CA2012314A1 - Composes de type imidazoline - Google Patents

Composes de type imidazoline

Info

Publication number
CA2012314A1
CA2012314A1 CA2012314A CA2012314A CA2012314A1 CA 2012314 A1 CA2012314 A1 CA 2012314A1 CA 2012314 A CA2012314 A CA 2012314A CA 2012314 A CA2012314 A CA 2012314A CA 2012314 A1 CA2012314 A1 CA 2012314A1
Authority
CA
Canada
Prior art keywords
imidazoline compounds
imidazoline
compounds
denotes
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2012314A
Other languages
English (en)
Other versions
CA2012314C (fr
Inventor
Madan M. Bagga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2012314A1 publication Critical patent/CA2012314A1/fr
Application granted granted Critical
Publication of CA2012314C publication Critical patent/CA2012314C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D233/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/04Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
    • C07D233/20Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C07D233/22Radicals substituted by oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Pyrrole Compounds (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CA002012314A 1989-03-17 1990-03-15 Composes de type imidazoline Expired - Lifetime CA2012314C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8906198.0 1989-03-17
GB898906198A GB8906198D0 (en) 1989-03-17 1989-03-17 Compounds

Publications (2)

Publication Number Publication Date
CA2012314A1 true CA2012314A1 (fr) 1990-09-17
CA2012314C CA2012314C (fr) 2001-01-02

Family

ID=10653545

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002012314A Expired - Lifetime CA2012314C (fr) 1989-03-17 1990-03-15 Composes de type imidazoline

Country Status (10)

Country Link
US (2) US4997951A (fr)
EP (1) EP0388359B1 (fr)
JP (1) JP2883996B2 (fr)
AT (1) ATE89274T1 (fr)
AU (1) AU5141290A (fr)
CA (1) CA2012314C (fr)
DE (1) DE59001397D1 (fr)
ES (1) ES2055398T3 (fr)
GB (1) GB8906198D0 (fr)
HK (1) HK1002913A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101065A (ja) * 1988-10-06 1990-04-12 Tanabe Seiyaku Co Ltd イミダゾリン誘導体及びその製法
US5212263A (en) * 1991-01-10 1993-05-18 Morton International, Inc. Textured epoxy powder coating
US5591811A (en) * 1995-09-12 1997-01-07 Ciba-Geigy Corporation 1-imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins
US5795927A (en) * 1996-05-17 1998-08-18 Morton International, Inc. Color stable wrinkle finish epoxy powder coating
US5688878A (en) * 1996-05-17 1997-11-18 Morton International, Inc. Epoxy powder coating with wrinkle finish
US5932288A (en) * 1997-12-18 1999-08-03 Morton International, Inc. Wrinkle epoxy powder coating with acid and its homolog methylenedisalicylic
US7041355B2 (en) * 2001-11-29 2006-05-09 Dow Global Technologies Inc. Structural reinforcement parts for automotive assembly
ATE500942T1 (de) * 2002-01-22 2011-03-15 Dow Global Technologies Inc Verstärktes verbundbauteil und verfahren zu dessen herstellung
CN100553929C (zh) * 2002-04-15 2009-10-28 陶氏环球技术公司 改进的车辆结构部件及制造这些部件的方法
AU2003301081A1 (en) * 2002-12-27 2004-07-29 Dow Global Technologies Inc. Heat activated epoxy adhesive and use in a structural foam insert
JP4938445B2 (ja) * 2003-03-05 2012-05-23 ダウ グローバル テクノロジーズ エルエルシー 構造用強化物品及びその製造方法
WO2009133168A1 (fr) 2008-04-30 2009-11-05 Sika Technology Ag Activateur pour compositions de résine époxy
EP2113525A1 (fr) 2008-04-30 2009-11-04 Sika Technology AG Activateur pour compositions de résine époxyde
JP6227954B2 (ja) * 2013-09-26 2017-11-08 株式会社日本触媒 硬化性樹脂組成物及びその用途
EP3405510B2 (fr) 2016-01-19 2023-06-07 Dow Global Technologies LLC Adhésifs monocomposants à base de polyuréthane et/ou de polyurée modifiés par époxy présentant un allongement élevé et une excellente stabilité thermique, et procédés d'assemblage les utilisant
CN117050272B (zh) * 2023-09-06 2024-07-12 北京密云水泥制品有限责任公司 一种环氧灌浆料用固化剂及其制备方法和环氧灌浆料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2888458A (en) * 1954-12-30 1959-05-26 Petrolite Corp Salicylaldehyde and vanillin schiff base derivatives of certain aminoalkyl cyclic amidines
CH602857A5 (fr) * 1976-12-10 1978-08-15 Ciba Geigy Ag
US4292429A (en) * 1978-03-08 1981-09-29 Ciba-Geigy Corporation Imidazole urea and amido compounds
US4613609A (en) * 1983-07-12 1986-09-23 Schering A. G. Antiarrhythmic imidazoliums
US4749729A (en) * 1984-06-21 1988-06-07 American Cyanamid Company Epoxy resin compositions curable above 160 F. and below 250 F.
JPH0625144B2 (ja) * 1986-02-24 1994-04-06 四国化成工業株式会社 新規イミダゾール化合物及び該化合物の合成方法

Also Published As

Publication number Publication date
EP0388359A1 (fr) 1990-09-19
AU5141290A (en) 1990-09-20
US4997951A (en) 1991-03-05
ATE89274T1 (de) 1993-05-15
ES2055398T3 (es) 1994-08-16
JP2883996B2 (ja) 1999-04-19
HK1002913A1 (en) 1998-09-25
EP0388359B1 (fr) 1993-05-12
CA2012314C (fr) 2001-01-02
DE59001397D1 (en) 1993-06-17
JPH02279675A (ja) 1990-11-15
US5152862A (en) 1992-10-06
GB8906198D0 (en) 1989-05-04

Similar Documents

Publication Publication Date Title
CA2012314A1 (fr) Composes de type imidazoline
CA2162003A1 (fr) Compositions de revetement reticulables renfermant des additifs a base de carbamate
DE69023088D1 (de) Wärmehärtende Pulverlackzusammensetzung.
TW376402B (en) Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same
CA2029703A1 (fr) Agents hypoglycemiques de type oxazolidinedione
CA2014017A1 (fr) Compose de resine pour electrodeposition cationique
KR880007589A (ko) 다기능(Multifunctional)에폭시드 수지
CA2037058A1 (fr) Additif a ciment, methode de production de l'additif et composition de ciment
EP0915383A3 (fr) Composition de résine photosensible
IE891601L (en) Latent hardeners for epoxy resin compositions
EP0372983A3 (fr) Composition de résine époxyde pour le scellement de semi-conducteurs
EP0404011A3 (fr) Composition résineuse malaxée, moulable
KR910006419A (ko) 열경화형 실리콘 고무 조성물 및 그 경화물
KR920006392A (ko) 에폭시 수지, 에폭시 수지 조성물 및 그의 경화제품
JPS5426000A (en) Epoxy resin composition
CA2011356A1 (fr) Compose de resine de type a fluorine, compose durcissable et compose de protection
KR900014486A (ko) 열잠재성 경화촉매 및 그를 함유한 수지 조성물
EP0294148A3 (fr) Composition de résine époxyde
CA2238778A1 (fr) Compositions durcissables pour tirage sur materiau photosensible
KR900018283A (ko) 열경화성 수지 조성물
KR850005462A (ko) 에폭시 수지의 경화방법
JPS5749646A (en) Epoxy resin composition
CA2161871A1 (fr) Materiel de moulage durcissable actiniquement
JPS5740576A (en) Epoxy resin adhesive composition
JPS5647445A (en) Epoxy resin composition

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKEC Expiry (correction)

Effective date: 20121202