CA1219082A - Montage de dispositifs aux deux faces d'une carte a circuit imprime - Google Patents

Montage de dispositifs aux deux faces d'une carte a circuit imprime

Info

Publication number
CA1219082A
CA1219082A CA000484186A CA484186A CA1219082A CA 1219082 A CA1219082 A CA 1219082A CA 000484186 A CA000484186 A CA 000484186A CA 484186 A CA484186 A CA 484186A CA 1219082 A CA1219082 A CA 1219082A
Authority
CA
Canada
Prior art keywords
devices
solder
circuit board
pads
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000484186A
Other languages
English (en)
Inventor
Jacques Van Den Brekel
Dale B. Squires
Carlyle W. Crothers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Priority to CA000484186A priority Critical patent/CA1219082A/fr
Application granted granted Critical
Publication of CA1219082A publication Critical patent/CA1219082A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA000484186A 1985-06-17 1985-06-17 Montage de dispositifs aux deux faces d'une carte a circuit imprime Expired CA1219082A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000484186A CA1219082A (fr) 1985-06-17 1985-06-17 Montage de dispositifs aux deux faces d'une carte a circuit imprime

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA000484186A CA1219082A (fr) 1985-06-17 1985-06-17 Montage de dispositifs aux deux faces d'une carte a circuit imprime

Publications (1)

Publication Number Publication Date
CA1219082A true CA1219082A (fr) 1987-03-10

Family

ID=4130723

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000484186A Expired CA1219082A (fr) 1985-06-17 1985-06-17 Montage de dispositifs aux deux faces d'une carte a circuit imprime

Country Status (1)

Country Link
CA (1) CA1219082A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988007317A1 (fr) * 1987-03-19 1988-09-22 Western Digital Corporation Procede et article de soudage remplaçant la soudure traditionnelle
EP0303272A2 (fr) * 1987-08-14 1989-02-15 Siemens Aktiengesellschaft Circuit imprimé pour l'électronique
EP0407685A2 (fr) * 1989-07-14 1991-01-16 Hitachi, Ltd. Procédé et appareil pour l'inspection des soudures par moyen d'une image fluoroscopique à rayons X

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988007317A1 (fr) * 1987-03-19 1988-09-22 Western Digital Corporation Procede et article de soudage remplaçant la soudure traditionnelle
EP0303272A2 (fr) * 1987-08-14 1989-02-15 Siemens Aktiengesellschaft Circuit imprimé pour l'électronique
EP0303272A3 (fr) * 1987-08-14 1990-05-09 Siemens Aktiengesellschaft Circuit imprimé pour l'électronique
EP0407685A2 (fr) * 1989-07-14 1991-01-16 Hitachi, Ltd. Procédé et appareil pour l'inspection des soudures par moyen d'une image fluoroscopique à rayons X
EP0407685A3 (en) * 1989-07-14 1991-11-06 Hitachi, Ltd. Method for inspection of solder joints by x-ray fluoroscopic image, apparatus therefor and mounting construction of electronic parts on board

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Legal Events

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