CA1260099A - Nickel-based electrical contact device - Google Patents
Nickel-based electrical contact deviceInfo
- Publication number
- CA1260099A CA1260099A CA000509516A CA509516A CA1260099A CA 1260099 A CA1260099 A CA 1260099A CA 000509516 A CA000509516 A CA 000509516A CA 509516 A CA509516 A CA 509516A CA 1260099 A CA1260099 A CA 1260099A
- Authority
- CA
- Canada
- Prior art keywords
- contact
- hydrogen
- nickel
- amount
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Abstract
NICKEL-BASED ELECTRICAL CONTACT DEVICE
Abstract This invention relates to a device having an electrically conducting member having a contact surface consisting of a nickel-based contact material. In accordance with the invention, the nickel-based material at least in a surface region (e.g. 23) comprises controlled amounts of hydrogen and has low electrical contact resistance even after prolonged exposure to an oxidizing ambient. When used as a surface layer (e.g. 22) on an electrically conducting member (e.g. 21), such material is suitable as a contact material and represents an inexpensive alternative to gold. And, when prepared in the form of microscopic flakes, such material is suitable for use in electrically conductive inks and adhesives. (FIG. 2)
Abstract This invention relates to a device having an electrically conducting member having a contact surface consisting of a nickel-based contact material. In accordance with the invention, the nickel-based material at least in a surface region (e.g. 23) comprises controlled amounts of hydrogen and has low electrical contact resistance even after prolonged exposure to an oxidizing ambient. When used as a surface layer (e.g. 22) on an electrically conducting member (e.g. 21), such material is suitable as a contact material and represents an inexpensive alternative to gold. And, when prepared in the form of microscopic flakes, such material is suitable for use in electrically conductive inks and adhesives. (FIG. 2)
Description
3~
..
NIC~EL~UA'ED EIECTRICAL CONT~CT DEVICE
T_chn~cal_Fleld The in~ention is conceLnecl with devices havlnq an electrically conducting member havirlg electrical contact surface of nickel-based materials.
B__k~___n__of__he_I_yent__n T~pically, the manufacture of high-quality electrical contacts has involved the usa~e of gold whose properties of low contact resistance and high chemical stability are key advantages in such usage. However, as the price of gold rematns hiyh, efforts continue at finding alternative materials for contact manufacture.
Prominent among such alternatives are precious metals other than gold; e~g., silver-palladium alloys have been found suita~le for certain applications.
While such alternate alloys are less expensive than gold, still further cost reduction is desired, and nonPreCiouS metal alloys such as, e.g., copper~nickel alloys have been investigated for contact resistance and stability over time. See S, M. Garte et al., "Contact Properties of Nickel-Containing Alloys", Elec_rica Contacts, 1972, Illinois Institute of Technology.
SummaEy_of_the_Inv_n_i__ It has been discovered that a material consisting essentially of nickel and a controlled amount of hydrogen has contact pro~erties comparable to those of gold such as, in particular, low and stable contact resistance. ~referred amounts of hydrogen in nickel are regarded to be such as to associate atoms of hydrogen with nickel atoms on dislocations, thus blocking oxidation at critical sites. Typically, surface contact resistance of the material is significantly less than 100 milliohms even after prolonged exposure to an oxidizing ambient.
q~
3~3 - la -In accordance with an aspect oE the invention there is provided a device compr;sing an electrically conducting member having a contact surface, said contact surface being the surface of a surface region oE said member, said surface region consisting of a contact material, an amount of at least 70 atom percent of said contact material consists of nickel and hydrogen, and hydrogen being present in said amount in a significant small percentage so as to enhance an electrical contact property of said contact surface.
In accordance with another aspect of the invention there is provided a method for making an electrically conducting member in a device, said method comprising a step of providing said member with a surface which is the surface of a contact material comprising an amount of at least 70 atom percent of nickel and hydrogen, and hydrogen being present in said amount in a significant small percentage so as to enhance an electrical contact property of said contact surface.
. ~2 E;~g~3
..
NIC~EL~UA'ED EIECTRICAL CONT~CT DEVICE
T_chn~cal_Fleld The in~ention is conceLnecl with devices havlnq an electrically conducting member havirlg electrical contact surface of nickel-based materials.
B__k~___n__of__he_I_yent__n T~pically, the manufacture of high-quality electrical contacts has involved the usa~e of gold whose properties of low contact resistance and high chemical stability are key advantages in such usage. However, as the price of gold rematns hiyh, efforts continue at finding alternative materials for contact manufacture.
