CA2187316C - Bande adhesive autocollante, antistatique resistant a de hautes temperatures - Google Patents

Bande adhesive autocollante, antistatique resistant a de hautes temperatures Download PDF

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Publication number
CA2187316C
CA2187316C CA002187316A CA2187316A CA2187316C CA 2187316 C CA2187316 C CA 2187316C CA 002187316 A CA002187316 A CA 002187316A CA 2187316 A CA2187316 A CA 2187316A CA 2187316 C CA2187316 C CA 2187316C
Authority
CA
Canada
Prior art keywords
acrylate
vinyl
adhesive tape
sensitive adhesive
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002187316A
Other languages
English (en)
Other versions
CA2187316A1 (fr
Inventor
Gustav Gutman
Steven D. Yau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Priority claimed from PCT/US1995/003381 external-priority patent/WO1995030720A1/fr
Publication of CA2187316A1 publication Critical patent/CA2187316A1/fr
Application granted granted Critical
Publication of CA2187316C publication Critical patent/CA2187316C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Une bande adhésive autocollante, antistatique, résistant à la chaleur comprend un substrat revêtu d'un adhésif microparticulaire ayant un diamètre moyen d'au moins un micromètre. Les microparticules sont pourvues sur leur surface d'un matériau conducteur ionique obtenu à partir d'un polymère à base d'électrolytes polymères, et d'au moins un sel ionique sélectionné dans le groupe composé de sels de métaux alcalins et de sels de métaux alcalino-terreux. Cet adhésif est collé sur le substrat à l'aide d'une composition d'amorce, cette amorce comprenant au moins une résine phénolique et au moins un composé du caoutchouc, et la bande adhésive pouvant supporter une immersion dans un métal d'apport fondu pendant au moins 5 secondes.
CA002187316A 1994-05-06 1995-03-16 Bande adhesive autocollante, antistatique resistant a de hautes temperatures Expired - Fee Related CA2187316C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23930994A 1994-05-06 1994-05-06
US08/239309 1994-05-06
PCT/US1995/003381 WO1995030720A1 (fr) 1994-05-06 1995-03-16 Bande adhesive autocollante, antistatique resistant a de hautes temperatures

Publications (2)

Publication Number Publication Date
CA2187316A1 CA2187316A1 (fr) 1995-11-16
CA2187316C true CA2187316C (fr) 2007-03-13

Family

ID=38007981

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002187316A Expired - Fee Related CA2187316C (fr) 1994-05-06 1995-03-16 Bande adhesive autocollante, antistatique resistant a de hautes temperatures

Country Status (1)

Country Link
CA (1) CA2187316C (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112608405A (zh) * 2020-12-15 2021-04-06 深圳市撒比斯科技有限公司 一种粘合剂用聚合物及其应用

Also Published As

Publication number Publication date
CA2187316A1 (fr) 1995-11-16

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed

Effective date: 20130318