CA1314519C - Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized products - Google Patents
Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized productsInfo
- Publication number
- CA1314519C CA1314519C CA000533612A CA533612A CA1314519C CA 1314519 C CA1314519 C CA 1314519C CA 000533612 A CA000533612 A CA 000533612A CA 533612 A CA533612 A CA 533612A CA 1314519 C CA1314519 C CA 1314519C
- Authority
- CA
- Canada
- Prior art keywords
- elongate
- products
- recited
- masking
- masking devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims description 5
- 238000000034 method Methods 0.000 title abstract description 29
- 230000000873 masking effect Effects 0.000 claims abstract description 51
- 239000003792 electrolyte Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims description 10
- 238000001465 metallisation Methods 0.000 claims description 10
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 29
- 229910052751 metal Inorganic materials 0.000 abstract description 29
- 239000010970 precious metal Substances 0.000 abstract description 26
- 238000007747 plating Methods 0.000 abstract description 23
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- 239000011148 porous material Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000012858 resilient material Substances 0.000 description 2
- 241000274177 Juniperus sabina Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 241000079527 Ziziphus spina-christi Species 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 235000001520 savin Nutrition 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000002311 subsequent effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
- C25D7/0678—Selective plating using masks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL8600838A NL8600838A (nl) | 1986-04-02 | 1986-04-02 | Werkwijze en inrichting voor het langs electrolytische weg aanbrengen van een metaalbedekking op in een band samenhangende langwerpige metalen en /of gemetalliseerde voorwerpen. |
| NL8600838 | 1986-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1314519C true CA1314519C (en) | 1993-03-16 |
Family
ID=19847812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000533612A Expired - Fee Related CA1314519C (en) | 1986-04-02 | 1987-04-01 | Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized products |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4770754A (instruction) |
| EP (1) | EP0241079B1 (instruction) |
| JP (1) | JPS6318095A (instruction) |
| AT (1) | ATE67248T1 (instruction) |
| CA (1) | CA1314519C (instruction) |
| DE (1) | DE3772811D1 (instruction) |
| HK (1) | HK12392A (instruction) |
| NL (1) | NL8600838A (instruction) |
| SG (1) | SG108591G (instruction) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2214930A (en) * | 1988-02-11 | 1989-09-13 | Twickenham Plating & Enamellin | Mask for use in electriplating on elongate substrate |
| ATE488621T1 (de) * | 1997-04-04 | 2010-12-15 | Univ Southern California | Galvanisches verfahren zur herstellung einer mehrlagenstruktur |
| JP3466458B2 (ja) * | 1998-02-19 | 2003-11-10 | アルプス電気株式会社 | 回転型電気部品 |
| WO2000006806A2 (de) * | 1998-07-27 | 2000-02-10 | Siemens Electromechanical Components Gmbh & Co. Kg | Vorrichtung zum galvanischen abscheiden und abtragen von metall |
| US9614266B2 (en) | 2001-12-03 | 2017-04-04 | Microfabrica Inc. | Miniature RF and microwave components and methods for fabricating such components |
| AU2002360464A1 (en) * | 2001-12-03 | 2003-06-17 | Memgen Corporation | Miniature rf and microwave components and methods for fabricating such components |
| US10416192B2 (en) | 2003-02-04 | 2019-09-17 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components |
| US8613846B2 (en) * | 2003-02-04 | 2013-12-24 | Microfabrica Inc. | Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
| US10297421B1 (en) | 2003-05-07 | 2019-05-21 | Microfabrica Inc. | Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures |
| TWI297045B (en) * | 2003-05-07 | 2008-05-21 | Microfabrica Inc | Methods and apparatus for forming multi-layer structures using adhered masks |