Prominent among such alternatives are precious metals other than gold; e~g., silver-palladium alloys have been found suita~le for certain applications.
While such alternate alloys are less expensive than gold, still further cost reduction is desired, and nonPreCiouS metal alloys such as, e.g., copper~nickel alloys have been investigated for contact resistance and stability over time. See S, M. Garte et al., "Contact Properties of Nickel-Containing Alloys", Elec_rica Contacts, 1972, Illinois Institute of Technology.
SummaEy_of_the_Inv_n_i__ It has been discovered that a material consisting essentially of nickel and a controlled amount of hydrogen has contact pro~erties comparable to those of gold such as, in particular, low and stable contact resistance. ~referred amounts of hydrogen in nickel are regarded to be such as to associate atoms of hydrogen with nickel atoms on dislocations, thus blocking oxidation at critical sites. Typically, surface contact resistance of the material is significantly less than 100 milliohms even after prolonged exposure to an oxidizing ambient.
q~
3~3 - la -In accordance with an aspect oE the invention there is provided a device compr;sing an electrically conducting member having a contact surface, said contact surface being the surface of a surface region oE said member, said surface region consisting of a contact material, an amount of at least 70 atom percent of said contact material consists of nickel and hydrogen, and hydrogen being present in said amount in a significant small percentage so as to enhance an electrical contact property of said contact surface.
In accordance with another aspect of the invention there is provided a method for making an electrically conducting member in a device, said method comprising a step of providing said member with a surface which is the surface of a contact material comprising an amount of at least 70 atom percent of nickel and hydrogen, and hydrogen being present in said amount in a significant small percentage so as to enhance an electrical contact property of said contact surface.
. ~2 E;~g~3
2 -Br-ef-Des~ o~-of the_DraWlng FIG. 1 is a perspective view of an electricaL
connector deYlce ln accordance with the invention; and FIG. 2 is a schema-tic cross-sectional vie~ oE a portion of a device in accordance with the invention.
Detailed D_s__ipti__ The electrical connector device showr, in FIG. 1 comprises housing 11 and contact pins 12. Housing 11 is made of an elec~rically insulatirg material, and contact pins 12 have contact surfaces in accordance with the illV ention.
Sho~n in EIG. 2 are, in cross section, an electrically conducting member 21 on ~hich layer 22 is situated. Member 2~ may consist of a copper conductor material~ and s~lrface layer 22 is a nic~el material which comprises hydrogen at least in a surface region 23. The incorporation of controlled amounts of hydrogen into nickel material results in enhanced contact properties such as low contact resis-tance and long-term stability of such resistance~
Hydrogen may be incorporated in a nickel material in a variety of ways such as, e.g., in the course of electroplating, by sputtering in an argon-hydrogen atmosphere, and by indiffusion at a bulk surface which, preferably, has been subiected to Plastic deformation by cold working. Preferred concentrations of hydrogen depend on conditions under which layers or bodies of nickel are produced and processed, and it is postulated thal preferred concentrations increase in direct relationship with the number of nickel atoms on dislocations. In particular, greater amounts of hydrogen are beneficial for cold worked material, preferred amounts being directly related to level of cold working. In the case of electrodeposited laYers, preferred amounts are in the range of from 0.0004 to 0.0009 atom concentration of h~drogen in nickel; when severe cold work is applied u~ to 0.01 atom concen-tration is preferred.
Fortuitously, as dislocation slip bands produced by cold workin~ also -facilitate indifEusion of hydrogen, contact properties of cold-worked bulk nickel materlal are most favorably affectecl by hYdrogen indiffusion.
Accordingly, applications are preferred in which nickeL
mateLial is ~lasticallY defornned by a significant amount, such as, e.g., corresponding to at least 50 percent reduction of cross-sectional area prior to hydrogen diffusion, the latter being carried out at a temperature which is less than the recrystallization temperature of Ni. H~drogen indiffusion is tYPicallY e-ffected over a time of a few minutes, and indiffusion is facilitated by heating at a temperature belo~ the recrYstallization temperature of Ni. Among applications of cold-worked material are those involving the use of microscopic flakes dispersed or embedded in a non-conductive matrix material as, e.g., in electrically conducting in]cs, pastes, and adhesives.
Conveniently, hydrogen can be incorporated in nickel layers b~ electroplating out of a suitable nickel bath, solutions of nickel salts being considered most suitable where the anion is but weakly oxidizing.
~ hile a contact material of the invention may be free or essentially free of elements ot~er than nickel and hydrogen, impurities may be present and additional elements maY be included such as, e~g., boron, silicon, germanium~ phosphorus, arsenic~ ant:Lmony, or bismuth.
When present in solid solution or~ in other words, when incorporated in the nickel structure, impurities and additives ars considered not to interfere with the beneficial effect of hydrogen in nickelO Amounts of at least 70 atom percent nickel~hYdrogen are preferred in the contact material.
Contacts of the invention may receive a final coating of "flash" comprising a significant amount of a coating material such as gold, one or several platinum-group elements, or ~old and one or several Platinum-group elements, the amount being sufficierlt to impart to -the coated surface the appearance of such coating material.
The structure of such coatinca may be essentiall~
homogeneous oE la~ered, and coating -thickness typically is ln a range from 0.01 to 0.05 micrometer~ For example, a cobalt-hardened gold coating maY be electro-dePosited ~rom a sli(Jhtly acidic solution (pH 5) comprisin~ ~otassium gold cyanide, cobalt citride, and a citric buffer. (The presence of cobalt, nominally in a range of from 0.2 to 0.5 percent by weiyht, enhances surface hardness especially in the case of thicker coatings.) Preferred temperature of the p;ating bath is approximately 35 degrees C, and a platin~ current of approximately 5 milliarnperes per cm~ is convenient. Typical plating times are of the order of half a minute~ Prior to plating, a surface may be cleaned, e.g., by electrolytic scrubbing in an alkaline solution, rinsing in de-ionized ~ater, and dipping in dilute hydrochloric acid at elevated temperature.
Examv~ layer having a thickness of approximately 1.68 micrometer and havinç approximatel~r 0.005 atom concentration of hydrogen in nickel l~as deposited on a copper substrate by sput-tering from an essentially ~ure nickel target in an atmosphere of approximately 10 percent by volume hYdro~en, remainder essent:Lally argon. The layer was exposed to atmospheric test conditions at 75 de~rees C and 95 percent relative humiditY for 65 hours. After such exposure contact resistance was determined to be in the range of from 7 to 10 milliohms.
30 Example 27 A layer having a thickness of approximately 0.4~ micrometer ~as deposited as further described in Example 1 above, Ultimate contact resistance ~as in the range of from 10 to 13 milliohms.
Example_3. A layer having a thickness of approximately 4.5 micrometers was de~osited on a copper substrate by electroplatin~ from a 2~molar nickel chloride solution at a temperature of appcoximately 75 degrees C, ~H of the - ~, solution uas ap~roximately 3 as obtainecl hy the addition of amlnoni.uln hydroxide, and current clensi-ty during deposition was approxi.mately 150 milliarnperes/cln2. The layer was exposecl to a~mos~heI:ic test cond.itions as described in Examrle 1 above, and contact resistance was determined to be in the range of from 1 to 10 milliohms.
Exam~1e_4~ A layer ~as deposited as described in Exalnple 3 a~ove except that a 2-molar nickel citrate solution was used at a pH of approximately 60 Contact resistance of the laYer was found to be in the range of from 0O8 to 10 milliohms.
Example 5. A layer was deposited as described in Example 3 above except that a 1/2-molar nickel acet.ate solution was used at a pH of approximately 8. Contact resistance of the layer was in the range of from 2 to 15 milliohms.
connector deYlce ln accordance with the invention; and FIG. 2 is a schema-tic cross-sectional vie~ oE a portion of a device in accordance with the invention.
Detailed D_s__ipti__ The electrical connector device showr, in FIG. 1 comprises housing 11 and contact pins 12. Housing 11 is made of an elec~rically insulatirg material, and contact pins 12 have contact surfaces in accordance with the illV ention.
Sho~n in EIG. 2 are, in cross section, an electrically conducting member 21 on ~hich layer 22 is situated. Member 2~ may consist of a copper conductor material~ and s~lrface layer 22 is a nic~el material which comprises hydrogen at least in a surface region 23. The incorporation of controlled amounts of hydrogen into nickel material results in enhanced contact properties such as low contact resis-tance and long-term stability of such resistance~
Hydrogen may be incorporated in a nickel material in a variety of ways such as, e.g., in the course of electroplating, by sputtering in an argon-hydrogen atmosphere, and by indiffusion at a bulk surface which, preferably, has been subiected to Plastic deformation by cold working. Preferred concentrations of hydrogen depend on conditions under which layers or bodies of nickel are produced and processed, and it is postulated thal preferred concentrations increase in direct relationship with the number of nickel atoms on dislocations. In particular, greater amounts of hydrogen are beneficial for cold worked material, preferred amounts being directly related to level of cold working. In the case of electrodeposited laYers, preferred amounts are in the range of from 0.0004 to 0.0009 atom concentration of h~drogen in nickel; when severe cold work is applied u~ to 0.01 atom concen-tration is preferred.
