CA2659017A1 - Device for preheating a component cooled by conduction and/or by convection - Google Patents
Device for preheating a component cooled by conduction and/or by convection Download PDFInfo
- Publication number
- CA2659017A1 CA2659017A1 CA002659017A CA2659017A CA2659017A1 CA 2659017 A1 CA2659017 A1 CA 2659017A1 CA 002659017 A CA002659017 A CA 002659017A CA 2659017 A CA2659017 A CA 2659017A CA 2659017 A1 CA2659017 A1 CA 2659017A1
- Authority
- CA
- Canada
- Prior art keywords
- heat
- heat pipe
- component
- conducting part
- dissipater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
- Resistance Heating (AREA)
- Secondary Cells (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a device for preheating a component cooled by conduction and/or by convection. The component (102) is in contact with a heat-conducting part (108) and the device comprises means (116) for heating the said part, the device comprising at least one heat pipe (114) connecting a heat dissipater (110) with the said part, the said dissipater and the said part furthermore being thermally insulated from one another. The freezing of the fluid comprised in the heat pipe (114) is taken advantage of in order to facilitate the preheating of the component (102) at low temperature. The invention applies notably to the starting of components subjected to low temperatures, for example, components installed in systems on board aircraft.
Description
DEVICE FOR PREHEATING A COMPONENT COOLED BY CONDUCTION
AND/OR BY CONVECTION
The present invention relates to a device for preheating a component cooled by conduction and/or by convection. The invention applies notably to the starting of components subjected to low temperatures, for example components installed in systems on board aircraft.
Electronic components, for example computer processors, are designed to operate in a limited temperature range, for example between 0`C
and 100'C. Therefore, when these components operate, they give off a quantity of heat which must be cleared away in order to avoid exceeding the authorized top temperature limit. The calories generated by the component are then usually cleared away thanks to means of cooling by conduction or by convection.
In certain situations, notably in a large number of onboard systems, the components are placed in environments at low temperatures -for example -40r. The starting of these components at temperatures below their bottom operating temperature limit poses a problem. In order to raise the temperature beyond this bottom limit, it is possible for example to place a heating resistor close to the component. But the cooling means that are present in order to clear away the excess calories will oppose the action of this heating resistor, thereby slowing, or even totally nullifying its effect.
There is therefore a contradiction between the need, when cold, to preheat the component before starting it, and the need, when hot, to clear away the calories generated by the component.
As an example, taking as the hypothesis a conduction-cooled 15W
dissipation processor, it is necessary to preheat the processor with 74W of power for 9 minutes in order to bring its temperature from -409C to 0'C. This waiting time is often too long and this required power is usually too high to be acceptable in onboard equipment.
An object of the invention is to allow a component associated with cooling means to start in an environment the temperature of which is below its minimum operating temperature. Accordingly, the subject of the invention is a device for preheating a component in contact with a heat-conducting part, the device comprising means for heating the said part, the device being characterized in that it comprises at least one heat pipe connecting a heat dissipater with the said part, the said dissipater and the said part furthermore being thermally insulated from one another.
By preventing the clearing away of the calories by an effect of freezing the fluid inside the heat pipe, the device according to the invention makes it possible to rapidly raise the temperature of the component in order to bring it to an acceptable level before it is started. Preferably, the volume of the heat-conducting part is small, so as to limit the energy necessary to preheat the component.
The heat-conducting part may be formed by an excrescence of the heat pipe, so as to reduce the volume of material to be heated and to enhance the efficiency of conduction between the heat pipe and the heat-conducting part.
According to an embodiment of the device according to the invention, each end of the heat pipe is placed in contact with the heat dissipater, the central portion of the heat pipe being in contact with the heat-conducting part. This embodiment makes it possible to generate substantially symmetrical heat-clearing paths, which facilitates the heat conduction, notably when the device sustains accelerations hampering the movement of the fluid contained in the heat pipe.
The heating means may comprise at least one heating resistor, the said resistor being placed adjacent to the heat-conducting part.
Advantageously, the heat-conducting part and the heat pipe are insulated in order to limit the heat loss.
In addition, the heat-conducting part may be rounded on the surface in order to reduce the heat loss by radiation.
Preferably, the heat-conducting part and the heat pipe are made of low specific heat materials, such as, for example, aluminium or copper.
According to an embodiment of the device according to the invention, the heat-conducting fluid used in the heat pipe may be chosen so that its solidification temperature is at least equal to or slightly below (for example a few degrees Celsius less) the preheating temperature to be achieved.
The device according to the invention may for example be installed in an onboard system greatly limited in available power and subjected to low temperatures.
AND/OR BY CONVECTION
The present invention relates to a device for preheating a component cooled by conduction and/or by convection. The invention applies notably to the starting of components subjected to low temperatures, for example components installed in systems on board aircraft.
Electronic components, for example computer processors, are designed to operate in a limited temperature range, for example between 0`C
and 100'C. Therefore, when these components operate, they give off a quantity of heat which must be cleared away in order to avoid exceeding the authorized top temperature limit. The calories generated by the component are then usually cleared away thanks to means of cooling by conduction or by convection.
In certain situations, notably in a large number of onboard systems, the components are placed in environments at low temperatures -for example -40r. The starting of these components at temperatures below their bottom operating temperature limit poses a problem. In order to raise the temperature beyond this bottom limit, it is possible for example to place a heating resistor close to the component. But the cooling means that are present in order to clear away the excess calories will oppose the action of this heating resistor, thereby slowing, or even totally nullifying its effect.
There is therefore a contradiction between the need, when cold, to preheat the component before starting it, and the need, when hot, to clear away the calories generated by the component.
As an example, taking as the hypothesis a conduction-cooled 15W
dissipation processor, it is necessary to preheat the processor with 74W of power for 9 minutes in order to bring its temperature from -409C to 0'C. This waiting time is often too long and this required power is usually too high to be acceptable in onboard equipment.
An object of the invention is to allow a component associated with cooling means to start in an environment the temperature of which is below its minimum operating temperature. Accordingly, the subject of the invention is a device for preheating a component in contact with a heat-conducting part, the device comprising means for heating the said part, the device being characterized in that it comprises at least one heat pipe connecting a heat dissipater with the said part, the said dissipater and the said part furthermore being thermally insulated from one another.
By preventing the clearing away of the calories by an effect of freezing the fluid inside the heat pipe, the device according to the invention makes it possible to rapidly raise the temperature of the component in order to bring it to an acceptable level before it is started. Preferably, the volume of the heat-conducting part is small, so as to limit the energy necessary to preheat the component.
The heat-conducting part may be formed by an excrescence of the heat pipe, so as to reduce the volume of material to be heated and to enhance the efficiency of conduction between the heat pipe and the heat-conducting part.
According to an embodiment of the device according to the invention, each end of the heat pipe is placed in contact with the heat dissipater, the central portion of the heat pipe being in contact with the heat-conducting part. This embodiment makes it possible to generate substantially symmetrical heat-clearing paths, which facilitates the heat conduction, notably when the device sustains accelerations hampering the movement of the fluid contained in the heat pipe.
The heating means may comprise at least one heating resistor, the said resistor being placed adjacent to the heat-conducting part.
Advantageously, the heat-conducting part and the heat pipe are insulated in order to limit the heat loss.
In addition, the heat-conducting part may be rounded on the surface in order to reduce the heat loss by radiation.
Preferably, the heat-conducting part and the heat pipe are made of low specific heat materials, such as, for example, aluminium or copper.
According to an embodiment of the device according to the invention, the heat-conducting fluid used in the heat pipe may be chosen so that its solidification temperature is at least equal to or slightly below (for example a few degrees Celsius less) the preheating temperature to be achieved.
The device according to the invention may for example be installed in an onboard system greatly limited in available power and subjected to low temperatures.
Other features will appear on reading the following detailed, non-limiting description given as an example with respect to the appended drawings which represent:
- Figure 1, a top view of an embodiment of the device according to the invention;
- Figure 2, a view in longitudinal section of the embodiment of Figure 1;
- Figure 3, a view in cross section of the embodiment of Figure 1;
- Figure 4, a view of the heat-conducting part used in the embodiment of Figure 1.
The same reference numbers in various figures designate the same elements.
Figure 1, Figure 2 and Figure 3 show respectively a top view, a view in longitudinal section and a view in cross section of an embodiment of the device according to the invention.
The device 100 of the example comprises a component 102 placed on a substrate 104, which substrate 104 is placed on a printed circuit board 106. A heat-conducting part 108, for example an aluminium block, is placed in contact with the component 102. In the example of Figures 1, 2 and 3, the conducting part 108 is placed adjacent to the top face of the component 102.
Furthermore, a heat dissipater 110, for example an aluminium drain, is clamped by cold plates 112a, 112b and placed close to the component, without touching it. In addition, all contact must be avoided between the conducting part 108 and the heat dissipater 110 so that no direct heat path between the conducting part 108 and the heat dissipater 110 is created. In the example, the heat dissipater 110 is a plate that is perforated so that the conducting part 108 can pass through without touching the plate.
The heat dissipater 110 must make it possible to clear away a large proportion of the calories generated by the component 102. Therefore, a heat pipe 114 connects the heat dissipater 110 to the conducting part 108 so that the heat pipe 114 establishes an efficient heat-conducting path between the part 108 and the heat dissipater 110 when the temperature of the heat pipe 114 is high enough to allow the fluid contained in the heat pipe 114 to leave the solid phase and to operate a heat-conducting circuit. On the other hand, when the temperature of the heat pipe 114 is too low to allow the fluid to melt, the heat-conducting circuit inside the heat pipe 114 is impossible, which thermally insulates the conducting part 108 from the heat dissipater 110. In the example, the top face of the heat dissipater 110 is grooved 111 to the dimensions of the heat pipe 114 and the heat pipe 114 is placed in the groove 111, the area of contact between the heat pipe 114 and the heat dissipater 110 thereby being maximized.
In order to raise the temperature of the component 102, a heating resistor 116 is placed close to the latter. In the example, the heating resistor 116 is placed adjacent to the conducting part 108, but in another embodiment, the heating resistor 116 is placed on the heat pipe 114.
The heat-conducting part 108 notably plays a role of a heat interface. Specifically, on the one hand, it carries the calories originating from the heating resistor 116 to the component 102, and on the other hand, when the component 102 is operating, the heat-conducting part 108 carries the calories originating from the component 102 to the heat pipe 114. According to one embodiment, the heat-conducting part 108 is only an excrescence of the heat pipe 114, the said excrescence 108 being fashioned at the time of manufacture of the heat pipe 114.
When, initially, the device 100 is subjected to an ambient temperature that is lower than the solidification temperature of the fluid contained in the heat pipe 114 (at the internal pressure of the heat pipe 114), the heating resistor 116 transmits calories to the heat-conducting part 108, hence to the component 102 and the heat pipe 114. Since the fluid contained in the heat pipe 114 is solidified, the heat pipe 114 is inoperative;
therefore, the calories remain largely confined to the assembly consisting of the component 102, the heat-conducting part 108 and the heat pipe 114. The temperature of this assembly increases until it reaches the minimum operating temperature of the component 102. The component can then be started without risk, then when the temperature of the assembly {component 102, conducting part 108, heat pipe 114} reaches or even exceeds the melting temperature of the fluid, then a heat-conducting circuit can be made in the heat pipe 114, which then carries away the received calories to the heat dissipater 110, thus preventing the component 102 from overheating.
The fluid used in the heat pipe 114 is, for example, water.
However, fluids with different solidification temperatures may be chosen in order to suit the conditions of use of the device 100. For example, for components operating at very low temperatures, alcohol may be a judicious choice for the heat pipe 114. Whatever fluid is chosen, its solidification 5 temperature must be below the maximum operating temperature of the component 102.
In the example, each end of the heat pipe 114 is placed in contact with the heat dissipater 110, the central portion of the heat pipe 114 being in contact with the conducting part 108. Therefore, the heat pipe 114 of the example comprises an evaporator on the conducting part 108 and two condensers, one at each end of the heat pipe 114. This configuration results in obtaining two substantially symmetrical heat clearance paths, which reduces the distance of travel of the fluid from a condenser to the evaporator and consequently makes it easier to establish a heat circuit. Notably, this configuration improves the heat-conducting path brought about by the heat pipe 114 when the device 100 sustains accelerations - including natural gravitation - hampering the movement of the fluid.
According to another embodiment, a first end of the heat pipe 114 is placed adjacent to the conducting part 108, whereas its second end is placed in contact with the heat dissipater 110, this configuration resulting in a simple evaporator-condenser circuit.
Figure 4 shows a view of the heat-conducting part used in the embodiment of Figure 1.
The conducting part 108 of the example is in the form of an arch.
In other words, it is a parallelepiped of which one face 401 has been hollowed out to form a groove 410 to the dimension of the heat pipe 114. The face 402 opposite to the hollowed-out face is placed in contact with the component 102 (Figures 1, 2, 3) and a side face 403 comprises a sufficient area to place a heating resistor thereon.
According to another embodiment of the device according to the invention, the conducting part 108 may be made in many ways, provided notably that the shape chosen allows good heat conduction between the said part 108, the heat pipe 114 and the component 102. Furthermore, several heating resistors may be placed adjacent to the conducting part 108 in order to more rapidly raise its temperature.
. ~ .. . . .. . . . . . . .
- Figure 1, a top view of an embodiment of the device according to the invention;
- Figure 2, a view in longitudinal section of the embodiment of Figure 1;
- Figure 3, a view in cross section of the embodiment of Figure 1;
- Figure 4, a view of the heat-conducting part used in the embodiment of Figure 1.
The same reference numbers in various figures designate the same elements.
Figure 1, Figure 2 and Figure 3 show respectively a top view, a view in longitudinal section and a view in cross section of an embodiment of the device according to the invention.
The device 100 of the example comprises a component 102 placed on a substrate 104, which substrate 104 is placed on a printed circuit board 106. A heat-conducting part 108, for example an aluminium block, is placed in contact with the component 102. In the example of Figures 1, 2 and 3, the conducting part 108 is placed adjacent to the top face of the component 102.
Furthermore, a heat dissipater 110, for example an aluminium drain, is clamped by cold plates 112a, 112b and placed close to the component, without touching it. In addition, all contact must be avoided between the conducting part 108 and the heat dissipater 110 so that no direct heat path between the conducting part 108 and the heat dissipater 110 is created. In the example, the heat dissipater 110 is a plate that is perforated so that the conducting part 108 can pass through without touching the plate.
The heat dissipater 110 must make it possible to clear away a large proportion of the calories generated by the component 102. Therefore, a heat pipe 114 connects the heat dissipater 110 to the conducting part 108 so that the heat pipe 114 establishes an efficient heat-conducting path between the part 108 and the heat dissipater 110 when the temperature of the heat pipe 114 is high enough to allow the fluid contained in the heat pipe 114 to leave the solid phase and to operate a heat-conducting circuit. On the other hand, when the temperature of the heat pipe 114 is too low to allow the fluid to melt, the heat-conducting circuit inside the heat pipe 114 is impossible, which thermally insulates the conducting part 108 from the heat dissipater 110. In the example, the top face of the heat dissipater 110 is grooved 111 to the dimensions of the heat pipe 114 and the heat pipe 114 is placed in the groove 111, the area of contact between the heat pipe 114 and the heat dissipater 110 thereby being maximized.
In order to raise the temperature of the component 102, a heating resistor 116 is placed close to the latter. In the example, the heating resistor 116 is placed adjacent to the conducting part 108, but in another embodiment, the heating resistor 116 is placed on the heat pipe 114.
The heat-conducting part 108 notably plays a role of a heat interface. Specifically, on the one hand, it carries the calories originating from the heating resistor 116 to the component 102, and on the other hand, when the component 102 is operating, the heat-conducting part 108 carries the calories originating from the component 102 to the heat pipe 114. According to one embodiment, the heat-conducting part 108 is only an excrescence of the heat pipe 114, the said excrescence 108 being fashioned at the time of manufacture of the heat pipe 114.
When, initially, the device 100 is subjected to an ambient temperature that is lower than the solidification temperature of the fluid contained in the heat pipe 114 (at the internal pressure of the heat pipe 114), the heating resistor 116 transmits calories to the heat-conducting part 108, hence to the component 102 and the heat pipe 114. Since the fluid contained in the heat pipe 114 is solidified, the heat pipe 114 is inoperative;
therefore, the calories remain largely confined to the assembly consisting of the component 102, the heat-conducting part 108 and the heat pipe 114. The temperature of this assembly increases until it reaches the minimum operating temperature of the component 102. The component can then be started without risk, then when the temperature of the assembly {component 102, conducting part 108, heat pipe 114} reaches or even exceeds the melting temperature of the fluid, then a heat-conducting circuit can be made in the heat pipe 114, which then carries away the received calories to the heat dissipater 110, thus preventing the component 102 from overheating.
The fluid used in the heat pipe 114 is, for example, water.
However, fluids with different solidification temperatures may be chosen in order to suit the conditions of use of the device 100. For example, for components operating at very low temperatures, alcohol may be a judicious choice for the heat pipe 114. Whatever fluid is chosen, its solidification 5 temperature must be below the maximum operating temperature of the component 102.
