CA2051542A1 - Methode et dispositif de generation de faisceaux laser multi-impulsion et methode et appareil d'usinage par faisceau laser multi-impulsion - Google Patents

Methode et dispositif de generation de faisceaux laser multi-impulsion et methode et appareil d'usinage par faisceau laser multi-impulsion

Info

Publication number
CA2051542A1
CA2051542A1 CA2051542A CA2051542A CA2051542A1 CA 2051542 A1 CA2051542 A1 CA 2051542A1 CA 2051542 A CA2051542 A CA 2051542A CA 2051542 A CA2051542 A CA 2051542A CA 2051542 A1 CA2051542 A1 CA 2051542A1
Authority
CA
Canada
Prior art keywords
laser beam
pulse
pulse laser
delayed
separated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2051542A
Other languages
English (en)
Other versions
CA2051542C (fr
Inventor
Makoto Yano
Kouji Kuwabara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2051542A1 publication Critical patent/CA2051542A1/fr
Application granted granted Critical
Publication of CA2051542C publication Critical patent/CA2051542C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
CA002051542A 1990-09-19 1991-09-17 Methode et dispositif de generation de faisceaux laser multi-impulsion et methode et appareil d'usinage par faisceau laser multi-impulsion Expired - Fee Related CA2051542C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24697690 1990-09-19
JP02-246976 1990-09-19

Publications (2)

Publication Number Publication Date
CA2051542A1 true CA2051542A1 (fr) 1992-03-20
CA2051542C CA2051542C (fr) 1995-01-10

Family

ID=17156521

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002051542A Expired - Fee Related CA2051542C (fr) 1990-09-19 1991-09-17 Methode et dispositif de generation de faisceaux laser multi-impulsion et methode et appareil d'usinage par faisceau laser multi-impulsion

Country Status (4)

Country Link
US (1) US5293389A (fr)
CN (2) CN1022361C (fr)
CA (1) CA2051542C (fr)
TW (1) TW207588B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112014824A (zh) * 2019-05-31 2020-12-01 深圳市速腾聚创科技有限公司 一种多脉冲抗干扰信号处理方法及装置

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WO1995026517A1 (fr) * 1992-11-10 1995-10-05 United States Department Of Energy Procede de mise en forme d'une impulsion de faisceau laser
JP3162255B2 (ja) * 1994-02-24 2001-04-25 三菱電機株式会社 レーザ加工方法及びその装置
US5878067A (en) * 1994-08-10 1999-03-02 Fanuc Ltd. Laser oscillator
TW284907B (en) * 1995-06-07 1996-09-01 Cauldron Lp Removal of material by polarized irradiation and back side application for radiation
FR2737814B1 (fr) * 1995-08-11 1997-09-12 Soc D Production Et De Rech Ap Procede et dispositif de commande d'une source laser a plusieurs modules laser pour optimiser le traitement de surface par laser
DE69739862D1 (de) * 1996-08-22 2010-06-10 Fujitsu Ltd Faseroptisches Übertragungssystem mit optischer Phasenkonjugation
JP3213882B2 (ja) * 1997-03-21 2001-10-02 住友重機械工業株式会社 レーザ加工装置及び加工方法
US6181728B1 (en) * 1998-07-02 2001-01-30 General Scanning, Inc. Controlling laser polarization
US6541731B2 (en) * 2000-01-25 2003-04-01 Aculight Corporation Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates
US6433303B1 (en) * 2000-03-31 2002-08-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus using laser pulses to make an array of microcavity holes
US6490299B1 (en) 2000-07-20 2002-12-03 Troitski Method and laser system for generating laser radiation of specific temporal shape for production of high quality laser-induced damage images
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
DE10145184B4 (de) * 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske
CN100355031C (zh) 2002-03-12 2007-12-12 浜松光子学株式会社 基板的分割方法
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
US6947454B2 (en) * 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US7511247B2 (en) * 2004-03-22 2009-03-31 Panasonic Corporation Method of controlling hole shape during ultrafast laser machining by manipulating beam polarization
US20070230882A1 (en) * 2004-07-22 2007-10-04 Rainer Hainberger All-optical polarization rotation switch using a loop configuration
AT414285B (de) * 2004-09-28 2006-11-15 Femtolasers Produktions Gmbh Mehrfachreflexions-verzögerungsstrecke für einen laserstrahl sowie resonator bzw. kurzpuls-laservorrichtung mit einer solchen verzögerungsstrecke
JP4527488B2 (ja) * 2004-10-07 2010-08-18 株式会社ディスコ レーザ加工装置
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
US7807938B2 (en) * 2006-06-22 2010-10-05 Sabic Innovative Plastics Ip B.V. Mastering tools and systems and methods for forming a plurality of cells on the mastering tools
JP4141485B2 (ja) * 2006-07-19 2008-08-27 トヨタ自動車株式会社 レーザ加工システムおよびレーザ加工方法
DE202006016155U1 (de) * 2006-10-21 2006-12-21 Mühlbauer Ag Vorrichtung zum Anordnen von Durchgangsöffnungen in einem fortbewegbaren Band
CN100451730C (zh) * 2007-01-12 2009-01-14 中国科学院上海光学精密机械研究所 脉冲间隔可调的线偏振激光双脉冲的分束装置及分束方法
US20090080467A1 (en) * 2007-09-24 2009-03-26 Andrei Starodoumov Pulse repetition frequency-multipler for fiber lasers
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
CN103578943B (zh) * 2012-07-25 2017-05-31 上海微电子装备有限公司 一种激光退火装置及激光退火方法
CN103825183B (zh) * 2014-01-08 2016-06-08 北京工业大学 一种光脉冲增频器
GB2529808B (en) * 2014-08-26 2018-07-25 M Solv Ltd Apparatus and methods for performing laser ablation on a substrate
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
CN104300352B (zh) * 2014-10-16 2017-04-26 北京工业大学 一种光脉冲重复频率扩频器
JP6817716B2 (ja) * 2015-09-03 2021-01-20 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
US10444526B2 (en) 2016-08-01 2019-10-15 The Regents Of The University Of California Optical pulse combiner comprising diffractive optical elements
JP7503764B2 (ja) * 2019-12-13 2024-06-21 パナソニックＩｐマネジメント株式会社 レーザ装置およびレーザ装置の制御方法
CN111702347A (zh) * 2020-05-27 2020-09-25 江苏大学 一种激光精密加工纤维增强复合材料的装置和方法

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Publication number Priority date Publication date Assignee Title
CN112014824A (zh) * 2019-05-31 2020-12-01 深圳市速腾聚创科技有限公司 一种多脉冲抗干扰信号处理方法及装置

Also Published As

Publication number Publication date
CN1078186A (zh) 1993-11-10
CA2051542C (fr) 1995-01-10
CN1061874A (zh) 1992-06-10
TW207588B (fr) 1993-06-11
CN1022361C (zh) 1993-10-06
US5293389A (en) 1994-03-08
CN1034112C (zh) 1997-02-26

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