CA1177288A - Flux treated solder powder composition - Google Patents
Flux treated solder powder compositionInfo
- Publication number
- CA1177288A CA1177288A CA000382924A CA382924A CA1177288A CA 1177288 A CA1177288 A CA 1177288A CA 000382924 A CA000382924 A CA 000382924A CA 382924 A CA382924 A CA 382924A CA 1177288 A CA1177288 A CA 1177288A
- Authority
- CA
- Canada
- Prior art keywords
- composition
- flux
- organic
- solder
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 91
- 230000004907 flux Effects 0.000 title claims abstract description 70
- 239000000843 powder Substances 0.000 title claims abstract description 62
- 239000000203 mixture Substances 0.000 title claims abstract description 47
- 239000002245 particle Substances 0.000 claims abstract description 39
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 11
- 230000005496 eutectics Effects 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 31
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 26
- 150000007524 organic acids Chemical group 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 17
- 150000001412 amines Chemical class 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 235000005985 organic acids Nutrition 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 238000010296 bead milling Methods 0.000 claims description 12
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 12
- 239000003960 organic solvent Substances 0.000 claims description 10
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical group OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 7
- 150000001298 alcohols Chemical class 0.000 claims description 6
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 6
- 229960004889 salicylic acid Drugs 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 5
- 229910019142 PO4 Inorganic materials 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 229910000464 lead oxide Inorganic materials 0.000 claims description 4
- 235000021317 phosphate Nutrition 0.000 claims description 4
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 3
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 238000012546 transfer Methods 0.000 claims description 2
- KSSJBGNOJJETTC-UHFFFAOYSA-N COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC Chemical compound COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC KSSJBGNOJJETTC-UHFFFAOYSA-N 0.000 claims 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 2
- 230000014759 maintenance of location Effects 0.000 description 25
- 238000003801 milling Methods 0.000 description 12
- 235000011044 succinic acid Nutrition 0.000 description 12
- 229910052718 tin Inorganic materials 0.000 description 12
- 229960005137 succinic acid Drugs 0.000 description 11
- 239000001384 succinic acid Substances 0.000 description 11
- 238000005476 soldering Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- 230000001788 irregular Effects 0.000 description 8
- 239000011324 bead Substances 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 7
- -1 aliphatic monocarboxylic acids Chemical class 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical compound Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 4
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 229960003707 glutamic acid hydrochloride Drugs 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 229910000743 fusible alloy Inorganic materials 0.000 description 2
- 150000002307 glutamic acids Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 150000002531 isophthalic acids Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000002895 organic esters Chemical class 0.000 description 2
- 150000003022 phthalic acids Chemical class 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- HFVMEOPYDLEHBR-UHFFFAOYSA-N (2-fluorophenyl)-phenylmethanol Chemical compound C=1C=CC=C(F)C=1C(O)C1=CC=CC=C1 HFVMEOPYDLEHBR-UHFFFAOYSA-N 0.000 description 1
- BHQCQFFYRZLCQQ-UHFFFAOYSA-N (3alpha,5alpha,7alpha,12alpha)-3,7,12-trihydroxy-cholan-24-oic acid Natural products OC1CC2CC(O)CCC2(C)C2C1C1CCC(C(CCC(O)=O)C)C1(C)C(O)C2 BHQCQFFYRZLCQQ-UHFFFAOYSA-N 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 239000004380 Cholic acid Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical class CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001279 adipic acids Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003613 bile acid Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- BHQCQFFYRZLCQQ-OELDTZBJSA-N cholic acid Chemical compound C([C@H]1C[C@H]2O)[C@H](O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H]([C@@H](CCC(O)=O)C)[C@@]2(C)[C@@H](O)C1 BHQCQFFYRZLCQQ-OELDTZBJSA-N 0.000 description 1
- 229960002471 cholic acid Drugs 0.000 description 1
- 235000019416 cholic acid Nutrition 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- KXGVEGMKQFWNSR-UHFFFAOYSA-N deoxycholic acid Natural products C1CC2CC(O)CCC2(C)C2C1C1CCC(C(CCC(O)=O)C)C1(C)C(O)C2 KXGVEGMKQFWNSR-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002691 malonic acids Chemical class 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid group Chemical group C(CCCCCCC\C=C/CCCCCCCC)(=O)O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 150000002913 oxalic acids Chemical class 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 150000003870 salicylic acids Chemical class 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000003444 succinic acids Chemical class 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nonmetallic Welding Materials (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/175,272 US4298407A (en) | 1980-08-04 | 1980-08-04 | Flux treated solder powder composition |
| US175,272 | 1980-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1177288A true CA1177288A (en) | 1984-11-06 |
Family
ID=22639646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000382924A Expired CA1177288A (en) | 1980-08-04 | 1981-07-30 | Flux treated solder powder composition |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4298407A (forum.php) |
| EP (1) | EP0045496B1 (forum.php) |
| JP (1) | JPS5752588A (forum.php) |
| CA (1) | CA1177288A (forum.php) |
| DE (1) | DE3167195D1 (forum.php) |
| DK (1) | DK346281A (forum.php) |
| GR (1) | GR75305B (forum.php) |
| IE (1) | IE51897B1 (forum.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998015375A1 (de) * | 1996-10-04 | 1998-04-16 | Nils Claussen | Pulverförmige zubereitung von wasserempfindlichen anorganischen substanzen, ihre herstellung und verwendung |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0618082B2 (ja) * | 1985-09-30 | 1994-03-09 | 富士ゼロックス株式会社 | 電気接続用異方導電材料 |
| US4670298A (en) * | 1985-12-09 | 1987-06-02 | Northern Telecom Limited | Fluorescent solder paste mixture |
| US4739920A (en) * | 1986-03-19 | 1988-04-26 | Rca Corporation | Soldering process |
| GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
| JP2564151B2 (ja) * | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | コーティングはんだ粉末 |
| JP2564152B2 (ja) * | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | はんだペースト |
| JP2719832B2 (ja) * | 1989-06-09 | 1998-02-25 | ユーホーケミカル株式会社 | はんだペースト |
| US5011546A (en) * | 1990-04-12 | 1991-04-30 | International Business Machines Corporation | Water soluble solder flux and paste |
| US5141568A (en) * | 1990-05-15 | 1992-08-25 | Hughes Aircraft Company | Water-soluble soldering paste |
| JP2780474B2 (ja) * | 1990-10-09 | 1998-07-30 | 松下電器産業株式会社 | クリーム半田の製造方法 |
| JPH04237590A (ja) * | 1991-01-22 | 1992-08-26 | Matsushita Electric Ind Co Ltd | クリーム半田とその製造方法及び半田付け材料 |
| US5196070A (en) * | 1991-12-31 | 1993-03-23 | International Business Machines Corporation | Thermally stable water soluble solder flux and paste |
| US5272007A (en) * | 1992-02-21 | 1993-12-21 | Union Carbide Chemicals & Plastics Technology Corporation | Solder powder coated with parylene |
| US6476487B2 (en) | 1992-10-30 | 2002-11-05 | Showa Denko K.K. | Solder circuit |
| US5556023A (en) * | 1992-10-30 | 1996-09-17 | Showa Denko K.K. | Method of forming solder film |
| JP2592757B2 (ja) * | 1992-10-30 | 1997-03-19 | 昭和電工株式会社 | はんだ回路基板及びその形成方法 |
| JPH06226487A (ja) * | 1993-02-02 | 1994-08-16 | Nec Corp | クリームはんだ |
| DE59307711D1 (de) * | 1993-05-13 | 1998-01-02 | Endress Hauser Gmbh Co | Verfahren zum Herstellen einer Aktivhartlotpaste |
| US5674326A (en) * | 1994-09-21 | 1997-10-07 | Motorola, Inc. | Solder paste |
| JP2606610B2 (ja) * | 1994-12-20 | 1997-05-07 | 日本電気株式会社 | ソルダーペースト、半導体装置の接続方法および接続構造 |
| US5789068A (en) * | 1995-06-29 | 1998-08-04 | Fry's Metals, Inc. | Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors |
| JP3493101B2 (ja) * | 1996-08-15 | 2004-02-03 | 三井金属鉱業株式会社 | 半田粉及びその製造方法、及びその半田粉を用いた半田ペースト |
| EP1099507B1 (en) * | 1998-07-02 | 2006-10-25 | Matsushita Electric Industrial Co., Ltd. | Solder powder and method for preparing the same and solder paste |
| JP3503523B2 (ja) | 1999-04-09 | 2004-03-08 | 千住金属工業株式会社 | はんだボールおよびはんだボールの被覆方法 |
| US6887319B2 (en) * | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
| US20030221748A1 (en) * | 2002-05-30 | 2003-12-04 | Fry's Metals, Inc. | Solder paste flux system |
| WO2005007919A2 (en) * | 2003-07-09 | 2005-01-27 | Fry's Metals Inc. | Coating metal particles |
| JP5248772B2 (ja) * | 2003-07-09 | 2013-07-31 | フライズ メタルズ インコーポレイテッド | 沈積とパターン化方法 |
| US7413805B2 (en) * | 2005-02-25 | 2008-08-19 | Fry's Metals, Inc. | Preparation of metallic particles for electrokinetic or electrostatic deposition |
| US7797808B2 (en) * | 2005-10-11 | 2010-09-21 | General Electric Company | Thermal management system and associated method |
| US7767032B2 (en) * | 2006-06-30 | 2010-08-03 | W.C. Heraeus Holding GmbH | No-clean low-residue solder paste for semiconductor device applications |
| US9682447B2 (en) | 2010-08-20 | 2017-06-20 | Henkel IP & Holding GmbH | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes |
| JP6083217B2 (ja) * | 2012-12-04 | 2017-02-22 | 三菱マテリアル株式会社 | Ａｕ−Ｓｎ−Ｂｉ合金粉末ペースト及びＡｕ−Ｓｎ−Ｂｉ合金薄膜の成膜方法 |
| JP6191143B2 (ja) * | 2013-01-28 | 2017-09-06 | 三菱マテリアル株式会社 | ＳｎＡｇＣｕ系はんだ粉末の製造方法及びこの粉末を用いたはんだ用ペーストの調製方法 |
| JP6192444B2 (ja) * | 2013-08-30 | 2017-09-06 | 株式会社タムラ製作所 | 微細パターン塗布用はんだ組成物 |
| US11319465B2 (en) * | 2017-02-06 | 2022-05-03 | Kyung Sub Lee | Method for manufacturing fine-pitch anisotropic conductive adhesive and fine-pitch anisotropic conductive adhesive manufactured by same method |
| US10730150B2 (en) * | 2017-08-07 | 2020-08-04 | Honeywell International Inc. | Flowable brazing compositions and methods of brazing metal articles together using the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2898255A (en) * | 1958-06-30 | 1959-08-04 | Ibm | Soldering flux composition |
| US3235414A (en) * | 1962-01-11 | 1966-02-15 | Continental Can Co | Organic flux for soldering |
| DE1483474C3 (de) * | 1963-05-20 | 1974-11-21 | Mitsutaro Kyoto Ohara (Japan) | Verfahren zur Herstellung eines vorgeformten Weichlotes |
| US3436278A (en) * | 1966-08-08 | 1969-04-01 | Ibm | Glycol soldering fluxes |
| US3617345A (en) * | 1969-10-30 | 1971-11-02 | Aluminum Co Of America | Method of manufacturing aluminum coated ferrous base articles |
| JPS4634211B1 (forum.php) * | 1970-01-14 | 1971-10-07 | ||
| JPS4926826A (forum.php) * | 1972-07-10 | 1974-03-09 | ||
| JPS5021308A (forum.php) * | 1973-06-28 | 1975-03-06 | ||
| GB1550648A (en) * | 1976-06-11 | 1979-08-15 | Multicore Solders Ltd | Soft soldering |
| US4194931A (en) * | 1977-05-16 | 1980-03-25 | Western Electric Co. | Soldering flux |
| US4168996A (en) * | 1977-05-16 | 1979-09-25 | Western Electric Company, Inc. | Soldering flux |
| US4165244A (en) * | 1977-10-21 | 1979-08-21 | Jacobs Norman L | Soldering flux and method of using same |
-
1980
- 1980-08-04 US US06/175,272 patent/US4298407A/en not_active Expired - Lifetime
-
1981
- 1981-07-30 CA CA000382924A patent/CA1177288A/en not_active Expired
- 1981-07-31 DE DE8181106016T patent/DE3167195D1/de not_active Expired
- 1981-07-31 IE IE1760/81A patent/IE51897B1/en unknown
- 1981-07-31 EP EP81106016A patent/EP0045496B1/en not_active Expired
- 1981-08-03 JP JP56120800A patent/JPS5752588A/ja active Pending
- 1981-08-03 GR GR65703A patent/GR75305B/el unknown
- 1981-08-03 DK DK346281A patent/DK346281A/da not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998015375A1 (de) * | 1996-10-04 | 1998-04-16 | Nils Claussen | Pulverförmige zubereitung von wasserempfindlichen anorganischen substanzen, ihre herstellung und verwendung |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5752588A (en) | 1982-03-29 |
| IE811760L (en) | 1982-02-04 |
| IE51897B1 (en) | 1987-04-29 |
| DE3167195D1 (en) | 1984-12-20 |
| EP0045496A1 (en) | 1982-02-10 |
| GR75305B (forum.php) | 1984-07-13 |
| EP0045496B1 (en) | 1984-11-14 |
| DK346281A (da) | 1982-02-05 |
| US4298407A (en) | 1981-11-03 |
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