CA2023172A1 - Methode de fabrication de condensateurs a deux polymeres - Google Patents
Methode de fabrication de condensateurs a deux polymeresInfo
- Publication number
- CA2023172A1 CA2023172A1 CA 2023172 CA2023172A CA2023172A1 CA 2023172 A1 CA2023172 A1 CA 2023172A1 CA 2023172 CA2023172 CA 2023172 CA 2023172 A CA2023172 A CA 2023172A CA 2023172 A1 CA2023172 A1 CA 2023172A1
- Authority
- CA
- Canada
- Prior art keywords
- poly layer
- layer
- regions
- poly
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/20—Resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA 2023172 CA2023172A1 (fr) | 1990-08-13 | 1990-08-13 | Methode de fabrication de condensateurs a deux polymeres |
PCT/CA1991/000277 WO1992003843A1 (fr) | 1990-08-13 | 1991-08-12 | Procede de fabrication de condensateurs et de resistances polycristallins pour circuits integres et circuit integre obtenu au moyen dudit procede |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA 2023172 CA2023172A1 (fr) | 1990-08-13 | 1990-08-13 | Methode de fabrication de condensateurs a deux polymeres |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2023172A1 true CA2023172A1 (fr) | 1992-02-14 |
Family
ID=4145723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2023172 Abandoned CA2023172A1 (fr) | 1990-08-13 | 1990-08-13 | Methode de fabrication de condensateurs a deux polymeres |
Country Status (2)
Country | Link |
---|---|
CA (1) | CA2023172A1 (fr) |
WO (1) | WO1992003843A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960009209A (ko) * | 1994-08-19 | 1996-03-22 | 이토 기요시 | 반도체 집적회로 |
US5541442A (en) * | 1994-08-31 | 1996-07-30 | International Business Machines Corporation | Integrated compact capacitor-resistor/inductor configuration |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4209716A (en) * | 1977-05-31 | 1980-06-24 | Texas Instruments Incorporated | Semiconductor integrated circuit with implanted resistor element in second-level polycrystalline silicon layer |
US4455568A (en) * | 1981-08-27 | 1984-06-19 | American Microsystems, Inc. | Insulation process for integrated circuits |
US4577390A (en) * | 1983-02-23 | 1986-03-25 | Texas Instruments Incorporated | Fabrication of polysilicon to polysilicon capacitors with a composite dielectric layer |
JPS59210658A (ja) * | 1983-05-16 | 1984-11-29 | Nec Corp | 半導体装置の製造方法 |
US4639274A (en) * | 1984-11-28 | 1987-01-27 | Fairchild Semiconductor Corporation | Method of making precision high-value MOS capacitors |
-
1990
- 1990-08-13 CA CA 2023172 patent/CA2023172A1/fr not_active Abandoned
-
1991
- 1991-08-12 WO PCT/CA1991/000277 patent/WO1992003843A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
WO1992003843A1 (fr) | 1992-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
FZDE | Dead |