Fortuitously, as dislocation slip bands produced by cold workin~ also -facilitate indifEusion of hydrogen, contact properties of cold-worked bulk nickel materlal are most favorably affectecl by hYdrogen indiffusion.
Accordingly, applications are preferred in which nickeL
mateLial is ~lasticallY defornned by a significant amount, such as, e.g., corresponding to at least 50 percent reduction of cross-sectional area prior to hydrogen diffusion, the latter being carried out at a temperature which is less than the recrystallization temperature of Ni. H~drogen indiffusion is tYPicallY e-ffected over a time of a few minutes, and indiffusion is facilitated by heating at a temperature belo~ the recrYstallization temperature of Ni. Among applications of cold-worked material are those involving the use of microscopic flakes dispersed or embedded in a non-conductive matrix material as, e.g., in electrically conducting in]cs, pastes, and adhesives.
Conveniently, hydrogen can be incorporated in nickel layers b~ electroplating out of a suitable nickel bath, solutions of nickel salts being considered most suitable where the anion is but weakly oxidizing.
~ hile a contact material of the invention may be free or essentially free of elements ot~er than nickel and hydrogen, impurities may be present and additional elements maY be included such as, e~g., boron, silicon, germanium~ phosphorus, arsenic~ ant:Lmony, or bismuth.
When present in solid solution or~ in other words, when incorporated in the nickel structure, impurities and additives ars considered not to interfere with the beneficial effect of hydrogen in nickelO Amounts of at least 70 atom percent nickel~hYdrogen are preferred in the contact material.
Contacts of the invention may receive a final coating of "flash" comprising a significant amount of a coating material such as gold, one or several platinum-group elements, or ~old and one or several Platinum-group elements, the amount being sufficierlt to impart to -the coated surface the appearance of such coating material.
The structure of such coatinca may be essentiall~
homogeneous oE la~ered, and coating -thickness typically is ln a range from 0.01 to 0.05 micrometer~ For example, a cobalt-hardened gold coating maY be electro-dePosited ~rom a sli(Jhtly acidic solution (pH 5) comprisin~ ~otassium gold cyanide, cobalt citride, and a citric buffer. (The presence of cobalt, nominally in a range of from 0.2 to 0.5 percent by weiyht, enhances surface hardness especially in the case of thicker coatings.) Preferred temperature of the p;ating bath is approximately 35 degrees C, and a platin~ current of approximately 5 milliarnperes per cm~ is convenient. Typical plating times are of the order of half a minute~ Prior to plating, a surface may be cleaned, e.g., by electrolytic scrubbing in an alkaline solution, rinsing in de-ionized ~ater, and dipping in dilute hydrochloric acid at elevated temperature.
Examv~ layer having a thickness of approximately 1.68 micrometer and havinç approximatel~r 0.005 atom concentration of hydrogen in nickel l~as deposited on a copper substrate by sput-tering from an essentially ~ure nickel target in an atmosphere of approximately 10 percent by volume hYdro~en, remainder essent:Lally argon. The layer was exposed to atmospheric test conditions at 75 de~rees C and 95 percent relative humiditY for 65 hours. After such exposure contact resistance was determined to be in the range of from 7 to 10 milliohms.
30 Example 27 A layer having a thickness of approximately 0.4~ micrometer ~as deposited as further described in Example 1 above, Ultimate contact resistance ~as in the range of from 10 to 13 milliohms.
Example_3. A layer having a thickness of approximately 4.5 micrometers was de~osited on a copper substrate by electroplatin~ from a 2~molar nickel chloride solution at a temperature of appcoximately 75 degrees C, ~H of the - ~, solution uas ap~roximately 3 as obtainecl hy the addition of amlnoni.uln hydroxide, and current clensi-ty during deposition was approxi.mately 150 milliarnperes/cln2. The layer was exposecl to a~mos~heI:ic test cond.itions as described in Examrle 1 above, and contact resistance was determined to be in the range of from 1 to 10 milliohms.
Exam~1e_4~ A layer ~as deposited as described in Exalnple 3 a~ove except that a 2-molar nickel citrate solution was used at a pH of approximately 60 Contact resistance of the laYer was found to be in the range of from 0O8 to 10 milliohms.
