CA2443846A1 - Compositions organiques - Google Patents

Compositions organiques Download PDF

Info

Publication number
CA2443846A1
CA2443846A1 CA002443846A CA2443846A CA2443846A1 CA 2443846 A1 CA2443846 A1 CA 2443846A1 CA 002443846 A CA002443846 A CA 002443846A CA 2443846 A CA2443846 A CA 2443846A CA 2443846 A1 CA2443846 A1 CA 2443846A1
Authority
CA
Canada
Prior art keywords
aryl
unsaturated
group
phenylethynyl
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002443846A
Other languages
English (en)
Inventor
Paul G. Apen
Kreisler Lau
Boris A. Korolev
Nancy Iwamoto
Bo Li
Brian Bedwell
Rusian Zherebin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2443846A1 publication Critical patent/CA2443846A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/16—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

L'invention concerne une composition comprenant: (a) un composant thermodurcissable comprenant un monomère ayant la structure (I) et un dimère ayant la structure (II), ou un mélange du monomère et du dimère, où Y est sélectionné à partir d'un composé cage; R¿1?, R¿2?, R¿3?, R¿4, ?R¿5?, et R¿6 ? sont sélectionnés, indépendamment, à partir d'un aryle, aryle ramifié et éther d'arylène ; au moins l'un des groupes aryle, aryle ramifié et éther d'arylène étant un groupe éthynyle ; R¿7? désigne un aryle ou un aryle substitué ; et au moins l'un des R¿1?, R¿2?, R¿3?, R¿4, ?R¿5?, et R¿6? comprend au moins deux isomères ; (b) un promoteur d'adhérence comprenant un composé ayant au moins une bifonctionnalité, cette dernière pouvant être la même ou différente, la première fonctionnalité étant capable d'entrer en interaction avec le composant thermodurcissable (a) et la seconde fonctionnalité étant capable d'entrer en interaction avec un substrat lorsque la composition est appliquée sur un substrat. La composition selon l'invention est utilisée notamment comme matériau diélectrique pour des applications en micro-électronique.
CA002443846A 2001-12-31 2001-12-31 Compositions organiques Abandoned CA2443846A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/050182 WO2003057749A1 (fr) 2001-12-31 2001-12-31 Compositions organiques

Publications (1)

Publication Number Publication Date
CA2443846A1 true CA2443846A1 (fr) 2003-07-17

Family

ID=21743166

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002443846A Abandoned CA2443846A1 (fr) 2001-12-31 2001-12-31 Compositions organiques

Country Status (6)

Country Link
EP (1) EP1461370A1 (fr)
JP (1) JP2005514479A (fr)
KR (1) KR20040068857A (fr)
CN (1) CN1494559A (fr)
CA (1) CA2443846A1 (fr)
WO (1) WO2003057749A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7531209B2 (en) 2005-02-24 2009-05-12 Michael Raymond Ayers Porous films and bodies with enhanced mechanical strength
JP2007031663A (ja) * 2005-07-29 2007-02-08 Fujifilm Corp 膜形成用組成物、それを用いて形成された絶縁膜及び電子デバイス
US7919188B2 (en) 2006-05-31 2011-04-05 Roskilde Semiconductor Llc Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials
US7875315B2 (en) 2006-05-31 2011-01-25 Roskilde Semiconductor Llc Porous inorganic solids for use as low dielectric constant materials
WO2007143029A1 (fr) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Matériaux poreux dérivés de composites polymères
US7790234B2 (en) 2006-05-31 2010-09-07 Michael Raymond Ayers Low dielectric constant materials prepared from soluble fullerene clusters
JP2008109061A (ja) * 2006-09-29 2008-05-08 Matsushita Electric Ind Co Ltd リード、配線部材、パッケージ部品、樹脂付金属部品及び樹脂封止半導体装置、並びにこれらの製造方法
US7638566B2 (en) * 2006-10-30 2009-12-29 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) compositions
GB2451865A (en) 2007-08-15 2009-02-18 Univ Liverpool Microporous polymers from alkynyl monomers
JP2010077395A (ja) * 2008-08-25 2010-04-08 Sumitomo Bakelite Co Ltd 絶縁膜用重合体及びその重合方法、絶縁膜ならびに電子デバイス
JP7110090B2 (ja) * 2018-12-28 2022-08-01 東京エレクトロン株式会社 基板処理方法および基板処理システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6423811B1 (en) * 2000-07-19 2002-07-23 Honeywell International Inc. Low dielectric constant materials with polymeric networks

Also Published As

Publication number Publication date
CN1494559A (zh) 2004-05-05
EP1461370A1 (fr) 2004-09-29
JP2005514479A (ja) 2005-05-19
KR20040068857A (ko) 2004-08-02
WO2003057749A1 (fr) 2003-07-17

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