| US9671429B2 (en) | 2003-05-07 | 2017-06-06 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
| US10641792B2 (en) | 2003-12-31 | 2020-05-05 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
| US11262383B1 (en) | 2018-09-26 | 2022-03-01 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
| US12078657B2 (en) | 2019-12-31 | 2024-09-03 | Microfabrica Inc. | Compliant pin probes with extension springs, methods for making, and methods for using |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4374004A (en) * | 1981-06-29 | 1983-02-15 | Northern Telecom Limited | Method and apparatus for surface-treating predetermined areas of a surface of a body |
| US4376017A (en) * | 1982-01-04 | 1983-03-08 | Western Electric Co., Inc. | Methods of electrolytically treating portions of digitated strips and treating cell |
| US4405410A (en) * | 1982-01-15 | 1983-09-20 | Northern Telecom Limited | Masking of elongate three dimensional objects for the exposure of preselected areas for surface treatment |
| EP0107417B1 (en) * | 1982-10-05 | 1989-01-18 | S.G. Owen (Northampton) Limited | Selective plating |
| US4514264A (en) * | 1984-02-21 | 1985-04-30 | Meco Equipment Engineers B.V. | Method and device for galvanically applying a metal coating on metal objects |
-
1986
- 1986-04-02 NL NL8600838A patent/NL8600838A/nl not_active Application Discontinuation
-
1987
- 1987-03-26 EP EP87200575A patent/EP0241079B1/en not_active Expired - Lifetime
- 1987-03-26 DE DE8787200575T patent/DE3772811D1/de not_active Expired - Lifetime
- 1987-03-26 AT AT87200575T patent/ATE67248T1/de not_active IP Right Cessation
- 1987-04-01 CA CA000533612A patent/CA1314519C/en not_active Expired - Fee Related
- 1987-04-01 JP JP62077632A patent/JPS6318095A/ja active Granted
- 1987-04-01 US US07/032,574 patent/US4770754A/en not_active Expired - Lifetime
-
1991
- 1991-12-24 SG SG1085/91A patent/SG108591G/en unknown
-
1992
- 1992-02-13 HK HK123/92A patent/HK12392A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6318095A (ja) | 1988-01-25 |
| EP0241079B1 (en) | 1991-09-11 |
| EP0241079A1 (en) | 1987-10-14 |
| SG108591G (en) | 1992-02-14 |
| NL8600838A (nl) | 1987-11-02 |
| US4770754A (en) | 1988-09-13 |
| HK12392A (en) | 1992-02-21 |
| JPH0246677B2 (instruction) | 1990-10-16 |
| DE3772811D1 (de) | 1991-10-17 |
| ATE67248T1 (de) | 1991-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1314519C (en) | Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized products | |
| JPH024678B2 (instruction) | ||
| WO2000040779A8 (en) | Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece | |
| GB2027054A (en) | Electroplating of selected areas of a surface | |
| CA2047502C (en) | Selectively plating electrically conductive pin | |
| US4132617A (en) | Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape | |
| JPH0149795B2 (instruction) | ||
| CA1056761A (en) | Methods of providing contact between two members normally separable by an intervening member | |
| US4539090A (en) | Continuous electroplating device | |
| US4405410A (en) | Masking of elongate three dimensional objects for the exposure of preselected areas for surface treatment | |
| US4361470A (en) | Connector contact point | |
| JPS58105592A (ja) | 平板状被加工片タブの局部的処理装置 | |
| US4224117A (en) | Methods of and apparatus for selective plating | |
| EP0114216B1 (en) | Method for selective electroplating | |
| EP0222232A1 (en) | Plating device for minute portions of connector terminals | |
| US4518636A (en) | Selective plating | |
| EP0108494B1 (en) | Selective plating | |
| CA1144522A (en) | Continuous contact plater | |
| CA1165640A (en) | Masking of elongate three dimensional objects for the exposure of preselected areas for surface treatment | |
| JPS6358397B2 (instruction) | ||
| JPS62109992A (ja) | 部分メツキ方法 | |
| JP2000064099A (ja) | 金属の剥離装置 | |
| JPS61295395A (ja) | コネクタ端子のブラシメツキ方法 | |
| Beyerle | Method and Apparatus for Forming Printed Circuits | |
| Leroy | Method and Apparatus for Electroless Plating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |