CA2028110A1 - Flat connection production process - Google Patents
Flat connection production processInfo
- Publication number
- CA2028110A1 CA2028110A1 CA 2028110 CA2028110A CA2028110A1 CA 2028110 A1 CA2028110 A1 CA 2028110A1 CA 2028110 CA2028110 CA 2028110 CA 2028110 A CA2028110 A CA 2028110A CA 2028110 A1 CA2028110 A1 CA 2028110A1
- Authority
- CA
- Canada
- Prior art keywords
- studs
- pad
- pads
- conductive
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Multi-Conductor Connections (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PROCEDE DE REALISATION D'UNE CONNEXION A PLAT Le procédé a pour but d'améliorer les connexions à plat, en vue de diminuer sensiblement la résistance de contact dans ces dernières, généralement importante en raison de défauts de planéité des plages conductrices en vis-à-vis. Il consiste à former sur une première plage conductrice (10) destinée à entrer en contact dans une connexion à plat avec une seconde plage conductrice, un état de surface faisant apparaître une pluralité de plots (12) régulièrement répartis, puis à appliquer en vis-à-vis et à serrer les deux plages, de manière à établir un contact entre chaque plot et la seconde plage. Applications particulièrement intéressantes aux connexions pour courants forts et aux connexions de lignes rubans en VHF et en hyperfréquence. Figure 1PROCESS FOR MAKING A FLAT CONNECTION The aim of the method is to improve the flat connections, with a view to significantly reducing the contact resistance in the latter, generally significant due to the flatness of the conductive areas facing each other. -screw. It consists of forming on a first conductive pad (10) intended to come into contact in a flat connection with a second conductive pad, a surface condition revealing a plurality of studs (12) regularly distributed, then to be applied visually. opposite and tightening the two pads, so as to establish contact between each pad and the second pad. Particularly interesting applications to connections for strong currents and to VHF and microwave line ribbon connections. Figure 1
Description
; ` 2028110 PROCEDE DE REALISATION
D'UNE CONNEXION A PLAT
La présente invention concerne un procédé de connexion applicable pour réaliser toute connexion à plat entre 5 deux organes rigides ou flexibles.
Actuellement, les connexions à plat sont realisées en mettant en vis-à-vis des zones de connexion constituées de plages conductrices planes pourvues ou non de protection de surface telle que dorure ou étamage, et en maintenant le~dites 10 plages conductrlces en contact par un moyen de serrage approprié. Ce type de connexion est utilisé, par exemple, pour relier des conducteur~ sous forme de rubans (communément appelés "strip line") entre eux ou à une carte de circuit imprimé .
La quallté de ces connexions dépend bien sûr de l'état .
de surface des plages conductrices destinées à venir en contact.
En pratique, leur planélté est le plus souvent très approximative, notamment celle des cartes de circuit imprimé
qui, de façon inhérente, présentent des ondulations 20 superficielles. Il en résulte des connexion~ de qualité médiocre ,; qul se caractérisent par des résistances de contact importantss.
L'invention a pour objet de pallier cet inconvénient par un procédé très simple à mettre en oeuvre et permettant de réaliser une seule liaison électrique adaptée plus généralement à des connexions de puissance ou des connexions de lignes 25 rubans.
Ce procédé consiste à former une premlère plage conductrhe destinée à entrer en contact dans une connexion à
plat avec une seconde plage conductrice senslblement plane, un état de surface faisant apparaître à partir d'une base 30 sensiblement plane une pluralité de plot3 de même hauteur régullèremsnt répartis, puls à appllquer en vi~-à-vl~ et à
serrer les première et seconde plages conductrice~, de manière à
202~
établir un contact entre le sommet de chaque plot et la surface de la seconde plage.
L'invention sera mieux comprise à l'aide des explications qul vont suivre et des dessins 30ints, parml 5 lesquels:
la figure 1 montre partiellement une plsge conductrics comportant des plots en vue d'une connexion selon le procéd~ de l'invention, et la flgure 2 est une vue similaire à la figure 1 lO illustrant un autre type de plots.
Les plages conductrices 10 représentées aux flgures 1 et 2 ~ont les extrémités d'un conducteur en ruban, généralement en cuivre, appllqué sur un substrat 11. Ce dernier peut être rigide, tel qu'une carte de circuit Imprimé, par exemple. Il 15 peut également être nexible, notamment dans le ca~ d'une llgne ruban ou "strlp line", la plage 10 pouvant alors être l'extrémité de l'une de plusleurs pistes parallèles. ~' Conformément à l'invention, à la surface de la plage 10 qui est sensiblement plane, sont formés dan~ la masse des 20 plots 12 en forme de pastil'ies cylindrique~ qul sont allgnés en colonnes et en rangées En variante, les plots 12 peuvent être arrangé~ en quinconce ou selon toute autre répartition régullère, fonction, ain~i que leur nombre, de la géométrie de la plage. Dans un exemple de réalisatlon, pour une liaison 25 électrique, le nombre de plots est, par exemple, de 20 et le courant est, par exemple de 5 kA.
A titre indicatif, on peut donner aux plots 12 une hauteur comprise, selon les cas, entre quelques centièmes et quelque~ - dizaines de millimètre pour un dlamètre et un 30 écartement de l'ordre de quelque~ dizaines de millimètre. Des essais ont été effectués en formant des plots de 50 ,um de hauteur et 0,7 mm de diamètre, ecartés de 0,8 Irun, dont les résultats se sont avérés extraordinairement satisfaisants, à
savoir que la résistance de cont8ct dans la connexion entre la ; `` 2028110 PRODUCTION PROCESS
OF A FLAT CONNECTION
The present invention relates to a method of connection applicable to make any flat connection between 5 two rigid or flexible members.
Currently, flat connections are made in putting opposite connection zones made up of flat conductive pads with or without protection of surface such as gilding or tinning, and maintaining the ~ say 10 conductive areas in contact by a clamping means appropriate. This type of connection is used, for example, to connect conductors ~ in the form of ribbons (commonly called "strip line") between them or on a circuit board printed.
The quality of these connections depends of course on the state .
surface of the conductive pads intended to come into contact.
In practice, their planeness is most often very approximate, including that of printed circuit boards which inherently have undulations 20 superficial. This results in poor quality connection ~
,; which are characterized by high contact resistances.
The object of the invention is to overcome this drawback by a very simple process to implement and allowing to make a single electrical connection more generally suitable to power connections or line connections 25 ribbons.
This process consists in forming a first track conductor intended to come into contact in a connection to flat with a second substantially flat conductive surface, a surface condition showing up from a base 30 substantially planar a plurality of stud3 of the same height evenly distributed, puls to apply in vi ~ -à-vl ~ and to tighten the first and second conductive pads ~, so that 202 ~
establish contact between the top of each stud and the surface from the second track.
The invention will be better understood using explanations which follow and drawings 30ints, parml 5 which:
Figure 1 partially shows a plsge conductrics comprising studs for connection according to the procedure of the invention, and figure 2 is a view similar to figure 1 lO illustrating another type of studs.
The conductive pads 10 shown in FIGS. 1 and 2 ~ have the ends of a ribbon conductor, generally made of copper, applied to a substrate 11. The latter can be rigid, such as a printed circuit board, for example. he 15 can also be nexible, especially in the ca ~ a llgne ribbon or "strlp line", the range 10 can then be the end of one of several parallel tracks. ~ ' According to the invention, on the surface of the beach 10 which is substantially flat, are formed dan ~ the mass of 20 studs 12 in the form of cylindrical pastil'ies ~ qul are allocated columns and in rows As a variant, the studs 12 can be arranged ~ staggered or in any other distribution regularity, function, ain ~ i as their number, of the geometry of the beach. In an exemplary embodiment, for a connection 25 electric, the number of pads is, for example, 20 and the current is, for example 5 kA.
As an indication, the studs 12 can be given a height, depending on the case, between a few hundredths and some ~ - tens of millimeters for a diameter and a 30 spacing of the order of some ~ tens of millimeters. Of tests were carried out by forming 50 μm pads height and 0.7 mm in diameter, separated by 0.8 Irun, the results have been extraordinarily satisfactory, know that the cont8ct resistance in the connection between the
2 Q 2 .~
plage conductrice ainsi obtenue et une autre plage conductrlce de surface normale était réduite de plus de moitié.
Un développement intéressant de l'lnvention consiste h prévolr sur la plage 10 un revêtement en matérlau conducteur 5 assez dur, tel que du nickel, afin de prévenir les plots 12 contre la déformation et l'écrasement. Cette précaution assure une bonne tenue des plots en cas de fort serrage ou de démontage répété de la connexion. Bien entendu, une protectlon supplémentaire classique par étamage ou par dorure peut également être prévue.
I~es plots 12' montrés à la figure 2 ont la forme de tétraèdres réguiiers. Les caractéristiques de ces plots, du point de vue de leurs dimensions et de leur répartition, sont sensiblement les mêmes que pour des plots cylindriques. Avec les plot~ 12', le contact est établi par leur~ pointes. S~il9 sont revêtus, comme précédemment décrit, d'une couche de nickel ou autre matériau conducteur dur, lesdltas pointes, au lieu de s'écraser lor~ du serrage, s'impregnent dans la surface de la plage conductrlce en vis-à-vis, de manière à assurer dans 20 la connexion une fonction supplémentaire de résistance au gligsement .
Bien entendu, les deux conflgurations de plot décrites icl ne sont nullement limitative~, et on comprendra que d'autres formes sont également pos~ible~, telle~ que parallélépipédique, 25 etc.
Les plots sur 18 plage 10 peuvent être obtenus très simplement en une seule opération collective de dépôt, par exemple par galvanoplastie, avec l'avantage que l'outillage industrie~ pour mettre en oeuvre cette technique existe déjà
30 dans le domaine des circuits imprimes, de sorte que le procédé
de l'lnvention se caractérise par un co~t très faible Du fait qu'ii apporte une réduction importante de la résistance de contact dans toute connexion à plat flexible-flexible, flexible-rigide ou rigide-riglde, on lui trouvera des application~ très 35 intéressantes aussi bien pour des connexions de puissance - 2~28110 c'est-à-dire de coursnts forts que pour des connexions de lignes rubans ou "strip line" utilisées en VHF et en hyperfréquence. A
noter que le procédé est applicable à des plages conductrices de formes quelconques.
7~ : 2 Q 2. ~
conductive pad thus obtained and another conductrlce pad normal area was reduced by more than half.
An interesting development of the invention consists in precoat on track 10 a coating of conductive material 5 hard enough, such as nickel, to prevent studs 12 against deformation and crushing. This precaution ensures good resistance of the studs in the event of tightening or repeated dismantling of the connection. Of course, a protectlon additional classic by tinning or by gilding can also be expected.
I ~ es pads 12 'shown in Figure 2 have the form of regular tetrahedra. The characteristics of these studs, point of view of their dimensions and their distribution, are substantially the same as for cylindrical studs. With the studs ~ 12 ', contact is established by their ~ points. S ~ il9 are coated, as previously described, with a layer of nickel or other hard conductive material, lesdltas pointe, au instead of crashing when tightening, soak into the surface of the conductrlce beach opposite, so as to ensure in 20 the connection an additional function of resistance to sticking out.
Of course, the two stud confluences described icl are in no way limiting ~, and it will be understood that other shapes are also pos ~ ible ~, such as ~ parallelepiped, 25 etc.
Plots on 18 track 10 can be obtained very simply in a single collective deposit operation, by example by electroplating, with the advantage that tooling industry ~ to implement this technique already exists 30 in the field of printed circuits, so that the process lnvention is characterized by a very low cost ~ t that it brings a significant reduction in the resistance of contact in any flexible-flexible, flexible- flat connection rigid or rigid-riglde, we will find applications ~ very 35 interesting as well for power connections - 2 ~ 28110 that is to say strong current only for line connections ribbons or "strip line" used in VHF and in microwave. AT
note that the method is applicable to conductive ranges of any shapes.
7 ~:
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8902555A FR2643754B1 (en) | 1989-02-28 | 1989-02-28 | PROCESS FOR MAKING A FLAT CONNECTION |
FR8902555 | 1989-02-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2028110A1 true CA2028110A1 (en) | 1990-08-29 |
Family
ID=9379185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2028110 Abandoned CA2028110A1 (en) | 1989-02-28 | 1990-02-27 | Flat connection production process |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0418345A1 (en) |
CA (1) | CA2028110A1 (en) |
FR (1) | FR2643754B1 (en) |
WO (1) | WO1990010320A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5105537A (en) * | 1990-10-12 | 1992-04-21 | International Business Machines Corporation | Method for making a detachable electrical contact |
JPH07105420B2 (en) * | 1991-08-26 | 1995-11-13 | ヒューズ・エアクラフト・カンパニー | Electrical connection with molded contacts |
DE69214389T2 (en) * | 1991-08-26 | 1997-04-30 | Hughes Aircraft Co | Electrical sensor with molded contacts |
JP2002090388A (en) | 2000-09-13 | 2002-03-27 | Soushiyou Tec:Kk | Contact structure for lead |
US6641406B1 (en) * | 2000-11-03 | 2003-11-04 | Cray Inc. | Flexible connector for high density circuit applications |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2149209A (en) * | 1935-11-14 | 1939-02-28 | Western Union Telegraph Co | Wire connecting sleeve |
US3346350A (en) * | 1965-05-25 | 1967-10-10 | Engelhard Ind Inc | Electrical contact tape |
US4067104A (en) * | 1977-02-24 | 1978-01-10 | Rockwell International Corporation | Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components |
US4466184A (en) * | 1981-04-21 | 1984-08-21 | General Dynamics, Pomona Division | Method of making pressure point contact system |
JPS5866216A (en) * | 1981-10-16 | 1983-04-20 | 信越ポリマ−株式会社 | Keyboard unit |
JPS5957866U (en) * | 1982-10-08 | 1984-04-16 | 松下電工株式会社 | Structure of flat cable connection |
DE3440109A1 (en) * | 1984-11-02 | 1986-05-07 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | METHOD FOR PRODUCING DEFORMABLE MULTIPLE CONNECTIONS FOR THE ELECTRICAL CONNECTION OF MICROELECTRONIC COMPONENTS AND MULTIPLE CONNECTIONS PRODUCED BY THIS METHOD |
-
1989
- 1989-02-28 FR FR8902555A patent/FR2643754B1/en not_active Expired - Fee Related
-
1990
- 1990-02-27 EP EP19900904369 patent/EP0418345A1/en not_active Withdrawn
- 1990-02-27 WO PCT/FR1990/000137 patent/WO1990010320A1/en not_active Application Discontinuation
- 1990-02-27 CA CA 2028110 patent/CA2028110A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP0418345A1 (en) | 1991-03-27 |
WO1990010320A1 (en) | 1990-09-07 |
FR2643754A1 (en) | 1990-08-31 |
FR2643754B1 (en) | 1993-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Dead |