CA2342726C - Apparatus and method for assembling optical devices - Google Patents
Apparatus and method for assembling optical devices Download PDFInfo
- Publication number
- CA2342726C CA2342726C CA002342726A CA2342726A CA2342726C CA 2342726 C CA2342726 C CA 2342726C CA 002342726 A CA002342726 A CA 002342726A CA 2342726 A CA2342726 A CA 2342726A CA 2342726 C CA2342726 C CA 2342726C
- Authority
- CA
- Canada
- Prior art keywords
- protrusions
- substrate
- mounting structure
- well
- adhesive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- H10W70/68—
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- H10W72/073—
-
- H10W72/07327—
-
- H10W72/07337—
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- H10W72/07353—
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- H10W72/334—
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- H10W72/354—
-
- H10W72/931—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/542,937 | 2000-04-04 | ||
| US09/542,937 US6404566B1 (en) | 2000-04-04 | 2000-04-04 | Apparatus and method for assembling optical devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2342726A1 CA2342726A1 (en) | 2001-10-03 |
| CA2342726C true CA2342726C (en) | 2006-02-07 |
Family
ID=24165906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002342726A Expired - Fee Related CA2342726C (en) | 2000-04-04 | 2001-04-02 | Apparatus and method for assembling optical devices |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6404566B1 (enExample) |
| EP (1) | EP1143519A3 (enExample) |
| JP (1) | JP2002014264A (enExample) |
| CN (1) | CN1255692C (enExample) |
| CA (1) | CA2342726C (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1271723C (zh) * | 2001-05-09 | 2006-08-23 | 新电元工业株式会社 | 半导体装置及其制造方法 |
| US20040161220A1 (en) * | 2002-09-09 | 2004-08-19 | Adc Telecommunications, Inc. | Method for face-mounting optical components and devices using same |
| US20040169926A1 (en) * | 2002-09-10 | 2004-09-02 | Adc Telecommunications, Inc. | Module assembly for fiber optic isolator |
| US6805786B2 (en) | 2002-09-24 | 2004-10-19 | Northrop Grumman Corporation | Precious alloyed metal solder plating process |
| US6998721B2 (en) | 2002-11-08 | 2006-02-14 | Stmicroelectronics, Inc. | Stacking and encapsulation of multiple interconnected integrated circuits |
| DE102006028692B4 (de) | 2006-05-19 | 2021-09-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium |
| CN101382696B (zh) * | 2007-09-07 | 2010-08-25 | 群康科技(深圳)有限公司 | 光学膜片自动组装系统和光学膜片自动组装方法 |
| JP2010008901A (ja) * | 2008-06-30 | 2010-01-14 | Fujitsu Ltd | 光学部品の接着面構造 |
| US8836100B2 (en) | 2009-12-01 | 2014-09-16 | Cisco Technology, Inc. | Slotted configuration for optimized placement of micro-components using adhesive bonding |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6114828A (ja) * | 1984-06-29 | 1986-01-23 | Omron Tateisi Electronics Co | ミラ−の精密取付方法 |
| JPH02310510A (ja) * | 1989-05-26 | 1990-12-26 | Fujitsu Ltd | 光学デバイス |
| GB2233152A (en) * | 1989-06-10 | 1991-01-02 | Plessey Co Plc | Bonding a device to a substrate |
| US5607488A (en) * | 1990-05-21 | 1997-03-04 | Wiand; Ronald C. | Molded abrasive article and process |
| JPH0545543A (ja) * | 1991-08-08 | 1993-02-23 | Japan Steel Works Ltd:The | 光部品固定方法 |
| JP2976642B2 (ja) * | 1991-11-07 | 1999-11-10 | 日本電気株式会社 | 光結合回路 |
| JPH0851143A (ja) * | 1992-07-20 | 1996-02-20 | Nikon Corp | 基板保持装置 |
| KR960011655B1 (en) * | 1993-04-20 | 1996-08-24 | Hyundai Electronics Ind | Dram cell capacitor and the method |
| GB2310052B (en) * | 1996-02-08 | 2000-01-19 | Northern Telecom Ltd | Securing an optical fibre in a v-groove |
| US5838703A (en) | 1996-09-30 | 1998-11-17 | Motorola, Inc. | Semiconductor laser package with power monitoring system and optical element |
| US5905750A (en) | 1996-10-15 | 1999-05-18 | Motorola, Inc. | Semiconductor laser package and method of fabrication |
| US5757561A (en) | 1996-11-26 | 1998-05-26 | Newport Corporation | Precision optical mounts |
| US6223103B1 (en) * | 1997-11-12 | 2001-04-24 | Lear Automotive Dearborn, Inc. | Driver display with highlighted images |
-
2000
- 2000-04-04 US US09/542,937 patent/US6404566B1/en not_active Expired - Fee Related
-
2001
- 2001-03-26 EP EP01302771A patent/EP1143519A3/en not_active Withdrawn
- 2001-04-02 CA CA002342726A patent/CA2342726C/en not_active Expired - Fee Related
- 2001-04-03 CN CNB011124253A patent/CN1255692C/zh not_active Expired - Fee Related
- 2001-04-04 JP JP2001105787A patent/JP2002014264A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US6404566B1 (en) | 2002-06-11 |
| CA2342726A1 (en) | 2001-10-03 |
| CN1316657A (zh) | 2001-10-10 |
| EP1143519A2 (en) | 2001-10-10 |
| CN1255692C (zh) | 2006-05-10 |
| JP2002014264A (ja) | 2002-01-18 |
| EP1143519A3 (en) | 2007-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |