CA1121011A - Contacts et connecteurs electriques dentritiques - Google Patents

Contacts et connecteurs electriques dentritiques

Info

Publication number
CA1121011A
CA1121011A CA000301230A CA301230A CA1121011A CA 1121011 A CA1121011 A CA 1121011A CA 000301230 A CA000301230 A CA 000301230A CA 301230 A CA301230 A CA 301230A CA 1121011 A CA1121011 A CA 1121011A
Authority
CA
Canada
Prior art keywords
electrical contact
projections
contact according
dendritic
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000301230A
Other languages
English (en)
Inventor
Robert Babuka
Robert E. Heath
George J. Saxenmeyer, Jr.
Lewis K. Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1121011A publication Critical patent/CA1121011A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13016—Shape in side view
    • H01L2224/13018—Shape in side view comprising protrusions or indentations
    • H01L2224/13019—Shape in side view comprising protrusions or indentations at the bonding interface of the bump connector, i.e. on the surface of the bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/28—Contacts for sliding cooperation with identically-shaped contact, e.g. for hermaphroditic coupling devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CA000301230A 1977-04-15 1978-04-17 Contacts et connecteurs electriques dentritiques Expired CA1121011A (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US78780477A 1977-04-15 1977-04-15
US787,804 1977-04-15
US87399978A 1978-01-31 1978-01-31
US873,999 1978-01-31

Publications (1)

Publication Number Publication Date
CA1121011A true CA1121011A (fr) 1982-03-30

Family

ID=27120690

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000301230A Expired CA1121011A (fr) 1977-04-15 1978-04-17 Contacts et connecteurs electriques dentritiques

Country Status (3)

Country Link
CA (1) CA1121011A (fr)
DE (1) DE2816328C3 (fr)
IT (1) IT1112620B (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118299A (en) * 1990-05-07 1992-06-02 International Business Machines Corporation Cone electrical contact
EP0505859A1 (fr) * 1991-03-25 1992-09-30 International Business Machines Corporation Paquet électronique pour utilisations à haute densité
US5237743A (en) * 1992-06-19 1993-08-24 International Business Machines Corporation Method of forming a conductive end portion on a flexible circuit member
US5248262A (en) * 1992-06-19 1993-09-28 International Business Machines Corporation High density connector
US5281150A (en) * 1993-01-05 1994-01-25 International Business Machines Corporation Method and apparatus for connecting cable to the surface of printed circuit boards or the like
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5397240A (en) * 1993-10-26 1995-03-14 International Business Machines Corporation Electrical connector
US5399101A (en) * 1993-12-16 1995-03-21 International Business Machines Corporation Electrical connector with preloaded contact
US5934914A (en) * 1994-06-07 1999-08-10 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5953214A (en) * 1994-03-07 1999-09-14 International Business Machines Corporation Dual substrate package assembly coupled to a conducting member
US6331119B1 (en) 1999-12-28 2001-12-18 International Business Machines Corporation Conductive adhesive having a palladium matrix interface between two metal surfaces

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3061659D1 (en) * 1979-04-06 1983-02-24 Ibm Method of making prints provided with masks
DE2936816A1 (de) * 1979-08-17 1981-03-26 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Buerstenkontakt fuer leistungshalbleiterbauelemente
JPS57110690A (en) * 1980-12-24 1982-07-09 Ibm Growing of tentrite by electroplating
US5185073A (en) * 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
DE68913823T2 (de) * 1988-06-21 1994-09-22 Ibm Lösbare elektrische Verbindung.
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
US4937653A (en) * 1988-07-21 1990-06-26 American Telephone And Telegraph Company Semiconductor integrated circuit chip-to-chip interconnection scheme
US5220725A (en) * 1991-04-09 1993-06-22 Northeastern University Micro-emitter-based low-contact-force interconnection device
US5660570A (en) * 1991-04-09 1997-08-26 Northeastern University Micro emitter based low contact force interconnection device
US5297967A (en) * 1992-10-13 1994-03-29 International Business Machines Corporation Electrical interconnector with helical contacting portion and assembly using same
US5889568A (en) 1995-12-12 1999-03-30 Rainbow Displays Inc. Tiled flat panel displays
FR2757682B1 (fr) * 1996-12-20 1999-03-12 Thomson Tubes Electroniques Procede et dispositif de connexion d'un composant semiconducteur sur un substrat equipe de conducteurs
DE102006031322A1 (de) * 2006-07-06 2007-09-27 Siemens Ag Elektromechanisches Bauteil
DE102007047162B4 (de) * 2007-05-25 2011-12-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen einer Mikrostruktur oder Nanostruktur und mit Mikrostruktur oder Nanostruktur versehenes Substrat
DE102009059304B4 (de) * 2009-12-23 2014-07-03 CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH Siliziumchip mit einem daran befestigten Kabel und Verfahen zur Befestigung des Kabels
DE102017122865B3 (de) * 2017-10-02 2019-03-14 Infineon Technologies Ag Verfahren zum Bilden einer metallischen Zwischenverbindung, Verfahren zum Herstellen einer Halbleiteranordnung mit einer metallischen Zwischenverbindung und Halbleitervorrichtungsanordnung mit einer metallischen Zwischenverbindung

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118299A (en) * 1990-05-07 1992-06-02 International Business Machines Corporation Cone electrical contact
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5435057A (en) * 1990-10-30 1995-07-25 International Business Machines Corporation Interconnection method and structure for organic circuit boards
EP0505859A1 (fr) * 1991-03-25 1992-09-30 International Business Machines Corporation Paquet électronique pour utilisations à haute densité
EP0872914A2 (fr) * 1992-06-19 1998-10-21 International Business Machines Corporation Connecteur haute densité
US5237743A (en) * 1992-06-19 1993-08-24 International Business Machines Corporation Method of forming a conductive end portion on a flexible circuit member
US5248262A (en) * 1992-06-19 1993-09-28 International Business Machines Corporation High density connector
EP0872914B1 (fr) * 1992-06-19 2001-12-12 International Business Machines Corporation Connecteur haute densité
EP0574793B1 (fr) * 1992-06-19 1999-01-20 International Business Machines Corporation Connecteur à haute densité
US5281150A (en) * 1993-01-05 1994-01-25 International Business Machines Corporation Method and apparatus for connecting cable to the surface of printed circuit boards or the like
US5397240A (en) * 1993-10-26 1995-03-14 International Business Machines Corporation Electrical connector
US5399101A (en) * 1993-12-16 1995-03-21 International Business Machines Corporation Electrical connector with preloaded contact
US5953214A (en) * 1994-03-07 1999-09-14 International Business Machines Corporation Dual substrate package assembly coupled to a conducting member
US5934914A (en) * 1994-06-07 1999-08-10 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US6938338B2 (en) 1994-06-07 2005-09-06 Tessera, Inc. Method of making an electronic contact
US6331119B1 (en) 1999-12-28 2001-12-18 International Business Machines Corporation Conductive adhesive having a palladium matrix interface between two metal surfaces
US6425772B1 (en) 1999-12-28 2002-07-30 International Business Machines Corporation Conductive adhesive having a palladium matrix interface between two metal surfaces

Also Published As

Publication number Publication date
IT7822260A0 (it) 1978-04-13
DE2816328C3 (de) 1980-11-20
DE2816328B2 (de) 1980-03-20
DE2816328A1 (de) 1978-10-19
IT1112620B (it) 1986-01-20

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