In the example, each end of the heat pipe 114 is placed in contact with the heat dissipater 110, the central portion of the heat pipe 114 being in contact with the conducting part 108. Therefore, the heat pipe 114 of the example comprises an evaporator on the conducting part 108 and two condensers, one at each end of the heat pipe 114. This configuration results in obtaining two substantially symmetrical heat clearance paths, which reduces the distance of travel of the fluid from a condenser to the evaporator and consequently makes it easier to establish a heat circuit. Notably, this configuration improves the heat-conducting path brought about by the heat pipe 114 when the device 100 sustains accelerations - including natural gravitation - hampering the movement of the fluid.
According to another embodiment, a first end of the heat pipe 114 is placed adjacent to the conducting part 108, whereas its second end is placed in contact with the heat dissipater 110, this configuration resulting in a simple evaporator-condenser circuit.
Figure 4 shows a view of the heat-conducting part used in the embodiment of Figure 1.
The conducting part 108 of the example is in the form of an arch.
In other words, it is a parallelepiped of which one face 401 has been hollowed out to form a groove 410 to the dimension of the heat pipe 114. The face 402 opposite to the hollowed-out face is placed in contact with the component 102 (Figures 1, 2, 3) and a side face 403 comprises a sufficient area to place a heating resistor thereon.
According to another embodiment of the device according to the invention, the conducting part 108 may be made in many ways, provided notably that the shape chosen allows good heat conduction between the said part 108, the heat pipe 114 and the component 102. Furthermore, several heating resistors may be placed adjacent to the conducting part 108 in order to more rapidly raise its temperature.
. ~ .. . . .. . . . . . . .
To take the example cited in the preamble of this application, with a temperature of approximately -409C and a conducti on-cooled 15W
dissipation processor, the use of a device according to the invention makes it possible to reduce the power needed to be supplied to 20W and the preheating time to 40 seconds in order to bring its temperature from -409C to 0'C, compared with 74W and 9 minutes that are neces sary with a conventional device, which represents approximately a gain (time x power) with a factor of 50.
The device according to the invention may be used to bring a component to its minimum specified temperature, for example 0'C, before it is powered up or before it is initialized. Nevertheless, if the available power is very low and/or the acceptable time for preheating is very short, the device may also be used to bring the component to a temperature below the specified temperature, for example -201C, - but all the same higher than the ambient cold temperature - 409C. This limited r ise in temperature may in effect be sufficient to achieve an acceptable success rate during a cold sorting of the card fitted with the component.
The device according to the invention preferably applies to the electronic components present on cards cooled by conduction. However, without departing from the context of the invention, the device may equally apply to cards cooled by convection considering that a cold wall may be formed by a convection radiator associated with the component.
dissipation processor, the use of a device according to the invention makes it possible to reduce the power needed to be supplied to 20W and the preheating time to 40 seconds in order to bring its temperature from -409C to 0'C, compared with 74W and 9 minutes that are neces sary with a conventional device, which represents approximately a gain (time x power) with a factor of 50.
The device according to the invention may be used to bring a component to its minimum specified temperature, for example 0'C, before it is powered up or before it is initialized. Nevertheless, if the available power is very low and/or the acceptable time for preheating is very short, the device may also be used to bring the component to a temperature below the specified temperature, for example -201C, - but all the same higher than the ambient cold temperature - 409C. This limited r ise in temperature may in effect be sufficient to achieve an acceptable success rate during a cold sorting of the card fitted with the component.
The device according to the invention preferably applies to the electronic components present on cards cooled by conduction. However, without departing from the context of the invention, the device may equally apply to cards cooled by convection considering that a cold wall may be formed by a convection radiator associated with the component.
Claims (8)
1. Device for preheating a component (102) in contact with a heat-conducting part (108), the device comprising means (116) for heating the said part, the device being characterized in that it comprises at least one heat pipe (114) connecting a heat dissipater (110) with the said part, the said dissipater and the said part furthermore being thermally insulated from one another.
2. Device according to the preceding claim, characterized in that the heat-conducting part (108) is formed by an excrescence of the heat pipe (114).
3. Device according to either one of the preceding claims, characterized in that the heating means comprise at least one heating resistor (116), the said resistor being placed adjacent to the heat-conducting part (108).
4. Device according to any one of the preceding claims, characterized in that each end of the heat pipe (114) is placed in contact with the heat dissipater (110), the central portion of the heat pipe being in contact with the heat-conducting part (108).
5. Device according to any one of the preceding claims, characterized in that the heat-conducting part (108) and the heat pipe (114) are insulated in order to limit the heat loss.
6. Device according to any one of the preceding claims, characterized in that the heat-conducting part (108) is rounded on the surface in order to reduce the heat loss by radiation.
7. Device according to any one of the preceding claims, characterized in that the heat-conducting part (108) and the heat pipe (114) are made of low specific heat materials.
8 8. Device according to any one of the preceding claims, characterized in that the heat-conducting fluid used in the heat pipe (114) is chosen so that its solidification temperature is at least equal to or slightly below the preheating temperature to be achieved.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0801483 | 2008-03-18 | ||
| FR0801483A FR2929070B1 (en) | 2008-03-18 | 2008-03-18 | DEVICE FOR PREHEATING A COMPONENT COOLED BY CONDUCTION AND / OR CONVECTION |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2659017A1 true CA2659017A1 (en) | 2009-09-18 |
Family
ID=39714004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002659017A Abandoned CA2659017A1 (en) | 2008-03-18 | 2009-03-18 | Device for preheating a component cooled by conduction and/or by convection |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090236081A1 (en) |
| EP (1) | EP2104139B1 (en) |
| AT (1) | ATE534143T1 (en) |
| CA (1) | CA2659017A1 (en) |
| FR (1) | FR2929070B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI411756B (en) * | 2010-01-22 | 2013-10-11 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2956280A1 (en) | 2010-02-09 | 2011-08-12 | Kontron Modular Computers Sa | AUXILIARY DEVICE FOR EVACUATION BY CONDUCTION OF HEAT PRODUCED BY AN ELECTRONIC CARD |
| CN103348466A (en) * | 2011-02-10 | 2013-10-09 | 三菱电机株式会社 | Cooling device and power conversion device |
| WO2014085993A1 (en) * | 2012-12-05 | 2014-06-12 | Telefonaktiebolaget L M Ericsson (Publ) | System and method for regulating temperature of electronic component |
| DE102013010088A1 (en) * | 2013-06-18 | 2014-12-18 | VENSYS Elektrotechnik GmbH | Cooling device for a power converter module |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4198559A (en) * | 1977-12-20 | 1980-04-15 | Clairol Incorporated | Heat retaining appliance |
| US4696338A (en) * | 1982-06-01 | 1987-09-29 | Thermal Energy Stroage, Inc. | Latent heat storage and transfer system and method |
| US4936377A (en) * | 1986-12-11 | 1990-06-26 | The Boeing Company | Food storage cart with thermo wall |
| JP3224930B2 (en) * | 1993-12-28 | 2001-11-05 | 株式会社東芝 | Reproduction method of semiconductor device |
| US5901040A (en) * | 1997-07-30 | 1999-05-04 | Hewlett-Packard Company | Heat sink and Faraday Cage assembly for a semiconductor module and a power converter |
| US5896259A (en) * | 1997-08-05 | 1999-04-20 | Raytheon Company | Preheating device for electronic circuits |
| US6230790B1 (en) * | 1999-05-10 | 2001-05-15 | Lockheed Martin Corporation | Thermal control system for spacecraft |
| US6883337B2 (en) * | 2000-06-02 | 2005-04-26 | University Of Florida Research Foundation, Inc. | Thermal management device |
| US6452798B1 (en) * | 2001-09-12 | 2002-09-17 | Harris Corporation | Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods |
| US20030196787A1 (en) * | 2002-04-19 | 2003-10-23 | Mahoney William G. | Passive thermal regulator for temperature sensitive components |
| US6631755B1 (en) * | 2002-07-17 | 2003-10-14 | Compal Electronics, Inc. | Thermal module with temporary heat storage |
-
2008
- 2008-03-18 FR FR0801483A patent/FR2929070B1/en not_active Expired - Fee Related
-
2009
- 2009-03-12 EP EP09155008A patent/EP2104139B1/en active Active
- 2009-03-12 AT AT09155008T patent/ATE534143T1/en active
- 2009-03-17 US US12/405,556 patent/US20090236081A1/en not_active Abandoned
- 2009-03-18 CA CA002659017A patent/CA2659017A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI411756B (en) * | 2010-01-22 | 2013-10-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2929070A1 (en) | 2009-09-25 |
| US20090236081A1 (en) | 2009-09-24 |
| FR2929070B1 (en) | 2010-03-12 |
| ATE534143T1 (en) | 2011-12-15 |
| EP2104139B1 (en) | 2011-11-16 |
| EP2104139A1 (en) | 2009-09-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |
Effective date: 20140318 |