Example 5. A layer was deposited as described in Example 3 above except that a 1/2-molar nickel acet.ate solution was used at a pH of approximately 8. Contact resistance of the layer was in the range of from 2 to 15 milliohms.
Claims (20)
1. Device comprising an electrically conducting member having a contact surface, said contact surface being the surface of a surface region of said member, said surface region consisting of a contact material, an amount of at least 70 atom percent of said contact material consists of nickel and hydrogen, and hydrogen being present in said amount in a significant small percentage so as to enhance an electrical contact property of said contact surface.
2. Device of claim 1, hydrogen atoms in said contact material being in correspondence with nickel atoms on dislocations.
3. Device of claim 1, said surface region being an electrodeposited layer in which atom concentration of hydrogen in said amount is in the range of from 0.0004 to 0.0009.
4. Device of claim 1, said surface region being a layer which has been plastically deformed and in which atom concentration of hydrogen in said amount is in the range of from 0.0004 to 0.01.
5. Device of claim 4 in which said surface region has been plastically deformed so as to result in cross-sectional area reduction greater than or equal to 50 percent.
6. Device of claim 1 in which the contact resistance at said surface is less than 100 milliohms.
7. Device of claim 1 in which said contact surface is essentially the entire surface of said member.
8. Device of claim 7 in which said member is a contact pin.
9. Device of claim 7 in which said member is a conductive particle.
10. Device of claim 9 in which said particle is an ink particle.
11. Device of claim 9 in which said particle is embedded in a non-conductive matrix material.
12. Device of claim 11 in which said non-conductive matrix material is an adhesive material.
13. Method for making an electrically conducting member in a device, said method comprising a step of providing said member with a surface which is the surface of a contact material comprising an amount of at least 70 atom percent of nickel and hydrogen, and hydrogen being present in said amount in a significant small percentage so as to enhance an electrical contact property of said contact surface.
14. Method of claim 13 in which said step is a step of electrodeposition.
15. Method of claim 13 in which said step is a step of sputtering.
16. Method of claim 13 in which said step is a step of diffusion of hydrogen into nickel.
17. Method of claim 16 in which said method comprises cold working said member prior to diffusion.
18. Device of claim 1, said contact material having a surface coating which consists essentially of a coating material selected from the group consisting of gold, one or several platinum-group elements, and gold and one or several platinum-group elements.
19. Device of claim 18, the amount of said coating material being sufficient to produce a surface appearance of said coating material.
20. Apparatus of claim 18, said surface coating having a thickness in the range of from 0.01 to 0.05 micrometer.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US823,986 | 1977-08-12 | ||
| US73577985A | 1985-05-20 | 1985-05-20 | |
| US735,779 | 1985-05-20 | ||
| US82398686A | 1986-01-30 | 1986-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1260099A true CA1260099A (en) | 1989-09-26 |
Family
ID=27112944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000509516A Expired CA1260099A (en) | 1985-05-20 | 1986-05-20 | Nickel-based electrical contact device |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0225912A1 (en) |
| KR (1) | KR880700503A (en) |
| CA (1) | CA1260099A (en) |
| WO (1) | WO1986007205A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4732821A (en) * | 1986-01-30 | 1988-03-22 | American Telephone And Telegraph Company, At&T Bell Laboratories | Nickel-based electrical contact |
| WO1988004701A1 (en) * | 1986-12-22 | 1988-06-30 | Amp Incorporated | Nickel plated contact surface having preferred crystallographic orientation |
| US4934968A (en) * | 1986-12-22 | 1990-06-19 | Amp Incorporated | Nickel plated contact surface having preferred crystallographic orientation |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4361470A (en) * | 1974-09-03 | 1982-11-30 | Micro-Plate, Inc. | Connector contact point |
| GB2097426B (en) * | 1981-04-24 | 1984-01-18 | James John Gilbert | Electro-plating process and products therefrom |
-
1986
- 1986-05-02 WO PCT/US1986/000971 patent/WO1986007205A1/en not_active Application Discontinuation
- 1986-05-02 EP EP86903756A patent/EP0225912A1/en not_active Ceased
- 1986-05-02 KR KR1019870700029A patent/KR880700503A/en not_active Application Discontinuation
- 1986-05-20 CA CA000509516A patent/CA1260099A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0225912A1 (en) | 1987-06-24 |
| WO1986007205A1 (en) | 1986-12-04 |
| KR880700503A (en) | 1988-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |