 77.97 g of pure water was separately charged into a three-necked flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring. While maintaining the state, the dropping funnel into which the above-mentioned mixed solution had been introduced was set to the three-necked flask, and the mixed solution was added dropwise into a boiled solution of pure water and ethanol over 1 hour. After dropping, the mixture was stirred under heating while maintaining the above-mentioned circumstance, then, it became a gelled solid within 10 minutes.
151.51 g of pure water was added to 5.00 g of acid phosphoxy ethyl methacrylate (Product name; Phosmer M, available from Unichemical Co., Ltd., a non-volatile component by the dryness method at 100 C for 1 hour: 91.8%, a mixture of acid phosphoxy ethyl methacrylate (44.2% by mass), bis[2-(methacryloyloxy)ethyl]
phosphate (28.6% by mass) and other substances (27.2% by mass)) and sufficiently dissolved, then, 16.83 g of ethanol, 3.82 g of 2-(dimethylamino)ethyl methacrylate (available from Tokyo Chemical Industry Co., Ltd.) and 0.04 g of 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] (Product name; VA-057, available from Wako Pure Chemical Industries, Ltd.) were added thereto while maintaining at 20 C or lower and stirred to mix uniformly. The mixed solution was charged into a flask equipped with a condenser, this was subjected to nitrogen flow, and raised to a reflux temperature while stirring over 0.5 hour, then, it became a gelled solid within 10 minutes after reflux.
The above-mentioned composition (A) for forming a coating film was spin coated on a silicon wafer or the above-mentioned glass substrate (G), and dried in an oven at 45 C for 12 hours. Thereafter, the uncured composition for forming a film attached onto the coating film was washed in pure water with ultrasonic wave for 5 minutes, and further thoroughly washed with PBS and pure water to obtain a silicon wafer or a glass substrate onto which the coating film has been formed. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 25A.
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 2 was added 2.00 g of pure water and the mixture was thoroughly stirred to prepare a composition for forming a coating film. By using the obtained composition for forming a coating film, a silicon wafer or a glass substrate onto which a coating film has been formed was obtained in the same manner as in Example 1. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 21A.
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 3 was added 2.00 g of PBS and the mixture was thoroughly stirred to prepare a composition for forming a coating film. By using the obtained composition for forming a coating fihn, a silicon wafer or a glass substrate onto which a coating film has been formed was obtained in the same manner as in Example 1. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was ' 12.A.
A silicon wafer or the above-mentioned glass substrate (G) was dipped in the above-mentioned composition (A) for forming a coating film for 24 hours and after removing the excess composition with an Air brush, then, baked in an oven at 45 C for 12 hours as a drying process. Thereafter, as a washing process, the excessively attached uncured composition for forming a coating film was washed in pure water by ultrasonic wave for 5 minutes, and thoroughly washed with PBS and pure water to obtain a silicon wafer or a glass substrate onto which a coating film has been formed.
By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 2IA.
A silicon wafer or the above-mentioned glass substrate (G) was dipped in the above-mentioned composition (A) for forming a coating film for 24 hours and after removing the excessive composition with an Air brush, as a drying process, it was allowed to stand under an environment of at room temperature of 25 C and a humidity of 40% for 24 hours. Thereafter, as a washing process, the excessively attached uncured composition for forming a coating film was washed in pure water by ultrasonic wave for 5 minutes, and thoroughly washed with PBS and pure water to obtain a silicon wafer or a glass substrate onto which a coating film has been formed. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 22A.
A silicon wafer or a glass substrate which a coating film has been formed was obtained in the same manner as in Example 1 except for changing the drying temperature to 150 C and the drying time to 0.5 hour by a hot plate. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 62A.
A coating film formed onto a silicon wafer or a polystyrene (PS) substrate was obtained in the same manner as in Example 1 except for changing the above-mentioned glass substrate (G) of Example 1 to the following PS substrate. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 25A.
for 5 minutes to prepare a PES substrate.
A coating film formed onto a silicon wafer or a polyether sulfone (PES) substrate was obtained in the same manner as in Example 1 except for changing the above-mentioned glass substrate (G) of Example 1 to the following PES
substrate. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 25A.
film.
(http://www.cutpla.com/) were used.
The quartz resonator (Q-Sense, QSX304) onto which Si02 has been deposited was washed by using a UV/ozone cleaning apparatus (UV253E, manufactured by Filgen Inc.) for 10 minutes. The above-mentioned composition (A) for forming a coating film was spin coated thereon, and as a drying process, baked in an oven at 45 C
for 12 hours. Thereafter, as a washing process, the excessively attached uncured composition for forming a coating film was washed in pure water by ultrasonic wave for 5 minutes, and further thorou. hly washed with PBS and pure water to obtain a surface treated QCM sensor (Si02).
The above-mentioned composition (A) for forming a coating film was spin =
coated onto each of three sheets of silicon wafers, and dried on a hot plate at 50 C for minutes, 12 hours and 24 hour, respectively. Thereafter, the uncured composition for forming a film attached onto the coating film was washed in pure water by ultrasonic wave for 5 minutes, and further thoroughly washed with PBS and pure water 5 to obtain a silicon wafer onto which the coating film has been formed. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 22A
with a drying time of 10 minutes, 21A with a drying time of 12 hours, and 36A with a drying time of 24 hours.
10 [0158] <Example 11>
The above-mentioned composition (A) for forming a coating film was spin coated onto each of two sheets of silicon wafers, and dried on a hot plate at 100 C for 10 minutes and 12 hours, respectively. Thereafter, the uncured composition for forming a film attached onto the coating film was washed in pure water by ultrasonic wave for 5 minutes, and further thoroughly washed with PBS and pure water to obtain a silicon wafer onto which the coating film has been formed. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 30A.
with the drying time of 10 minutes and 89A with the drying time of 12 hours.
[0159] <Example 12>
The above-mentioned composition (A) for forming a coating film was spin coated onto a silicon wafer, and dried on a hot plate at 200 C for 10 minutes.
Thereafter, the uncured composition for forming a film attached onto the coating film was washed in pure water by ultrasonic wave for 5 minutes, and further thoroughly washed with PBS and pure water to obtain a silicon wafer onto which the coating film has been formed. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 145A.
[0160] <Example 13>
The above-mentioned composition (A) for forming a coating film was spin coated onto each of two sheets of the above-mentioned PES substrates, and dried on a hot plate at 50 C for 12 hours and 24 hours, respectively. Thereafter, the uncured composition for forming a film attached onto the coating film was washed in pure water by ultrasonic wave for 5 minutes, and further thoroughly washed with PBS and pure water to obtain a PES substrate onto which the coating film has been formed.
By using the above-mentioned PES substrate, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 29A
with the drying time of 12 hours and 29A with the drying time of 24 hours.
[0161] (Preparation of QCM sensor (PES)) The quartz resonator (Q-Sense, QSX304) onto which Au has been deposited was washed by using a UV/ozone cleaning apparatus(1JV253E, manufactured by Filgen Inc.) for 10 minutes, and immediately after dipped in 100 ml of an ethanol solution into which 0.1012 g of 1-decanethiol (available from Tokyo Chemical Industry Co., Ltd.) for 24 hours. After washing the surface of the sensor with ethanol, it was naturally dried, and a varnish in which 1.00 g of poly(oxy-1,4-phenylenesulfony1-1,4-phenylene) (available from Aldrich Co.) has been dissolved in 99.00 g of 1,1,2,2-tetrachloroethane was spin coated on a film sensor side by a spin coater with 3,500 rpm/30 sec and dried at 205 C/1 min to prepare a QCM sensor (PES).
[0162] <Example 14>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 5 were added 5.10 g of pure water and 0.57 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. The above-mentioned PES film, silicon wafer or the above-mentioned glass substrate (G) was dipped in the obtained composition for forming a coating film, and dried in an oven at 45 C for 12 hours. Thereafter, the uncured composition for forming a film attached onto the coating film was thoroughly washed with PBS
and pure water to obtain a silicon wafer, a PES film or a glass substrate onto which the coating film has been formed. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 65A. Also, the above-mentioned composition for forming a coating film was spin coated onto a QCM sensor (PES) with 3,500 rpm/30sec, and as a drying process, based in an oven at 45 C for 12 hours. Thereafter, as a washing process, the excessively attached uncured composition for forming a coating film was washed with PBS and ultrapure water each twice to make a surface treated QCM sensor (PES).
[0163] <Example 15>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 6 were added 7.27 g of pure water and 3.39 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate, a PES film, a polyethylene (PE) resin substrate, a polypropylene (PP) resin substrate, a polyethylene terephthalate (PET) resin substrate, a polytetrafluoroethylene (PTFE) resin substrate or a surface treated QCM sensor (PES) onto each of which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 44A.
[0164] <Example 16>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 7 were added 10.78 g of pure water and 4.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 59A.
[0165] <Example 17>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 8 were added 13.11 g of pure water and 5.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 62A.
[0166] <Example 18>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 9 were added 8.44 g of pure water and 3.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 55A.
[0167] '(Example 19>
To 1.00 g of the vamish containing a copolymer obtained in the above-mentioned Synthetic example 10 were added 14.35 g of pure water and 0.90 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 13A.
[0168] <Example 20>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 11 were added 11.10 g of pure water and 1.23 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate, a PES film or a surface treated QCM sensor (PES) onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 68A.
[0169] <Example 21>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 12 were added 8.44 g of pure water and 3.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating fihn has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 49A.
[0170] (Example 22>
=
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 13 were added 8.44 g of pure water and 3.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a PES film or a glass substrate onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 49A.
[0171] <Example 23>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 14 were added 8.44 g of pure water and 3.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES filni onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 50A.
[0172] <Example 24>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 15 were added 8.44 g of pure water and 3.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substiate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 22A.
[0173] <Example 25>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 16 were added 8.44 g of pure water and 3.89 g of ethanol, and the mixture was thorouglhly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 22A.
[0174] <Example 26>
= To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 6 were added 4.85 g of pure water, 5.72 g of ethanol and 0.095 g of 1 mol/L aqueous ammonia, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 39A.
[0175] <Example 27>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 6 were added 4.95 g of pure water, 5.72 g of ethanol and 0.02 g of diethanolamine (available from Tokyo Chemical Industry Co., Ltd.), and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate, a PES film or a surface treated QCM sensor (PES) onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 45A.
[0176] <Example 28>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 6 were added 0.06 g of pure water, 10.60 g of ethanol and 0.02 g of diethanolamine (available from Tokyo Chemical Industry Co., =
=
Ltd.), and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate, a PES film or a surface treated QCM sensor (PES) onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference fihn thickness meter, then, it was 68A.
[0177] <Example 29>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 6 were added 0.02 g of pure water, 10.60 g of ethanol and 0.07 g of choline (48-50% aqueous solution) (available from Tokyo Chemical Industry Co., Ltd.), and the mixture was thoroughly stirred to prepare a composition for forming a coating film In the same manner as in Example 14, a silicon wafer, a glass substrate, a PES film or a surface treated QCM sensor (PES) onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 122A.
[0178] <Example 30>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 6 were added 4.99 g of pure water, 5.74 g of ethanol and 0.05 g of sodium hydroxide, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 38A.
[0179] <Example 31>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 6 were added 4.01 g of pure water, 5.72 g of ethanol and 0.95 g of 1 mon, aqueous ammonia, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate, a PES film or a surface treated QCM
sensor (PES) onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 40A.
[0180] <Example 32>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 6 were added 7.27 g of PBS and 3.39 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES
film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 55A.
[0181] <Example 33>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 17 were added 22.45 g of pure water and 9.88 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 79A.
[0182] <Example 34>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 18 were added 10.78 g of pure water and 4.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating fihn was confirmed by an optical interference film thickness meter, then, it was 28A.
[0183] <Example 35>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 19 were added 10.78 g of pure water and 4.89 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 82A.
[0184] <Example 36>
To 1.00 g of the varnish containing a copolymer obtained in the above-mentioned Synthetic example 20 were added 22.45 g of pure water and 9.88 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film. In the same manner as in Example 14, a silicon wafer, a glass substrate or a PES film onto which a coating film has been formed was obtained. By using the =
above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 11A.
[0185] <Comparative example 1>
To 1.00 g of the polymerized solution obtained in the above-mentioned Comparative synthetic example 1 were added 1.80 g of pure water and 0.20 g of ethanol and the mixture was thoroughly stirred to obtain a composition for forming a coating film. A glass substrate or a silicon wafer was obtained by treating the obtained composition for forming a coating film in the same manner as in Example 1.
When a film thickness of the above-mentioned silicon wafer was confirmed by an optical interference film thickness meter, then, no coating film was found to be formed (film thickness: OA).
[0186] <Comparative example 2>
A silicon wafer or a glass substrate was obtained by using the above-mentioned composition (A) for forming a coating film and treating it in the same manner as in Example 4 except for carrying out the drying process. When a film thickness of the above-mentioned silicon wafer was confirmed by an optical interference film thickness meter, then, no coating film was found to be formed (film thickness: OA).
[0187] <Comparative example 3>
In the same manner as in Example 1 except for the drying temperature of 205 C and the drying time of 12 hours, a coating film formed onto a silicon wafer or a glass substrate was obtained. When a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, it was 78A.
[0188] <Comparative example 4>
In the same manner as in Example 1 except for not using the composition for forming a coating film, a glass substrate was obtained.
[0189] <Comparative example 5>
In the same manner as in Example 7 except for not using the composition for forming a coating film, a PS substrate was obtained.
[0190] <Comparative example 6>
In the same manner as in Example 8 except for not using the composition for forming a coating film, a PES substrate was obtained.
[0191] <Comparative example 7>
In the same manner as in Example 9 except for subjecting to the drying process, a surface treated QCM sensor was obtained.
[0192] <Comparative example 8>
In the same manner as in Example 9 except for not forming a film by the =
composition for forming a coating film, a surface treated QCM sensor was obtained.
[0193] '(Comparative example 9>
A PES film, a polyethylene (PE) resin substrate, a polypropylene (PP) resin substrate, a polyethylene terephthalate (PET) resin substrate, a polytetrafluoroethylene (PTFE) resin substrate, or the above-mentioned QCM sensor (PES) was dried in an oven at 45 C for 12 hours. Thereafter, they were further thoroughly washed with PBS
and pure water to obtain a PES film, a polyethylene (PE) resin substrate, a polypropyl-ene (PP) resin substrate, a polyethylene terephthalate (PET) resin substrate, a polytetrafluoroethylene (PTFE) resin substrate or a surface treated QCM sensor (PES).
[0194] (Comparative example 10>
To 1.00 g of the polymerized solution obtained in the above-mentioned Comparative synthetic example 1 were added 1.80 g of pure water and 0.20 g of ethanol and the mixture was thoroughly stirred to obtain a composition for forming a coating film. The above-mentioned PES film, a silicon wafer or the above-mentioned glass substrate (G) was dipped in the obtained composition for forming a coating film, and dried in an oven at 45 C for 12 hours. Thereafter, the uncured composition for forming a film attached onto the coating film was thoroughly washed with PBS
and pure water to obtain a silicon wafer, a glass substrate or a PES film onto which the coating film has been formed. By using the above-mentioned silicon wafer, when a film thickness was confirmed by an optical interference film thickness meter, then, no coating film was found to be formed (film thickness: OA).
Also, the above-mentioned composition for forming a coating film was spin coated onto a QCM sensor (PES) with 3,500 rpm/30 sec, and as a drying process, it was baked in an oven at 45 C for 12 hours. Thereafter, as a washing process, the excessively attached uncured composition for forming a coating film was washed with PBS and ultrapure water each twice to make a surface treated QCM sensor (PES).
[0195] <Comparative example 11>
To 1.00 g of polyvinylpyrrolidone (K90) (available from Tokyo Chemical Industry Co., Ltd.) were added 59.40 g of pure water and 39.60 g of ethanol, and the mixture was thoroughly stirred to prepare a composition for forming a coating film.
The above-mentioned PES film, a silicon wafer or the above-mentioned glass substrate (G) was dipped in the obtained composition for forming a coating film, and dried in an oven at 45 C for 12 hours. Thereafter, the uncured composition for forming a film attached onto the coating film was thoroughly washed with PBS and pure water to obtain a silicon wafer, a glass substrate or a PES film onto which the coating film has been formed. By using the above-mentioned silicon wafer, when a film thickness of the coating film was confirmed by an optical interference film thickness meter, then, no coating film was found to be formed (film thickness: 22A).
Also, the above-mentioned composition for forming a coating film was spin coated onto a QCM sensor (PES) with 3,500 rpm/30 sec, and as a drying process, it was baked in an oven at 45 C for 12 hours. Thereafter, as a washing process, the excessively attached uncured composition for forming a coating film was thoroughly washed with PBS and ultrapure water each twice to make a surface treated QCM
sensor (PES).
[0196] [Platelet adhesion test]
(Preparation of platelet solution) To 0.5 mL of a 3.8% by mass sodium citrate solution was mixed 4.5 mL of blood collected from a healthy volunteer, platelet-rich plasma (PRP) at an upper layer was recovered by centrifugal separation [Refrigerated Centrifuge 5900 (manufactured by Kubota Corporation), at 1,000 rpm/10 min and room temperature].
Subsequently, centrifugal separation (the above-mentioned Centrifuge, 3500 rpm/10 min, room temperature) of a lower layer was performed to recover platelet-poor plasma (PPP) at an upper layer. A number of the platelets of the PRP was counted by a multi-item automatic Hematology Analyzer (XT-2000i, manufactured by Sysmex Corporation), and a platelet concentration of the PRP was adjusted to be 30x104 cells/gL by using the PPP.
[0197] (Platelet adhesion test) Glass substrates, PS substrates, PES substrates, PP resin substrates, PET
resin substrates, PTFE resin substrates or PES films of Examples 1 to 8, Examples 14 to 23, Examples 25 to 35, Comparative examples 1 to 6, Comparative example 9 and Comparative example 10 were provided to 24-well flat bottom microplate (manufactured by Corning Inc.). Into the well of the plate to which these substrates were provided was added 300 p,L of the PRP solution which has been adjusted to the above-mentioned platelet concentration. At the state while maintaining at 5%
carbon dioxide concentration, these were allowed to stand in a CO2 incubator at 37 C
for 24 hours. After lapsing a predetermined allowing time, the PRP in the plate was removed, and the plate was washed five times with each 3 mL of PBS. Thereafter, 2 mL of a PBS solution containing 2.5% by volume of glutaraldehyde was added thereto, allowed to stand at 4 C over day and night, then, the PBS solution of glutaraldehyde was removed, and the plate was washed five times with each 3 mL of ultrapure water (Milli-Q water). Further, the plate was washed three times with each 1 mL of 70%
ethanol-water (v/v), and air-dried.
[0198] [Measurement of number of adhered platelets]
To the glass subshettes, the PS substrates, the PES substrates, the PP resin substrates, the PET resin substrates, the PTFE resin substrates or the PES
films of Examples 1 to 8, Examples 14 to 23, Examples 25 to 38, Comparative examples 1 to 6, Comparative example 9 and Comparative example 10 which had been subjected to the above-mentioned platelet adhesion test were deposited Pt-Pd for 1 minute by using ion sputter (E-1030, manufactured by Hitachi High Technologies Corporation).
Thereafter, adhesion of the platelets was observed by an electron microscope (S-4800, manufactured by Hitachi High Technologies Corporation) with 1, 000-fold.
Number of the adhered platelets at the five portions from the center portion of the glass substrate within a radius of 2 mm was counted by the electron microscope. By averaging the counted values of the respective portions, it was made a number of adhered platelets.
The results are shown in the following Tables 1 to 4.
[0199] [Table 1]
Number of platelets adhered (number) Glass PS PES
Example 1 0 Example 2 2 Example 3 = 1 Example 4 2 Example 5 1 Example 6 1 Example 7 3 Example 8 2 [0200] [Table 2]
Number of platelets adhered (number) PES PE PP PET PTFE
Example 14 2 Example 15 1 4 2 3 6 Example 16 17 Example 17 31 Example 18 10 Example 19 25 Example 20 6 Example 21 6 Example 22 4 Example 23 0 Example 25 1 Example 26 4 Example 27 2 Example 28 6 Example 29 4 Example 30 6 Example 31 3 Example 32 2 Example 33 10 Example 34 5 Example 35 2 [0201] [Table 3]
Number of platelets adhered (number) Glass PS PES
Comparative Example 1 45 Comparative Example 2 70 Comparative Example 3 99 Comparative Example 4 47 Comparative Example 5 85 Comparative Example 6 69 [0202] [Table 4]
Number of platelets adhered (number) PES PE PP PET PTFE
Comparative Example 9 107 17 35 73 53 Comparative Example 10 138 (PES: Example 8 and Comparative example 6 are the results on the PES
substrates, and Examples 14 to 35 and Comparative examples 9 and 10 are the results on the PES
films.) [0203] [Protein adhesion test; QCM-D measurement]
The QCM sensors surface treated in Example 9, Comparative example 7 and Comparative example 8 were attached to a dissipation type quartz resonator microbalance QCM-D (E4, manufactured by Q-Sense Co.), and PBS was flown until a stable base line has been established in which change in the frequency became 1 Hz or less in one hour. Next, the frequency of the stabilized base line was made 0 Hz and PBS was flown for about 10 minutes. Subsequently, a solution in which human serum (available from Aldrich Co.) was diluted to 10% with PBS was flown for about minutes, thereafter PBS was again flown for about 20 minutes, and then, a shift (Af) of ò
an adhesion induced frequency at eleventh overtone was read. The measured values are shown in Table 5. In Example 9, the shift value was close to 0, and no human serum was adhered, but in Comparative example 7 and Comparative example 8, as compared to Example 9, it was shown that the human serum component had been adhered.
[0204] [Table 5]
Table 5 Adhesion induced frequency shift value (Af) Example 9 -1 Comparative Example 7 -18 Comparative Example 8 -33 [0205] [Protein adhesion test; QCM-D measurement (2)]
The PES sensors surface treated in Examples 14, 15, 20, 27 to 29 and 31, Comparative example 9 and Comparative example 11 were attached to a dissipation type quartz resonator microbalance QCM-D (E4, manufactured by Q-Sense Co.), and PBS was flown until a stable base line has been established in which change in the frequency became 1 Hz or less in one hour. Next, the frequency of the stabilized base line was made 0 Hz and PBS was flown for about 10 minutes. Subsequently, a solution in which fibrinogen, derived from a human plasma (available from Wako Pure Chemical Industries, Ltd.) or fibronectin, derived from a human plasma (available from Sigma-Aldrich Co. LLC.) was diluted to 100 Ilginal with PBS was flown for about 30 minutes, thereafter PBS was again flown for about 20 minutes, and then, a shift (Af) of an adhesion induced frequency at eleventh overtone was read. By using Q-Tools (manufactured by Q-Sense Co.) for analysis, a shift (Af) of the adhesion induced frequency is converted into a mass (ng/cm2) per unit surface area of a shift (Af) of the adhesion induced frequency explained by the Sauerbrey's formula and shown as an adhered amount of the biological substance in Table 6. As compared to Comparative examples, Examples showed adhesion amounts of various proteins with one digit large.
[0206] [Table 6]
Table 6 Mass (ng/cm2) per unit surface area Fibrinogen Fibronectin Example 14 121 15 Example 15 186 8 Example 20 300 15 Example 27 131 Example 28 59 Example 29 58 Example 31 244 16 Comparative Example 9 2214 837 Comparative Example 11 1102 34 [0207] [Measurement of contact angle in liquid]
A contact angle in a liquid of CH2I2 (diiodomethane) in PBS was measured.
The measurement results are shown in Table 7.
[0208] [Table 7]
Table 7 Measurement of contact angle in liquid ( ) Substrate Drying Drying time Drying time Drying time temperature 10 min 12 firs 24 hrs Example 10 Silicon 50 C 144 = 145 144 Example 11 Silicon 100 C 142 145 Example 12 Silicon 200 C 140 Example 13 PES 50 C 141 142 [0209] With regard to the uncoated silicon wafer and PES substrate, when a contact angle in liquid was measured in the same conditions to those of Example 10 to Example 13, then, the silicon wafer was 144 and the PES substrate (PES film thickness: 300A) was 60 .
[0210] From the results as mentioned above, in the surface contact angle measurement method in liquid, a contact angle to the coating film of CH2I2 in PBS is 137 to 151 , more preferably 139 to 149 .
[0211] [Measurement of particle diameter by dynamic light scattering method]
Measurements of a sol particle diameter in each of the composition for forming a coating film of Examples 14, 15, 16, 18, 19, 20, 21, 26, 30, 33 and 35 were carried out by using a dynamic light scattering photometer (DLS, manufactured by Otsuka Electronics Co., Ltd., Product name: DLS-8000DLTKY).
[0212] [Table 8]
Table 8 Average particle diameter (nm) Example 14 79 Example 15 35 Example 16 42 Example 18 34 Example 19 12 Example 20 115 Example 21 46 Example 26 40 Example 30 18 Example 33 151 #
Example 35 22 UTILIZABIIITY IN INDUSTRY
[0213] The coating filin using with an ion complex of the present invention firmly fix to any of the substrates with a simple and easy drying process, and the film has a function of inhibiting adhesion of a biological substance. It can be expected to apply for a coating film inhibiting adhesion of the biological substance to an artificial dialyzer, artificial organs, medical equipments, etc.
Claims (21)
wherein U a1,U a2, U b1,U b2, and U b3 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, An-represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion, and a solvent onto a substrate; and a process of drying at a temperature of -200°C to 200°C.
by mass.
wherein T a, T b, U a1, U a2, U b1, U b2 and U b3 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, Q a and Q b each independently represent a single bond, an ester bond or an amide bond, R a and R b each independently represent a linear or branched alkylene group having 1 to 10 carbon atoms which may be substituted by a halogen atom, An- represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion, and m is an integer of 0 to 6.
wherein U a1, U a2, U b1, U b2 and U b3 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, An-represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion, and a solvent onto a substrate; and a process of drying at a temperature of -200°C to 200°C.
wherein T a, T b, U a1, U a2, U b1, U b2 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, Q a and Q b each independently represent a single bond, an ester bond or an amide bond, R a and R b each independently represent a linear or branched alkylene group having 1 to 10 carbon atoms which may be substituted by a halogen atom, An- represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion, and m is an integer of 0 to 6, and a compound of the following formula (C) or (D):
wherein T c, T d and U d each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, R c and R d each independently represent a linear or branched alkylene group having 1 to 10 carbon atoms which may be substituted by a halogen atom.
wherein U a1, U a2, U b1 and U b3 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, An-represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion;
(ii) a solvent; and (iii) a pH adjusting agent.
wherein T a, T b, U a1, U a2, U b1, U b2 and U b3 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, Q a and Q b each independently represent a single bond, an ester bond or an amide bond, R a and R b each independently represent a linear or branched alkylene group having 1 to 10 carbon atoms which may be substituted by a halogen atom, An- represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion, and m is an integer of 0 to 6.
wherein T a, T b, U a1, U a2, U b1 and U b3 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, Q a and Q b each independently represent a single bond, an ester bond or an amide bond, R a and R b each independently represent a linear or branched alkylene group having 1 to 10 carbon atoms which may be substituted by a halogen atom, An- represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion, and m is an integer of 0 to 6, in a solvent with a total concentration of the both compounds of 0.01% by mass to 4%
by mass.
by mass of water.
by mass of an alcohol.
wherein T a, T b, U a1, U a2, U b1, U b2 and U b3 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, Q a and Q b each independently represent a single bond, an ester bond or an amide bond, R a and R b each independently represent a linear or branched alkylene group having 1 to 10 carbon atoms which may be substituted by a halogen atom, An- represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion, and m is an integer of 0 to 6, a solvent and a polymerization initiator, by adding the mixture dropwise into a solvent maintained at a temperature higher than 10-hr half-life temperature of the polymerization initiator.
wherein U a1, U a2, U b1, U b2 and U b3 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, An-represents an anion selected from the group consisting of a halide ion, an inorganic acid ion, a hydroxide ion and an isothiocyanate ion.
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| GB2500721A (en) | 2012-03-30 | 2013-10-02 | Provost Fellows & Scholars College Of The Holy Undivided Trinity Of Queen Elizabeth Near Dublin | Cell culture medium additive comprising a xanthan polysaccharide and a mannan polysaccharide |
| CN108753679A (en) | 2012-07-24 | 2018-11-06 | 日产化学工业株式会社 | Culture media composition and the method for using the composition culture cell or tissue |
| US9528023B2 (en) * | 2012-12-13 | 2016-12-27 | Rohm And Haas Company | Amphoteric polymer particles and compositions thereof |
| JP6485349B2 (en) * | 2013-06-07 | 2019-03-20 | 日産化学株式会社 | Cell incubator |
| SG10202108070PA (en) * | 2014-12-10 | 2021-09-29 | Nissan Chemical Ind Ltd | Ion complex material having function of inhibiting adhesion of biological substance and method for manufacturing the same |
| EP3363870B1 (en) * | 2015-10-16 | 2023-04-19 | Nissan Chemical Corporation | Coating agent for flow passage |
| JP6965878B2 (en) * | 2016-05-27 | 2021-11-10 | 日産化学株式会社 | Cell culture vessel |
| JP7040446B2 (en) * | 2016-07-20 | 2022-03-23 | 日産化学株式会社 | A coating film having a thin film step coating property, a structural substrate provided with the film |
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2014
- 2014-06-09 JP JP2015521514A patent/JP6485349B2/en active Active
- 2014-06-09 SG SG11201510001RA patent/SG11201510001RA/en unknown
- 2014-06-09 JP JP2015521512A patent/JP6481611B2/en active Active
- 2014-06-09 WO PCT/JP2014/065248 patent/WO2014196650A1/en not_active Ceased
- 2014-06-09 CN CN201480032648.5A patent/CN105308137B/en active Active
- 2014-06-09 KR KR1020157037029A patent/KR102358722B1/en active Active
- 2014-06-09 CA CA2914616A patent/CA2914616C/en active Active
- 2014-06-09 CA CA2914618A patent/CA2914618A1/en active Pending
- 2014-06-09 US US14/896,639 patent/US10774234B2/en active Active
- 2014-06-09 KR KR1020157037043A patent/KR102292139B1/en active Active
- 2014-06-09 US US14/896,623 patent/US11345827B2/en active Active
- 2014-06-09 TW TW103119985A patent/TWI673333B/en active
- 2014-06-09 CN CN202011478659.XA patent/CN112552769B/en active Active
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- 2014-06-09 CN CN201480032593.8A patent/CN105308169B/en active Active
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| EP3363870A4 (en) * | 2015-10-16 | 2018-10-31 | Nissan Chemical Corporation | Coating material for channel |
| US11470841B2 (en) * | 2016-06-15 | 2022-10-18 | Nissan Chemical Corporation | Cryopreservation vessel |
| US12291701B2 (en) | 2017-09-26 | 2025-05-06 | Nissan Chemical Corporation | Cell culture container having minute volume |
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