JPH02240907A - Method of taking out lead wire of metallized film capacitor - Google Patents
Method of taking out lead wire of metallized film capacitorInfo
- Publication number
- JPH02240907A JPH02240907A JP1060680A JP6068089A JPH02240907A JP H02240907 A JPH02240907 A JP H02240907A JP 1060680 A JP1060680 A JP 1060680A JP 6068089 A JP6068089 A JP 6068089A JP H02240907 A JPH02240907 A JP H02240907A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electrode
- fine line
- metallized film
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 239000003990 capacitor Substances 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 14
- 239000011104 metalized film Substances 0.000 title claims description 8
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 238000005507 spraying Methods 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 230000020169 heat generation Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はメタライズドフィルムコンデンサの金属溶射に
より形成した電極からのリード線引出し方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for drawing out lead wires from electrodes formed by metal spraying of a metallized film capacitor.
信号用等のコンデンサでは、通常は丸棒のリード線の先
端を、そのまま、またはかしめて、電極面に半田付けも
しくは溶接してリード線の引出しを行なっている。電力
用等のコンデンサでは接触面積を大きくして、接触抵抗
を減少するため、リード線として編線を用いる。第4図
に示すように、lが金属蒸着フィルムを巻回した積層体
で、この巻口端面に溶射金属(メタリコン)による電極
2が形成されている。電極2の中央部に半田4で、編v
A3の先端を半田付けして引出している。In capacitors for signals, etc., the tip of a round lead wire is usually drawn out by soldering or welding it to the electrode surface, either as is or by crimping it. In power capacitors, braided wire is used as the lead wire in order to increase the contact area and reduce contact resistance. As shown in FIG. 4, 1 is a laminate formed by winding a metal-deposited film, and an electrode 2 made of sprayed metal (metallicon) is formed on the end face of this winding. Apply solder 4 to the center of electrode 2.
The tip of the A3 sheet is soldered and pulled out.
ところで、この種のコンデンサは有機フィルムを使用し
ているので、熱に弱く、幅の広い編線を半田付けする際
に、かなり熱が加わるので、フィルム変形等が生じフィ
ルムの蒸着部と溶射金属との接触がわるくなり、歩留低
下の原因となっていた。また電極面積が大きい場合、リ
ード線の固着部にいたるまでの電極抵抗も無視できず、
大電流用途では、発熱が大きくなり、故障の原因になる
ことがあった。By the way, since this type of capacitor uses an organic film, it is sensitive to heat, and when soldering a wide braided wire, a considerable amount of heat is applied, causing the film to deform and damage the evaporated part of the film and the sprayed metal. This resulted in poor contact with the metal, causing a decrease in yield. In addition, when the electrode area is large, the electrode resistance up to the fixed part of the lead wire cannot be ignored.
In high-current applications, heat generation increases, which can lead to malfunctions.
本発明の目的は、メタライズドフィルムコンデンサにお
いて上記の欠点を除去し、大電流用途においても信頼度
の高いリード線引出し方法を提供することにある。An object of the present invention is to eliminate the above-mentioned drawbacks in metallized film capacitors and to provide a highly reliable lead wire extraction method even in high current applications.
本発明のリード線引出し方法は、先端部が多数の細線部
にわけられたリード線を用い、該細線部を前記電極面上
に間隔をおいて分散配置し溶着するようにしたものであ
る。別の方法は、リード線を溶射金属内に埋込・むよう
にした方法で、電極の金属溶射後、先端部が多数の細線
部にわけられたリード線を、該細線部が金属溶射面に、
分散配置されるように設定しておいて、再び上面から金
属溶射を行なうものである。The lead wire drawing method of the present invention uses a lead wire whose tip portion is divided into a large number of thin wire portions, and the thin wire portions are distributed and welded at intervals on the electrode surface. Another method is to embed the lead wire in the sprayed metal. After the electrode is sprayed with metal, the lead wire whose tip is divided into many thin wire parts is placed on the metal sprayed surface.
The metal spraying is performed from above again after the metals are arranged in a dispersed manner.
リード線の先端部は、多数の細線部にわかれ、この細線
部を溶射金属からなる電極面に分散して配置するから、
電極面の各部は実質的にリード線への電流経路が短くな
る。これによって電極抵抗を減少できる。また、細線部
を半田付けで溶着する場合には、低い半田付は温度で、
容易に半田付けができるので、蒸着フィルムの変形によ
る事故が生じない。The tip of the lead wire is divided into many thin wire sections, and these thin wire sections are distributed and arranged on the electrode surface made of sprayed metal.
Each part of the electrode surface has a substantially shorter current path to the lead wire. This allows electrode resistance to be reduced. Also, when welding thin wire parts by soldering, low soldering temperature
Since soldering is easy, accidents caused by deformation of the deposited film do not occur.
(実施例)
以下、図面を参照して、本発明の実施例につき説明する
。第1図が、リード線の先端部を半田付けした実施例に
より製造したフィルムコンデンサの外観図である0図に
みるように、編線3は幅広い形状を有するリード線で、
その先端部は、複数個の細線部3Aに分割されている。(Example) Hereinafter, examples of the present invention will be described with reference to the drawings. As shown in Figure 1, which is an external view of a film capacitor manufactured according to an embodiment in which the tips of the lead wires are soldered, the braided wire 3 is a lead wire with a wide shape.
The tip portion is divided into a plurality of thin wire portions 3A.
この細線部3Aを溶射金属による電極2の面になるべく
分散するように配置して、各細線部3Aをそれぞれ半田
4Aで半田付けする。The thin wire portions 3A are arranged so as to be dispersed as much as possible on the surface of the electrode 2 made of sprayed metal, and each thin wire portion 3A is soldered with solder 4A.
上記方法で製作する場合の、端子間の抵抗を測定した例
が第2図である。ただし、この例は定格10uF、20
0Vのフィルムコンデンサと同一寸法で、フィルムの亜
鉛蒸着層が互いに接触する向きにした試料(シッート巻
回品)について測定したもので、巻口端面の電極に、そ
れぞれ本実施例の方法でリード線を形成し、その端子間
抵抗を測定したものである。縦軸の測定値は、端子抵抗
から蒸着膜抵抗を引いた抵抗値で、フィルムの蒸着金属
と電極の溶射金属との間の接触抵抗、電流経路による電
極抵抗が主体である。従来例の場合に対して、前記抵抗
が〃となっている。FIG. 2 shows an example of measuring the resistance between the terminals when manufactured by the above method. However, this example has a rating of 10uF, 20
Measurements were taken on a sample (sheet-wound product) with the same dimensions as a 0V film capacitor and with the zinc-deposited layers of the film in contact with each other. was formed and the resistance between its terminals was measured. The measured value on the vertical axis is the resistance value obtained by subtracting the vapor deposited film resistance from the terminal resistance, and is mainly the contact resistance between the vapor deposited metal of the film and the sprayed metal of the electrode, and the electrode resistance due to the current path. Compared to the case of the conventional example, the resistance is 〃.
次に、リード線の先端部を埋込む方法について説明する
。第3図(a)はこの方法により製作したフィルムコン
デンサの外観図、第3図山)は電極部分のA−A断面図
である。Next, a method of embedding the tip of the lead wire will be explained. FIG. 3(a) is an external view of a film capacitor manufactured by this method, and FIG. 3(a) is a sectional view taken along line A-A of the electrode portion.
編線3の先端部は、前記の方法と同様に分岐し、複数の
細線部3Aを有する。この方法では先ず金属溶射により
、下地のメタリコン層10を形成してから、前記細線部
3Aをなるべく離した配置をして、その上から金属溶射
を行ない上地のメタリコン層11を形成し、その間に細
線部3Aを埋込むので、特に半田付けする必要もなく、
リード線先端部が固定される。メタリコン層としては、
通常の方法では1日程度の厚さであるが、本方法ではた
とえば下地層を0.5m、上地層を0.・51■程度と
する。The tip of the braided wire 3 is branched in the same manner as in the above method, and has a plurality of thin wire portions 3A. In this method, first, a base metallicon layer 10 is formed by metal spraying, and then the thin wire portions 3A are arranged as far apart as possible, and metal spraying is performed on top of that to form a base metallicon layer 11. Since the thin wire part 3A is embedded in the
The tip of the lead wire is fixed. As a metallic layer,
In the normal method, the thickness is about 1 day, but in this method, for example, the base layer is 0.5 m thick and the upper layer is 0.5 m thick.・Approximately 51■.
以上説明したように、本発明の方法は大電力コンデンサ
用としてリード線を幅広の編線を用いた場合に、その先
端部を複数個の細線部に分岐させ、この細線部をフィル
ムコンデンサの電極面に可及的に分散配置して、半田付
けもしくは溶接により溶着することにより、金属溶射に
よる電極の電極抵抗を実質的に減少させることができ、
使用時の発熱を防止できる。また製作工程でリード引出
しを行なう際、細線部と電極との半田付け、または溶接
は小容量の熱パワーで可能だから、これによる有機フィ
ルムの劣化変形がなく、蒸着金属と電極との接触抵抗不
良の増大がない。As explained above, in the method of the present invention, when a wide braided lead wire is used for a high-power capacitor, the tip of the lead wire is branched into a plurality of thin wire portions, and these thin wire portions are used as electrodes of a film capacitor. By distributing them as much as possible on the surface and welding them by soldering or welding, the electrode resistance of the electrode due to metal spraying can be substantially reduced.
Prevents heat generation during use. In addition, when drawing out leads in the manufacturing process, soldering or welding between the thin wire part and the electrode can be done with a small amount of thermal power, so there is no deterioration or deformation of the organic film due to this, and there is no contact resistance between the vapor-deposited metal and the electrode. There is no increase in
別方法として、電極形成の金属溶射の際、金属溶射を2
回にわけて、リード線の先端部を埋込むようにしている
が、同様な効果が得られる。As an alternative method, when metal spraying is used to form electrodes, two
Although the tips of the lead wires are buried at different times, similar effects can be obtained.
なお、リード線として、編線と限定する必要はなく、そ
の先端部が、細かくわかれた形状のものであれば良いこ
とはいうまでもない。It goes without saying that the lead wire does not have to be limited to a braided wire, as long as its tip has a finely divided shape.
第1図は本発明の一実施例により製作したフィルムコン
デンサの外観図、第2図は同実施例の特別な試作品につ
いて端子間抵抗を実測した図、第3図は別の実施例によ
り製作したフィルムコンデンサの外観図、第4図は従来
例により製作したフィルムコンデンサの外観図である。
1− 積層体、 2−電極(メタリコン電極)、3−
編線、 3A〜細線部、 4 A−・半田、10−メタ
リコン層(下地)、
11・−・メタリコン11(上地)。Figure 1 is an external view of a film capacitor manufactured according to one embodiment of the present invention, Figure 2 is a diagram showing the actual measured terminal resistance of a special prototype of the same embodiment, and Figure 3 is a diagram of a film capacitor manufactured according to another embodiment. Fig. 4 is an external view of a film capacitor manufactured according to a conventional example. 1- Laminated body, 2- Electrode (metallicon electrode), 3-
Braided wire, 3A--thin wire portion, 4 A--Solder, 10-Metallicon layer (base), 11--Metallicon 11 (upper layer).
Claims (2)
属溶射して形成するコンデンサの製造において、先端部
が多数の細線部にわけられたリード線を用い、該細線部
を前記電極面上に間隔をおいて分散配置して溶着し、リ
ード線引出しを行なうことを特徴とするメタライズドフ
ィルムコンデンサのリード線引出し方法。1. In the manufacture of capacitors in which electrodes are formed by metal spraying on the end surface of the winding end of a wound metallized film, a lead wire whose tip is divided into a number of thin wire sections is used, and the thin wire sections are placed on the electrode surface. A method for drawing out lead wires for a metallized film capacitor, which comprises distributing and welding the lead wires at intervals and drawing out the lead wires.
属溶射して形成するコンデンサの製造において、電極の
金属溶射後、先端部が多数の細線部にわけられたリード
線を、該細線部が金属溶射面に、分散配置されるように
設定しておいて、再び上面から金属溶射を行ない、リー
ド線先端部を溶射金属内に埋込み、リード線引出しを行
なうことを特徴とするメタライズドフィルムコンデンサ
のリード線引出し方法。2. In the manufacture of capacitors, in which electrodes are formed by metal spraying on the end surface of the winding end of a wound metallized film, after the metal spraying of the electrodes, a lead wire whose tip end is divided into a number of thin wire parts is used. A metallized film capacitor characterized in that the metallized film capacitor is set so as to be dispersedly arranged on the metal sprayed surface, and then the metal is sprayed again from the top surface, the lead wire tip is embedded in the sprayed metal, and the lead wire is drawn out. How to draw out the lead wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1060680A JPH02240907A (en) | 1989-03-15 | 1989-03-15 | Method of taking out lead wire of metallized film capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1060680A JPH02240907A (en) | 1989-03-15 | 1989-03-15 | Method of taking out lead wire of metallized film capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02240907A true JPH02240907A (en) | 1990-09-25 |
Family
ID=13149273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1060680A Pending JPH02240907A (en) | 1989-03-15 | 1989-03-15 | Method of taking out lead wire of metallized film capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02240907A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310618A (en) * | 2005-04-28 | 2006-11-09 | Murata Mfg Co Ltd | Ceramic electronic component and its manufacturing method |
JP2011029556A (en) * | 2009-07-29 | 2011-02-10 | Nichicon Corp | Capacitor |
US20140226259A1 (en) * | 2013-02-13 | 2014-08-14 | Sbe, Inc. | Mitigating the Effects of Cracks in Metallized Polymer Film Capacitor Arc-Sprayed End Connections |
JP2015046462A (en) * | 2013-08-28 | 2015-03-12 | 株式会社ネイブヒート | Sintering molding heating element |
JP2022541973A (en) * | 2019-04-25 | 2022-09-29 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | Low inductance component |
WO2023100502A1 (en) * | 2021-12-01 | 2023-06-08 | 株式会社村田製作所 | Film capacitor and method for producing film capacitor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5581667A (en) * | 1978-12-15 | 1980-06-19 | Matsushita Electric Works Ltd | Back muscle extension moving instrument |
-
1989
- 1989-03-15 JP JP1060680A patent/JPH02240907A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5581667A (en) * | 1978-12-15 | 1980-06-19 | Matsushita Electric Works Ltd | Back muscle extension moving instrument |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310618A (en) * | 2005-04-28 | 2006-11-09 | Murata Mfg Co Ltd | Ceramic electronic component and its manufacturing method |
JP2011029556A (en) * | 2009-07-29 | 2011-02-10 | Nichicon Corp | Capacitor |
US20140226259A1 (en) * | 2013-02-13 | 2014-08-14 | Sbe, Inc. | Mitigating the Effects of Cracks in Metallized Polymer Film Capacitor Arc-Sprayed End Connections |
JP2015046462A (en) * | 2013-08-28 | 2015-03-12 | 株式会社ネイブヒート | Sintering molding heating element |
JP2022541973A (en) * | 2019-04-25 | 2022-09-29 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | Low inductance component |
US12051548B2 (en) | 2019-04-25 | 2024-07-30 | KYOCERA AVX Components Corporation | Low inductance component |
WO2023100502A1 (en) * | 2021-12-01 | 2023-06-08 | 株式会社村田製作所 | Film capacitor and method for producing film capacitor |
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