CA2163033C - A film bulk acoustic wave device - Google Patents
A film bulk acoustic wave device Download PDFInfo
- Publication number
- CA2163033C CA2163033C CA 2163033 CA2163033A CA2163033C CA 2163033 C CA2163033 C CA 2163033C CA 2163033 CA2163033 CA 2163033 CA 2163033 A CA2163033 A CA 2163033A CA 2163033 C CA2163033 C CA 2163033C
- Authority
- CA
- Canada
- Prior art keywords
- acoustic wave
- bulk acoustic
- wave device
- thin film
- piezoelectric ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Embodiments of the present invention provide a small and well-characterized bulk acoustic wave device by fabricating a filter having a wide band width or a resonator having a wide oscillation frequency range together with a semiconductor circuit. In embodiments of the present invention, a bulk acoustic wave device comprises a semiconductor substrate having a dielectric substance layer thereon, the dielectric substance layer has a ground conductor layer thereon, the ground conductor layer has a piezoelectric ceramic thin film thereon and the piezoelectric ceramic thin film has a conductive electrode pattern thereon. The thickness of the piezoelectric ceramic thin film is more than ten times the thickness of the ground conductor layer, and the wave number of acoustic waves that propagate in a direction parallel to a surface of the piezoelectric ceramic thin film multiplied by the thickness of the piezoelectric ceramic thin film is less than 2.
Claims (43)
1. A film bulk acoustic wave device comprising:
a semiconductor substrate;
a ground conductor layer mounted on the semiconductor substrate;
a piezoelectric ceramic thin film mounted on the ground conductor layer; and a conductive electrode pattern mounted on the piezoelectric ceramic thin film;
wherein the piezoelectric ceramic thin film has a piezoelectric section processed by a polarization process and a dielectric section that has not been processed by the polarization process.
a semiconductor substrate;
a ground conductor layer mounted on the semiconductor substrate;
a piezoelectric ceramic thin film mounted on the ground conductor layer; and a conductive electrode pattern mounted on the piezoelectric ceramic thin film;
wherein the piezoelectric ceramic thin film has a piezoelectric section processed by a polarization process and a dielectric section that has not been processed by the polarization process.
2. The film bulk acoustic wave device of claim 1:
wherein the ground conductor layer has a thickness;
wherein the piezoelectric ceramic thin film has a thickness; and wherein the thickness of the piezoelectric ceramic thin film is more than 10 times the thickness of the ground conductor layer.
wherein the ground conductor layer has a thickness;
wherein the piezoelectric ceramic thin film has a thickness; and wherein the thickness of the piezoelectric ceramic thin film is more than 10 times the thickness of the ground conductor layer.
3. The film bulk acoustic wave device of claim 1:
wherein the piezoelectric ceramic thin film has a thickness; and wherein the piezoelectric ceramic thin film generates an acoustic wave propagated in a direction parallel to a surface of the piezoelectric ceramic thin film and a wave number of the acoustic waves is less than 2 divided by the thickness of the piezoelectric ceramic thin film.
wherein the piezoelectric ceramic thin film has a thickness; and wherein the piezoelectric ceramic thin film generates an acoustic wave propagated in a direction parallel to a surface of the piezoelectric ceramic thin film and a wave number of the acoustic waves is less than 2 divided by the thickness of the piezoelectric ceramic thin film.
4. The film bulk acoustic wave device of claim 1 further comprising:
a semiconductor circuit formed on the semiconductor substrate;
wherein the piezoelectric ceramic thin film constitutes a first piezoelectric ceramic thin film; and wherein the semiconductor circuit includes at least one component having a second piezoelectric ceramic thin film formed with the first piezoelectric ceramic thin film.
a semiconductor circuit formed on the semiconductor substrate;
wherein the piezoelectric ceramic thin film constitutes a first piezoelectric ceramic thin film; and wherein the semiconductor circuit includes at least one component having a second piezoelectric ceramic thin film formed with the first piezoelectric ceramic thin film.
5. The film bulk acoustic wave device of claim 1 wherein the dielectric section is used as a part of a capacitive reactance device.
6. The film bulk acoustic wave device of claim 4 wherein the semiconductor circuit is an inductive reactance device.
7. The film bulk acoustic wave device of claim 1 further comprising:
a semiconductor circuit mounted on the semiconductor substrate;
a polarization connection circuit connected to the ground conductor layer and the conduction electrode pattern for applying an electric potential to polarize the piezoelectric ceramic thin film; and a protective circuit connected to the polarization circuit and the semiconductor circuit for protecting the semiconductor circuit from the electric potential.
a semiconductor circuit mounted on the semiconductor substrate;
a polarization connection circuit connected to the ground conductor layer and the conduction electrode pattern for applying an electric potential to polarize the piezoelectric ceramic thin film; and a protective circuit connected to the polarization circuit and the semiconductor circuit for protecting the semiconductor circuit from the electric potential.
8. The film bulk acoustic wave device of claim 1 further comprising:
a plurality of reactance devices mounted on the semiconductor substrate; and a means for selectively connecting each of the plurality of reactance devices in a circuit with the ground conductor layer and the conductive electrode pattern.
a plurality of reactance devices mounted on the semiconductor substrate; and a means for selectively connecting each of the plurality of reactance devices in a circuit with the ground conductor layer and the conductive electrode pattern.
9. The film bulk acoustic wave device of claim 1 further comprising:
an active device circuit that provides a variable capacitive reactance, mounted on the semiconductor substrate and connected to the ground conductor layer and the conductive electrode pattern.
an active device circuit that provides a variable capacitive reactance, mounted on the semiconductor substrate and connected to the ground conductor layer and the conductive electrode pattern.
10. The film bulk acoustic wave device of claim 8, wherein at least one of the plurality of reactance devices includes a second piezoelectric ceramic thin film formed with the first piezoelectric ceramic thin film.
11. The film bulk acoustic wave device of claim 7, wherein the protective circuit has a capacitive reactance connected in series between the semiconductor circuit and at least one of the ground conductor layer and the conductive electrode pattern.
12. The film bulk acoustic wave device of claim 7, wherein the semiconductor circuit has a ground potential electrode, and wherein the protective circuit includes a ground connection circuit for connecting a first one of the conductive electrode pattern and the ground conductor layer to the ground potential electrode of the semiconductor circuit and a disconnection circuit for disconnecting a second one of the conductive electrode pattern and the ground conductor layer from the ground potential electrode of the semiconductor circuit when the electric potential is applied, and wherein the polarization connection circuit applies a direct current voltage for polarization to the second one of the conductive electrode pattern and the ground conductor.
13. The film bulk acoustic wave device of claim 7, wherein the semiconductor circuit has a ground potential electrode, and wherein the protective circuit includes a ground connection circuit for connecting a first one of the conductive electrode pattern and the ground conductor to the ground potential electrode of the semiconductor circuit when the electric potential is applied and includes a resistance between a second one of the conductive electrode pattern and the ground conductor layer and the polarization connection circuit a resistance, wherein the resistance has a larger resistance value than that of a resistance device in the semiconductor circuit between the polarization connection circuit and the ground potential electrode of the semiconductor circuit.
14. The film bulk acoustic wave device of claim 7, wherein the polarization connection circuit is provided for a plurality of film bulk acoustic wave devices.
15. The film bulk acoustic wave device of claim 14, wherein the polarization circuit has one of a first line to electrically couple a plurality of the ground conductor layers and a second line to electrically couple a plurality of the conductive electrode patterns.
16. The film bulk acoustic wave device of claim 15, wherein the first and second lines have a characteristic impedance of more than 50 .OMEGA..
17. The film bulk acoustic wave device of claim 15, wherein the first and second lines have a resistance of more than 50 .OMEGA..
18. The film bulk acoustic wave device of claim 9, wherein the active device circuit has an active device, a plurality of resistance devices, and a means for selectively connecting each of the plurality of resistance devices between the active device and one of the ground conductor layer and the conductive electrode pattern.
19. The film bulk acoustic wave device of claims 8 or 18, wherein the means for selectively connecting includes means for connecting devices in series.
20. The film bulk acoustic wave device of claims 8 or 18, wherein the means for selectively connecting includes means for connecting devices in parallel.
21. The film bulk acoustic wave device of claims 8 or 18, wherein the means for selectively connecting includes wire bonds connected to selected devices.
22. The film bulk acoustic wave device of claims 8 or 18, wherein the means for selectively connecting includes a mask for producing an electrode connected to selected devices.
23. The film bulk acoustic wave device of claims 8 or 18, wherein the means for selectively connecting includes means for cutting an electrode pattern connected to selected devices.
24. The film bulk acoustic wave device of claim 1, 3, 4, 5, 8 or 9, wherein the ground conductor layer has a thickness and the piezoelectric ceramic thin film has a thickness and the thickness of the piezoelectric ceramic thin film is more than 10 times the thickness of the ground conductor layer.
25. The film bulk acoustic wave device of claim 1, 2, 4, 5, 8 or 9, wherein the piezoelectric ceramic thin film has a thickness and wherein the piezoelectric ceramic thin film generates an acoustic wave to propagate in a direction parallel to a surface of the piezoelectric ceramic thin film and a number of acoustic waves is less than 2 divided by the thickness of the piezoelectric thin film.
26. The film bulk acoustic wave device of claim 1, 2, 3, 4, 5, 8 or 9, wherein the piezoelectric ceramic thin film is comprised of one of lead titanate and lead titanate-zirconate.
27. The film bulk acoustic wave device of claim 26, wherein the semiconductor substrate is comprised of one of silicon and gallium arsenide.
28. The film bulk acoustic wave device of claim 26, further comprising at least one of a semiconductor circuit, an active circuit device and a passive circuit device on the semiconductor substrate, so as to configure an electronic system.
29. The film bulk acoustic wave device of claim 26, further comprising a dielectric substance layer between the semiconductor substrate and the ground conductor layer.
30. The film bulk acoustic wave device of claim 27, wherein the ground conductor layer uses at least one of platinum and gold.
31. The film bulk acoustic wave device of claim 30, wherein the ground conductor layer uses one of titanium and tungsten.
32. The film bulk acoustic wave device of claim 31, wherein the conductive electrode pattern uses one of a metal, a conductive semiconductor layer and a conductive material.
33. The piezoelectric thin film of claim 29, wherein the piezoelectric ceramic thin film is mounted on a part of the dielectric substance layer.
34. The film bulk acoustic wave device of claim 29, wherein the dielectric substance layer is mainly composed of one of silicon oxide, silicon nitride and tantalum oxide.
35. A film bulk acoustic wave device comprising:
a semiconductor substrate;
a ground conductor layer mounted on the semiconductor substrate;
a first piezoelectric ceramic thin film mounted on the ground conductor layer;
a conductive electrode pattern mounted on the piezoelectric ceramic thin film;
and a semiconductor circuit formed on the semiconductor substrate;
wherein the semiconductor circuit includes at least one component having a second piezoelectric ceramic thin film formed with the first piezoelectric ceramic thin film;
wherein the semiconductor circuit is an inductive reactance device; and wherein an electrical characteristic of the inductive reactance device is based upon a shape of the piezoelectric ceramic thin film and a shape of the conductive electrode pattern.
a semiconductor substrate;
a ground conductor layer mounted on the semiconductor substrate;
a first piezoelectric ceramic thin film mounted on the ground conductor layer;
a conductive electrode pattern mounted on the piezoelectric ceramic thin film;
and a semiconductor circuit formed on the semiconductor substrate;
wherein the semiconductor circuit includes at least one component having a second piezoelectric ceramic thin film formed with the first piezoelectric ceramic thin film;
wherein the semiconductor circuit is an inductive reactance device; and wherein an electrical characteristic of the inductive reactance device is based upon a shape of the piezoelectric ceramic thin film and a shape of the conductive electrode pattern.
36. The film bulk acoustic wave device of claim 35, wherein an electrical characteristic of the inductive reactance device is based upon a shape of the ground conductor layer.
37. A method of manufacturing a film bulk acoustic wave device comprising the steps of:
(a) forming a ground conductor layer on a semiconductor substrate;
(b) forming a piezoelectric ceramic thin film of one of lead titanate and lead titanate-zirconate on the ground conductor layer;
(c) forming a conductive electrode pattern on the piezoelectric ceramic thin film; and (d) polarizing only part of the piezoelectric ceramic thin film.
(a) forming a ground conductor layer on a semiconductor substrate;
(b) forming a piezoelectric ceramic thin film of one of lead titanate and lead titanate-zirconate on the ground conductor layer;
(c) forming a conductive electrode pattern on the piezoelectric ceramic thin film; and (d) polarizing only part of the piezoelectric ceramic thin film.
38. The method of manufacturing the film bulk acoustic wave device of claim 37, further comprising the step of forming a dielectric substance layer by layering one of silicon oxide, silicon nitride, and tantalum oxide between the semiconductor substrate and the ground conductor layer.
39. The method of manufacturing the film bulk acoustic wave device of claim 37, wherein the step of forming the ground conductor layer includes the step of setting a thickness of the ground conductor layer, and the step of forming the piezoelectric ceramic thin film includes the step of setting the thickness of the piezoelectric ceramic thin film to be more that ten times the thickness of the ground conductor layer.
40. The method of manufacturing the film bulk acoustic wave device of claim 37, wherein the step of forming the piezoelectric ceramic thin film includes the step of forming the piezoelectric ceramic thin film wherein a product of a thickness of the piezoelectric ceramic thin film and a number of acoustic waves to propagate in a direction parallel to a surface of the piezoelectric ceramic thin film is less than 2.
41. The method of manufacturing the film bulk acoustic wave device of claim 37, further comprising the step of forming a semiconductor circuit by using a part of the piezoelectric ceramic thin film.
42. The method of manufacturing the film bulk acoustic wave device of claim 37, further comprising the step of forming a semiconductor circuit on the semiconductor substrate, the step of polarizing the piezoelectric ceramic thin film, and the step of protecting the semiconductor circuit during the polarization process.
43. The method of manufacturing the film bulk acoustic wave device of claim 37, further comprising the step of forming a plurality of devices to adjust a characteristic of the film bulk acoustic wave device, and the step of adjusting the characteristic of the film bulk acoustic wave device by selectively connecting devices of the plurality of devices.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06-289804 | 1994-11-24 | ||
| JP6289804A JPH08148968A (en) | 1994-11-24 | 1994-11-24 | Thin film piezoelectric element |
| JP28062895A JP3371050B2 (en) | 1995-10-27 | 1995-10-27 | Thin film piezoelectric element |
| JP07-280628 | 1995-10-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2163033A1 CA2163033A1 (en) | 1996-05-25 |
| CA2163033C true CA2163033C (en) | 2000-01-25 |
Family
ID=26553860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2163033 Expired - Fee Related CA2163033C (en) | 1994-11-24 | 1995-11-17 | A film bulk acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2163033C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022134196A1 (en) * | 2020-12-25 | 2022-06-30 | 杭州左蓝微电子技术有限公司 | Thin-film bulk acoustic wave resonator, fabrication method therefor, and filter |
-
1995
- 1995-11-17 CA CA 2163033 patent/CA2163033C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022134196A1 (en) * | 2020-12-25 | 2022-06-30 | 杭州左蓝微电子技术有限公司 | Thin-film bulk acoustic wave resonator, fabrication method therefor, and filter |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2163033A1 (en) | 1996-05-25 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |