CA1154111A - Trimmable electrical inductors and method of making the same - Google Patents
Trimmable electrical inductors and method of making the sameInfo
- Publication number
- CA1154111A CA1154111A CA000361730A CA361730A CA1154111A CA 1154111 A CA1154111 A CA 1154111A CA 000361730 A CA000361730 A CA 000361730A CA 361730 A CA361730 A CA 361730A CA 1154111 A CA1154111 A CA 1154111A
- Authority
- CA
- Canada
- Prior art keywords
- inductor
- layer
- inductance
- substrate
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000000696 magnetic material Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims description 2
- 238000009966 trimming Methods 0.000 abstract description 14
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 238000000227 grinding Methods 0.000 abstract description 2
- 230000001419 dependent effect Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229940108928 copper Drugs 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
- H01R4/48185—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
Trimming either a thin or thick film inductor located on one surface of an electrically non-conductive substrate is achieved by applying to the opposite surface of the substrate a layer of highly conductive metal or of magnetic material of high resistivity. When a highly con-ductive metal is used, the inductance is decreased. Pro-gressively reducing either the thickness or the area of the layer, as by grinding, progressively increases the inductance until all of the metal layer has been removed.
When a magnetic layer is used, the inductance is increased by an amount dependent on the thickness and the area of the magnetic layer.
Trimming either a thin or thick film inductor located on one surface of an electrically non-conductive substrate is achieved by applying to the opposite surface of the substrate a layer of highly conductive metal or of magnetic material of high resistivity. When a highly con-ductive metal is used, the inductance is decreased. Pro-gressively reducing either the thickness or the area of the layer, as by grinding, progressively increases the inductance until all of the metal layer has been removed.
When a magnetic layer is used, the inductance is increased by an amount dependent on the thickness and the area of the magnetic layer.
Description
TRIMMABLE ELECTRICAL INDUCTORS
AND METHOD OF MAKING THE SAME
, BACKGROUND OF THE INVENTION
This inve~tion relates to electrical induct-ors, and more particularly to trimmable thick and thin ~ilm inductors. ;~
:.
When inductors are employed in tuned circuits, filters, etc.,~ it is essential that the inductance be ad-:
; ~ justable to a desired value~and~be maintained at that : : :
value. It is des;irable to use microelectronic clrcuit construction in many applications to provid~ miniature ~ electronic equipment. One~problem as~sociated with such ; ~ ~lO ~c~ircuits~is that miniature components which are avai~able ; ar~e not adjustable, and it is difficult to work with them to adjust or ~align the circuit because of the small size.
:~ .
To the best of my knowledge, there has been no attempt made to adjust the inductance of a thin or thick film inductor of the type exemplified in U. S. Patent No.
3,785,046 ~ithout physical alteration of the inductor itself or to the circuit in which the inductor is being :.
~LlS~lil applied. It is difficult and impracticable to make an electrical connection to a point on the winding of the inductor other than the start and finish terminals provided.
It is obvious that an attempt ko make a connection elsewhere on the winding would require breaking through the dielectric layers, thereby breaking the hermetic seal and exposing the winding to the deleterious elements in the environment.
Furthermore, in such a case, the trimming range is limited by the amount contributed by the last turn of the inductor, since only the last turn is accessible, dis-regarding the~breaking of the hermetic seal.
In a spiral inductor however, all the turns of the inductor are accessible, assuming the inductor is not sealed before trimming. The tap can be moved until the desired inductance is obtained, and then the tap connection is made permanent by soldering or bonding. In practice, however, this is a delicate and precise alteration, especial-ly when the inductance value is low. The position and length of the wire at the tap must be maintained from trimming to the final permanent attachment. Altering the physical characteristics of such inductors is a meticulous and time-consuming function which necessarily adds to the manufactur-ing time and expense.
In its basic concept, this disclosure provides for the trimming of thick and thin film inductors mounted on one surface of a substrate by applying to the opposite
AND METHOD OF MAKING THE SAME
, BACKGROUND OF THE INVENTION
This inve~tion relates to electrical induct-ors, and more particularly to trimmable thick and thin ~ilm inductors. ;~
:.
When inductors are employed in tuned circuits, filters, etc.,~ it is essential that the inductance be ad-:
; ~ justable to a desired value~and~be maintained at that : : :
value. It is des;irable to use microelectronic clrcuit construction in many applications to provid~ miniature ~ electronic equipment. One~problem as~sociated with such ; ~ ~lO ~c~ircuits~is that miniature components which are avai~able ; ar~e not adjustable, and it is difficult to work with them to adjust or ~align the circuit because of the small size.
:~ .
To the best of my knowledge, there has been no attempt made to adjust the inductance of a thin or thick film inductor of the type exemplified in U. S. Patent No.
3,785,046 ~ithout physical alteration of the inductor itself or to the circuit in which the inductor is being :.
~LlS~lil applied. It is difficult and impracticable to make an electrical connection to a point on the winding of the inductor other than the start and finish terminals provided.
It is obvious that an attempt ko make a connection elsewhere on the winding would require breaking through the dielectric layers, thereby breaking the hermetic seal and exposing the winding to the deleterious elements in the environment.
Furthermore, in such a case, the trimming range is limited by the amount contributed by the last turn of the inductor, since only the last turn is accessible, dis-regarding the~breaking of the hermetic seal.
In a spiral inductor however, all the turns of the inductor are accessible, assuming the inductor is not sealed before trimming. The tap can be moved until the desired inductance is obtained, and then the tap connection is made permanent by soldering or bonding. In practice, however, this is a delicate and precise alteration, especial-ly when the inductance value is low. The position and length of the wire at the tap must be maintained from trimming to the final permanent attachment. Altering the physical characteristics of such inductors is a meticulous and time-consuming function which necessarily adds to the manufactur-ing time and expense.
In its basic concept, this disclosure provides for the trimming of thick and thin film inductors mounted on one surface of a substrate by applying to the opposite
- 2 -- ~ . . .
., . , : .
` ` 115~
surface of the substrate a layer of highly conductive metal or of magnetic material of high resistivity.
It is by virtue of the foregoing basic concept that the principal objective is achieved; namely, to overcome the afore-mentioned disadvantages and limitatlons associated with the prior methods of trimming thick and thin film inductors.
Another objective is the provision of an inductor of the class described which has a high stability of trimmed inductance.
Another important objective is the provision of an in-ductor of the class described ln which the inductance may be in-creased or decreased as required by specifications simply through the choice of amount and type of coating applied to the surface of the substrate opposite the inductor.
A further objective is the provision of a method for trimming inductors of the class described in which the seal or passivation of the inductor is not affected by the trimming process.
A still further objective is the provision of a trimm-able inductor of the class described which is of simplified construction for economical manufacture.
More particularly in accordance with one aspect of the invention there is provided a trimmable inductor, comprising:
a) an electrically non-conductive substrate, b~ an electrical inductor mounted on one surface of sald substrate and having a certain value of inductance, and . ..
..''~,, .: ,, .
,: ~ , , . . . :
115~
c) mounted on the surface o~ the substrate opposite said inductor a layer of material characterized by being capable of being changed in thickness or area to adjust said inductor to a predetermined value of inductance different rom said certain value. The layer may be a highly conductive metal or a magnetic material of high resistivity~
In accordance with another aspect of the invention there is provided the method of making a trimmable thin or thick film inductor comprising:
a) mounting on one surface of an electrically non-conductive substrate a thick or thin film inductor ~`
: having a certain value of industance, and b) mounting on the surface of the substrate opposite the inductor a layer of material characterized by being capable of being changed in thickness or area to adjust said inductor to a predetermined value of in- .:
ductance different from said certain value. If the layer is a hlghly electrically conductive material, reducing its thickness or area increases the inductance.
If:the layer is a magnetic material of high resistivity : ~ reducing the thickness or area o~ the layer reduces the inductance.
In accordance with another aspect of the invention there :: is provided the method of adjusting the inductance of a thin or thick film inductor having a certain value of inductance and mounted on one sur~ac~e of a substrate, comprising mounting on the ^-, ;- .. :- :
,: :: : -: , ~ ~
.. . . . .
~lS4~
surface of said substrate opposite the inductor a layer of material characterized by being capable of being changed in thickness or area to change said certain value of inductance, and changing the thickness or area of said layer to adjust said inductor to a predetermined value of inductance different from said certain value.
The foregoing and other objects and advantages of this disclosure will appear from the following detailed description, taken in connection with the accompanying ' . - ., .~ - .
: ~ - . . : -. . . - , ,:
~` llS~
4.
drawings of preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a plan view of a trimmabie inductor embodying the features of this invention.
Fig. 2 is a side elevation o the inductor and substrate shown in Figure 1 showing the metal coating on the surface of the substrate opposite the inductor.
Fig. 3 is a plan view of a second embodiment of a trimmablP inductor embodying the features of this 10 `invention.
Fig. 4 is a side elevation of the inductor and substrate of Fig. 3 showing the magnetic coating on the surface of the substrate opposite the inductorO
DESCRIPTION OF THE PREFERRED EMBODIMENTS
An eLectrically non~conductive substrate 10 -is shown in the drawings, and may be formed of any suit-able insulating material such as alumina (A1203). One ~`
surface of the substrate 10 provides a base for a ~hin or thick film inductor 12~ It will be understood that any thin or thick film inductor mounted on an electrically non-conductive substrate may be used, including spiral in-duc~ors made either by thin fiLm or thick film processO
The inductor coil illustrated is described in U. S. Patent No. 3,785,046.
As shown in Fig. 2, the surface of the sub-strate 10 opposite the inductor l2 is coated with a metal layer 14 such as aluminum, copper, gold, or other highly electrically conductive metal. When an alternating current - . , -, ;
115~
.
Jj flows through the inductor 12, the varying magnetic fie~d induces eddy currents in the metal layer 14 in such a dir-ection that the magnetic field produced by the eddy cur-rents opposes the magnetic field produced by the current in the ind~ctor. As a result, the application of the metal layer reduces the inductance of the inductor. The amount of reduction depends on the diameter of the inductor coil, the thickness of the substrate, and the thickness or the area of the metal layer.
Removing the metal layer 14, as by griAding off var-ious amounts of its area or thicknessJincrease the induct-ance untiL all of the metal layer is removed, ~ is desir-able to use metal of high conductivity in the layer to min-imize the loss reflected into the inductor circuit. The re-flected loss reduces the Q-factor of the inductor.
For example, in an inductor having a coil with an outside diameter of .100" on a 10 mil, thick alumina sub-strate~ the inductance is reduced by about 35% when a cop-per coating 1 mil. thick is placed on the lower surface of the substrate. Thus a trimming range of 35% is feasible~
In the~embodiment o Figs. 3-and-4j a magnetic lay-er 16 of the high resistivity is used in place of the metal layer 14 described hereinbeore. The inductance of the coil is increased due to the proximity of the magnetic layer.
When the magnetic layer is partially removed, either in area or in thickness, the inductance decreases until all of the magnetic layer is removed. The a~ount of increase in inductance depends on the permeability of the magnetic mat-: ;
-. .- - - . ~ . , , . . : -. - ~ .. : : : , : ! : :
:' ` . ' : '' : ''' .. ':
., , , ,, " .
f erial used and the thickness or area of the layer.
For example, in an inductor having a coil with an outside diameter of .055" on a 10 mil. thick ~lumina substrate, the inductance i8 increased by about 17% when a magnetic alpha ferrite layer of 2 mil. thickness i8 applied to the opposite surface of the substrate. Con-sequently, the trimming range is about 17% in this case.
Therefore, it will be understood that the funct-ion of the metal coating is to provide an overall reduct-ion in inductance from the value provided by the inductorper se. Trimming to increase the inductance by various amounts is accomplished by removing various amounts of the thickness or, preferably, the are~ of the metal coating.
Use of the magnetic CoatiQg increases the inductance ~rom the value provided by the inductor per se. Trimming to dec$ease the inductance is accomplished by removing various amounts of the thickness or area of the magnetic coat~ng. The function of the magnetic coating therefore is to provide for an overall increase in inductance.
The method using a magnetic coating is more des-irable, since the increa&e in inductance ~ d much smaller reflected loss result in higher Q-factor ~ the lnductor.
The metal coating, however, can be easily re-placed when over-trimmedg by painting conductive paint or epoxy to replace the trimmed areas.
.
., ,. . ~, . .. ~
~1S411 ~
The trimming of inductance may be accomplished by grinding off the metal or magnetic coating on the sub-strate after it is mounted in a circuit package with the coated surface exposed. Trimming by laser is also feasible.
Therefore, it will be apparent to those skilled in the art that this disclosure provides a thin film or thick film inductor which is trimmed without affecting the hermetic seal or altering the physical characteristics of the inductor or the circuit in which the inductor is being applied. It will also be appreciated that the inductor may be trimmed during manufacture or after being incorporated in a circuit package.
It will also be apparent to those skilled in the art that various changes may be made in the size, shape, and arrangement of parts described hereinbefore without departing from the spirit of this invention and the scope of the a~pended claims.
., . , : .
` ` 115~
surface of the substrate a layer of highly conductive metal or of magnetic material of high resistivity.
It is by virtue of the foregoing basic concept that the principal objective is achieved; namely, to overcome the afore-mentioned disadvantages and limitatlons associated with the prior methods of trimming thick and thin film inductors.
Another objective is the provision of an inductor of the class described which has a high stability of trimmed inductance.
Another important objective is the provision of an in-ductor of the class described ln which the inductance may be in-creased or decreased as required by specifications simply through the choice of amount and type of coating applied to the surface of the substrate opposite the inductor.
A further objective is the provision of a method for trimming inductors of the class described in which the seal or passivation of the inductor is not affected by the trimming process.
A still further objective is the provision of a trimm-able inductor of the class described which is of simplified construction for economical manufacture.
More particularly in accordance with one aspect of the invention there is provided a trimmable inductor, comprising:
a) an electrically non-conductive substrate, b~ an electrical inductor mounted on one surface of sald substrate and having a certain value of inductance, and . ..
..''~,, .: ,, .
,: ~ , , . . . :
115~
c) mounted on the surface o~ the substrate opposite said inductor a layer of material characterized by being capable of being changed in thickness or area to adjust said inductor to a predetermined value of inductance different rom said certain value. The layer may be a highly conductive metal or a magnetic material of high resistivity~
In accordance with another aspect of the invention there is provided the method of making a trimmable thin or thick film inductor comprising:
a) mounting on one surface of an electrically non-conductive substrate a thick or thin film inductor ~`
: having a certain value of industance, and b) mounting on the surface of the substrate opposite the inductor a layer of material characterized by being capable of being changed in thickness or area to adjust said inductor to a predetermined value of in- .:
ductance different from said certain value. If the layer is a hlghly electrically conductive material, reducing its thickness or area increases the inductance.
If:the layer is a magnetic material of high resistivity : ~ reducing the thickness or area o~ the layer reduces the inductance.
In accordance with another aspect of the invention there :: is provided the method of adjusting the inductance of a thin or thick film inductor having a certain value of inductance and mounted on one sur~ac~e of a substrate, comprising mounting on the ^-, ;- .. :- :
,: :: : -: , ~ ~
.. . . . .
~lS4~
surface of said substrate opposite the inductor a layer of material characterized by being capable of being changed in thickness or area to change said certain value of inductance, and changing the thickness or area of said layer to adjust said inductor to a predetermined value of inductance different from said certain value.
The foregoing and other objects and advantages of this disclosure will appear from the following detailed description, taken in connection with the accompanying ' . - ., .~ - .
: ~ - . . : -. . . - , ,:
~` llS~
4.
drawings of preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a plan view of a trimmabie inductor embodying the features of this invention.
Fig. 2 is a side elevation o the inductor and substrate shown in Figure 1 showing the metal coating on the surface of the substrate opposite the inductor.
Fig. 3 is a plan view of a second embodiment of a trimmablP inductor embodying the features of this 10 `invention.
Fig. 4 is a side elevation of the inductor and substrate of Fig. 3 showing the magnetic coating on the surface of the substrate opposite the inductorO
DESCRIPTION OF THE PREFERRED EMBODIMENTS
An eLectrically non~conductive substrate 10 -is shown in the drawings, and may be formed of any suit-able insulating material such as alumina (A1203). One ~`
surface of the substrate 10 provides a base for a ~hin or thick film inductor 12~ It will be understood that any thin or thick film inductor mounted on an electrically non-conductive substrate may be used, including spiral in-duc~ors made either by thin fiLm or thick film processO
The inductor coil illustrated is described in U. S. Patent No. 3,785,046.
As shown in Fig. 2, the surface of the sub-strate 10 opposite the inductor l2 is coated with a metal layer 14 such as aluminum, copper, gold, or other highly electrically conductive metal. When an alternating current - . , -, ;
115~
.
Jj flows through the inductor 12, the varying magnetic fie~d induces eddy currents in the metal layer 14 in such a dir-ection that the magnetic field produced by the eddy cur-rents opposes the magnetic field produced by the current in the ind~ctor. As a result, the application of the metal layer reduces the inductance of the inductor. The amount of reduction depends on the diameter of the inductor coil, the thickness of the substrate, and the thickness or the area of the metal layer.
Removing the metal layer 14, as by griAding off var-ious amounts of its area or thicknessJincrease the induct-ance untiL all of the metal layer is removed, ~ is desir-able to use metal of high conductivity in the layer to min-imize the loss reflected into the inductor circuit. The re-flected loss reduces the Q-factor of the inductor.
For example, in an inductor having a coil with an outside diameter of .100" on a 10 mil, thick alumina sub-strate~ the inductance is reduced by about 35% when a cop-per coating 1 mil. thick is placed on the lower surface of the substrate. Thus a trimming range of 35% is feasible~
In the~embodiment o Figs. 3-and-4j a magnetic lay-er 16 of the high resistivity is used in place of the metal layer 14 described hereinbeore. The inductance of the coil is increased due to the proximity of the magnetic layer.
When the magnetic layer is partially removed, either in area or in thickness, the inductance decreases until all of the magnetic layer is removed. The a~ount of increase in inductance depends on the permeability of the magnetic mat-: ;
-. .- - - . ~ . , , . . : -. - ~ .. : : : , : ! : :
:' ` . ' : '' : ''' .. ':
., , , ,, " .
f erial used and the thickness or area of the layer.
For example, in an inductor having a coil with an outside diameter of .055" on a 10 mil. thick ~lumina substrate, the inductance i8 increased by about 17% when a magnetic alpha ferrite layer of 2 mil. thickness i8 applied to the opposite surface of the substrate. Con-sequently, the trimming range is about 17% in this case.
Therefore, it will be understood that the funct-ion of the metal coating is to provide an overall reduct-ion in inductance from the value provided by the inductorper se. Trimming to increase the inductance by various amounts is accomplished by removing various amounts of the thickness or, preferably, the are~ of the metal coating.
Use of the magnetic CoatiQg increases the inductance ~rom the value provided by the inductor per se. Trimming to dec$ease the inductance is accomplished by removing various amounts of the thickness or area of the magnetic coat~ng. The function of the magnetic coating therefore is to provide for an overall increase in inductance.
The method using a magnetic coating is more des-irable, since the increa&e in inductance ~ d much smaller reflected loss result in higher Q-factor ~ the lnductor.
The metal coating, however, can be easily re-placed when over-trimmedg by painting conductive paint or epoxy to replace the trimmed areas.
.
., ,. . ~, . .. ~
~1S411 ~
The trimming of inductance may be accomplished by grinding off the metal or magnetic coating on the sub-strate after it is mounted in a circuit package with the coated surface exposed. Trimming by laser is also feasible.
Therefore, it will be apparent to those skilled in the art that this disclosure provides a thin film or thick film inductor which is trimmed without affecting the hermetic seal or altering the physical characteristics of the inductor or the circuit in which the inductor is being applied. It will also be appreciated that the inductor may be trimmed during manufacture or after being incorporated in a circuit package.
It will also be apparent to those skilled in the art that various changes may be made in the size, shape, and arrangement of parts described hereinbefore without departing from the spirit of this invention and the scope of the a~pended claims.
Claims (10)
1. A trimmable inductor, comprising:
a) an electrically non-conductive substrate, b) an electrical inductor mounted on one surface of said substrate and having a certain value of induc-tance, the opposite surface of the substrate being devoid of inductors, and c) mounted on the surface of the substrate opposite said inductor a layer of material characterized by being capable of being changed in thickness or area to adjust said inductor to a predetermined value of inductance different from said certain value.
a) an electrically non-conductive substrate, b) an electrical inductor mounted on one surface of said substrate and having a certain value of induc-tance, the opposite surface of the substrate being devoid of inductors, and c) mounted on the surface of the substrate opposite said inductor a layer of material characterized by being capable of being changed in thickness or area to adjust said inductor to a predetermined value of inductance different from said certain value.
2. The inductor of claim 1 wherein the layer is a highly conductive metal.
3. The inductor of claim 1 wherein the layer is a magnetic material of high resistivity.
4. The inductor of claim 1 wherein the thickness or the area of the layer is selected to provide a predetermined magnitude of inductance.
5. The method of adjusting the inductance of a thin or thick film inductor having a certain value of inductance and mounted on one surface of a substrate, the opposite surface of the substrate being devoid of inductors, compris-ing mounting on the surface of said substrate opposite the inductor a layer of material characterized by being capable of being changed in thickness or area to change said certain value of inductance, and changing the thickness or area of said layer to adjust said inductor to a pre-determined value of inductance different from said certain value
6. The method of claim 5 wherein the layer is a highly conductive metal, and the adjusting step comprises reducing the thickness or the area of the layer to increase the inductance to a predetermined magnitude.
7. The method of claim 5 wherein the layer is a magnetic material of high resistivity. and the adjusting step com-prises reducing the thickness or the area of the layer to decrease the inductance to a predetermined magnitude.
8. The method of making a trimmable thin or thick film inductor, comprising:
a) mounting on one surface of an electrically non-conductive substrate a thick or thin film inductor having a certain value of inductance, the opposite surface of the substrate being devoid of inductors, and b) mounting on the surface of the substrate opposite the inductor a layer of material characterized by being capable of being changed in thickness or area to adjust said inductor to a predetermined value of inductance different from said certain value.
a) mounting on one surface of an electrically non-conductive substrate a thick or thin film inductor having a certain value of inductance, the opposite surface of the substrate being devoid of inductors, and b) mounting on the surface of the substrate opposite the inductor a layer of material characterized by being capable of being changed in thickness or area to adjust said inductor to a predetermined value of inductance different from said certain value.
9. The method of claim 8 wherein the layer is a highly electrically conductive metal and including the step of reducing the thickness or area of the layer to increase the inductance of the inductor to a predetermined value
10. The method of claim 8 wherein the layer is a magnetic material of high resistivity and including the step of reducing the thickness or the area of the layer to reduce the inductance of the inductor to a predetermined value.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16168280A | 1980-06-23 | 1980-06-23 | |
| US161,682 | 1980-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1154111A true CA1154111A (en) | 1983-09-20 |
Family
ID=22582263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000361730A Expired CA1154111A (en) | 1980-06-23 | 1980-10-06 | Trimmable electrical inductors and method of making the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5713717A (en) |
| CA (1) | CA1154111A (en) |
| DE (1) | DE3045585A1 (en) |
| FR (1) | FR2485247A1 (en) |
| GB (1) | GB2079066B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4597169A (en) * | 1984-06-05 | 1986-07-01 | Standex International Corporation | Method of manufacturing a turnable microinductor |
| JPH0656813B2 (en) * | 1989-03-29 | 1994-07-27 | 株式会社村田製作所 | Frequency adjustment method for electronic components including inductors |
| FI95515C (en) * | 1993-11-01 | 1996-02-12 | Solitra Oy | Resonator construction with point-distributed circuit constant and a method for controlling a resonator construction with point-distributed circuit constant |
| GB2292016B (en) * | 1994-07-29 | 1998-07-22 | Plessey Semiconductors Ltd | Inductor device |
| GB2292015B (en) * | 1994-07-29 | 1998-07-22 | Plessey Semiconductors Ltd | Trimmable inductor structure |
| DE4442994A1 (en) * | 1994-12-02 | 1996-06-05 | Philips Patentverwaltung | Planar inductance |
| DE10162540A1 (en) * | 2001-12-19 | 2003-07-10 | Infineon Technologies Ag | Component and method for its production |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4844213U (en) * | 1971-09-25 | 1973-06-09 | ||
| DE2320500A1 (en) * | 1973-04-21 | 1974-11-07 | Licentia Gmbh | PROCESS FOR PRODUCING AND CALIBRATING A HIGH FREQUENCY COIL IN STRIP LINE TECHNOLOGY |
| DE2441317A1 (en) * | 1974-08-29 | 1976-03-11 | Siemens Ag | Pancake coil inductance equalising - uses ferrite powder paste applied to coil conductor to achieve wanted inductance |
-
1980
- 1980-09-24 GB GB8030763A patent/GB2079066B/en not_active Expired
- 1980-10-06 CA CA000361730A patent/CA1154111A/en not_active Expired
- 1980-10-28 FR FR8023060A patent/FR2485247A1/en active Pending
- 1980-12-03 DE DE19803045585 patent/DE3045585A1/en not_active Ceased
-
1981
- 1981-01-16 JP JP492181A patent/JPS5713717A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2485247A1 (en) | 1981-12-24 |
| GB2079066B (en) | 1983-09-21 |
| GB2079066A (en) | 1982-01-13 |
| DE3045585A1 (en) | 1982-01-14 |
| JPS5713717A (en) | 1982-01-23 |
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| Date | Code | Title | Description |
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