CA2814755C - Method for bonding solar cells directly to polyimide - Google Patents
Method for bonding solar cells directly to polyimide Download PDFInfo
- Publication number
- CA2814755C CA2814755C CA2814755A CA2814755A CA2814755C CA 2814755 C CA2814755 C CA 2814755C CA 2814755 A CA2814755 A CA 2814755A CA 2814755 A CA2814755 A CA 2814755A CA 2814755 C CA2814755 C CA 2814755C
- Authority
- CA
- Canada
- Prior art keywords
- solar cell
- thermoplastic polyimide
- polyimide
- solar
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 99
- 229920001721 polyimide Polymers 0.000 title claims description 65
- 239000004642 Polyimide Substances 0.000 title claims description 62
- 229920006259 thermoplastic polyimide Polymers 0.000 claims abstract description 182
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000001816 cooling Methods 0.000 claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 239000000178 monomer Substances 0.000 claims description 88
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 50
- 150000004985 diamines Chemical class 0.000 claims description 48
- 239000002131 composite material Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 19
- 229910002804 graphite Inorganic materials 0.000 claims description 19
- 239000010439 graphite Substances 0.000 claims description 19
- 239000004760 aramid Substances 0.000 claims description 16
- 229920003235 aromatic polyamide Polymers 0.000 claims description 16
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 13
- 239000004917 carbon fiber Substances 0.000 claims description 13
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 claims description 11
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 10
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 7
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 19
- 239000000203 mixture Substances 0.000 description 16
- 238000003491 array Methods 0.000 description 12
- BIXGISJFDUHZEB-UHFFFAOYSA-N 2-[9,9-bis(4-methylphenyl)fluoren-2-yl]-9,9-bis(4-methylphenyl)fluorene Chemical compound C1=CC(C)=CC=C1C1(C=2C=CC(C)=CC=2)C2=CC(C=3C=C4C(C5=CC=CC=C5C4=CC=3)(C=3C=CC(C)=CC=3)C=3C=CC(C)=CC=3)=CC=C2C2=CC=CC=C21 BIXGISJFDUHZEB-UHFFFAOYSA-N 0.000 description 7
- 229920001169 thermoplastic Polymers 0.000 description 6
- 239000004416 thermosoftening plastic Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- SXGMVGOVILIERA-UHFFFAOYSA-N (2R,3S)-2,3-diaminobutanoic acid Natural products CC(N)C(N)C(O)=O SXGMVGOVILIERA-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 101100353042 Mycobacterium bovis (strain BCG / Pasteur 1173P2) lnt gene Proteins 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- -1 aluminum metals Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 101150028022 ppm1 gene Proteins 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/804—Materials of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/807—Double-glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/85—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/808—Bonding techniques
- H01L2224/8085—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/970,230 US8232129B2 (en) | 2010-12-16 | 2010-12-16 | Bonding solar cells directly to polyimide |
| US12/970,230 | 2010-12-16 | ||
| PCT/US2011/052788 WO2012091771A1 (en) | 2010-12-16 | 2011-09-22 | Method for bonding solar cells directly to polyimide |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2814755A1 CA2814755A1 (en) | 2012-07-05 |
| CA2814755C true CA2814755C (en) | 2018-10-16 |
Family
ID=44759785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2814755A Active CA2814755C (en) | 2010-12-16 | 2011-09-22 | Method for bonding solar cells directly to polyimide |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8232129B2 (enExample) |
| EP (1) | EP2652796B1 (enExample) |
| JP (1) | JP5887357B2 (enExample) |
| KR (1) | KR101660570B1 (enExample) |
| CN (1) | CN103262258B (enExample) |
| CA (1) | CA2814755C (enExample) |
| WO (1) | WO2012091771A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2012560B1 (en) * | 2014-04-03 | 2016-03-08 | Stichting Energieonderzoek Centrum Nederland | Solar panel and method for manufacturing such a solar panel. |
| US10059471B2 (en) | 2014-10-24 | 2018-08-28 | Solaero Technologies Corp. | Method for releasing a deployable boom |
| US9004410B1 (en) * | 2014-10-24 | 2015-04-14 | Alliance Spacesystems, Llc | Deployable boom for collecting electromagnetic energy |
| FR3028515B1 (fr) * | 2014-11-14 | 2018-01-12 | Thales | Structure composite comportant une resine chargee avec des feuillets plans de graphene a conductivite thermique et conductivite electrique renforcees, notamment pour satellite |
| WO2016205722A1 (en) * | 2015-06-17 | 2016-12-22 | Stc.Unm | Metal matrix composites for contacts on solar cells |
| US12074228B2 (en) | 2015-06-17 | 2024-08-27 | Unm Rainforest Innovations | Metal-carbon-nanotube metal matrix composites for metal contacts on photovoltaic cells |
| US10276742B2 (en) * | 2015-07-09 | 2019-04-30 | Solaero Technologies Corp. | Assembly and mounting of solar cells on space vehicles or satellites |
| JP7030683B2 (ja) | 2015-07-27 | 2022-03-07 | シエラ・スペース・コーポレイション | 宇宙空間品質の太陽電池アレイの製造方法 |
| CN106409958B (zh) * | 2016-09-21 | 2017-08-11 | 云南临沧鑫圆锗业股份有限公司 | 基于石墨衬底的倒装三结太阳电池及其制备方法 |
| US20220037541A1 (en) * | 2020-07-30 | 2022-02-03 | Northrop Grumman Systems Corporation | Flexible solar array for extraterrestrial deployment |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3179634A (en) | 1962-01-26 | 1965-04-20 | Du Pont | Aromatic polyimides and the process for preparing them |
| US3179630A (en) | 1962-01-26 | 1965-04-20 | Du Pont | Process for preparing polyimides by treating polyamide-acids with lower fatty monocarboxylic acid anhydrides |
| US4394529A (en) * | 1981-08-05 | 1983-07-19 | Rca Corporation | Solar cell array with lightweight support structure |
| US4542257A (en) | 1984-04-27 | 1985-09-17 | Hughes Aircraft Company | Solar cell array panel and method of manufacture |
| JPH02181975A (ja) * | 1989-01-07 | 1990-07-16 | Nitto Denko Corp | フィルム太陽電池 |
| US5614033A (en) | 1995-08-08 | 1997-03-25 | Hughes Aircraft Company | Rigid solar panel with discrete lattice and carrier structures bonded together |
| JPH11100517A (ja) * | 1997-09-29 | 1999-04-13 | Hitachi Chem Co Ltd | 樹脂ペースト、膜形成法、電子部品及び半導体装置 |
| US6313396B1 (en) | 2000-05-22 | 2001-11-06 | The Boeing Company | Lightweight solar module and method of fabrication |
| US6410362B1 (en) | 2000-08-28 | 2002-06-25 | The Aerospace Corporation | Flexible thin film solar cell |
| US6300158B1 (en) | 2000-08-28 | 2001-10-09 | Iowa Thin Films | Integrated solar power module |
| EP1910078A4 (en) * | 2005-08-02 | 2012-06-06 | Nexolve Corp | HETEROPOLYMERIC COMPOSITIONS OF POLYIMIDE POLYMER |
| WO2007088892A1 (ja) * | 2006-02-02 | 2007-08-09 | Mitsui Chemicals, Inc. | 太陽電池モジュール用裏面保護基板、並びに、太陽電池モジュール及び発電装置 |
| JP2008047815A (ja) * | 2006-08-21 | 2008-02-28 | Toyobo Co Ltd | 光電変換装置 |
| JP2008047813A (ja) * | 2006-08-21 | 2008-02-28 | Toyobo Co Ltd | 光電変換装置 |
| US20090188603A1 (en) * | 2008-01-25 | 2009-07-30 | Applied Materials, Inc. | Method and apparatus for controlling laminator temperature on a solar cell |
| JP5481929B2 (ja) * | 2008-05-20 | 2014-04-23 | 宇部興産株式会社 | ポリイミド金属積層体および太陽電池 |
| US20090288699A1 (en) * | 2008-05-20 | 2009-11-26 | E.I. Du Pont De Nemours And Company | Laminate structures for high temperature photovoltaic applications, and methods relating thereto |
| JP2009290164A (ja) | 2008-06-02 | 2009-12-10 | Toyobo Co Ltd | 光電変換装置 |
| US20100330731A1 (en) * | 2009-06-27 | 2010-12-30 | Twin Creeks Technologies, Inc. | Method to form a thin semiconductor lamina adhered to a flexible substrate |
| CN102575034B (zh) * | 2009-08-20 | 2013-11-06 | 宇部兴产株式会社 | 聚酰亚胺膜和用于制备聚酰亚胺膜的方法 |
-
2010
- 2010-12-16 US US12/970,230 patent/US8232129B2/en active Active
-
2011
- 2011-09-22 KR KR1020137007449A patent/KR101660570B1/ko active Active
- 2011-09-22 CA CA2814755A patent/CA2814755C/en active Active
- 2011-09-22 WO PCT/US2011/052788 patent/WO2012091771A1/en not_active Ceased
- 2011-09-22 CN CN201180060387.4A patent/CN103262258B/zh active Active
- 2011-09-22 JP JP2013544465A patent/JP5887357B2/ja active Active
- 2011-09-22 EP EP11764921.0A patent/EP2652796B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140009972A (ko) | 2014-01-23 |
| KR101660570B1 (ko) | 2016-09-27 |
| WO2012091771A1 (en) | 2012-07-05 |
| JP5887357B2 (ja) | 2016-03-16 |
| US20120156824A1 (en) | 2012-06-21 |
| JP2013546198A (ja) | 2013-12-26 |
| US8232129B2 (en) | 2012-07-31 |
| EP2652796A1 (en) | 2013-10-23 |
| CN103262258A (zh) | 2013-08-21 |
| EP2652796B1 (en) | 2022-01-05 |
| CA2814755A1 (en) | 2012-07-05 |
| CN103262258B (zh) | 2015-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |
Effective date: 20160922 |