CA1120601A - Thin film lossy line package - Google Patents

Thin film lossy line package

Info

Publication number
CA1120601A
CA1120601A CA000329380A CA329380A CA1120601A CA 1120601 A CA1120601 A CA 1120601A CA 000329380 A CA000329380 A CA 000329380A CA 329380 A CA329380 A CA 329380A CA 1120601 A CA1120601 A CA 1120601A
Authority
CA
Canada
Prior art keywords
conductors
dielectric
conductor
ground plane
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000329380A
Other languages
English (en)
French (fr)
Inventor
Chung W. Ho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1120601A publication Critical patent/CA1120601A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/22—Attenuating devices
    • H01P1/227—Strip line attenuators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/01023—Vanadium [V]
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    • H01L2924/01029—Copper [Cu]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Logic Circuits (AREA)
  • Dc Digital Transmission (AREA)
CA000329380A 1978-06-30 1979-06-08 Thin film lossy line package Expired CA1120601A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US920,914 1978-06-30
US05/920,914 US4210885A (en) 1978-06-30 1978-06-30 Thin film lossy line for preventing reflections in microcircuit chip package interconnections

Publications (1)

Publication Number Publication Date
CA1120601A true CA1120601A (en) 1982-03-23

Family

ID=34218325

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000329380A Expired CA1120601A (en) 1978-06-30 1979-06-08 Thin film lossy line package

Country Status (6)

Country Link
US (1) US4210885A (US20030199744A1-20031023-C00003.png)
JP (1) JPS558096A (US20030199744A1-20031023-C00003.png)
CA (1) CA1120601A (US20030199744A1-20031023-C00003.png)
DE (1) DE2920564A1 (US20030199744A1-20031023-C00003.png)
FR (1) FR2430094A1 (US20030199744A1-20031023-C00003.png)
GB (1) GB2024525B (US20030199744A1-20031023-C00003.png)

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Publication number Priority date Publication date Assignee Title
US4454529A (en) * 1981-01-12 1984-06-12 Avx Corporation Integrated circuit device having internal dampening for a plurality of power supplies
JPS57129844A (en) * 1981-01-29 1982-08-12 Mitsubishi Petrochem Co Ltd Resin coated glass bottle preventing scattering
US4446477A (en) * 1981-08-21 1984-05-01 Sperry Corporation Multichip thin film module
JPS58225657A (ja) * 1982-06-22 1983-12-27 Sanyo Electric Co Ltd 多層混成集積回路
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
JPS60134440A (ja) * 1983-12-23 1985-07-17 Hitachi Ltd 半導体集積回路装置
US4553050A (en) * 1983-12-27 1985-11-12 International Business Machines Corporation Transmission line terminator-decoupling capacitor chip for off-chip driver
US4705606A (en) * 1985-01-31 1987-11-10 Gould Inc. Thin-film electrical connections for integrated circuits
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
JPS61212096A (ja) * 1985-03-18 1986-09-20 株式会社日立製作所 多層配線板
US4703288A (en) * 1985-04-03 1987-10-27 American Telephone And Telegraph Company, At&T Bell Laboratories Interconnection lines for wafer-scale-integrated assemblies
US4692839A (en) * 1985-06-24 1987-09-08 Digital Equipment Corporation Multiple chip interconnection system and package
JPS61296800A (ja) * 1985-06-25 1986-12-27 日本電気株式会社 設計変更用電極
JPS62243345A (ja) * 1986-04-15 1987-10-23 Toshiba Corp 半導体集積回路装置
US4811082A (en) * 1986-11-12 1989-03-07 International Business Machines Corporation High performance integrated circuit packaging structure
US5097232A (en) * 1989-06-16 1992-03-17 Environmental Research Institute Of Michigan Transmission lines for wafer-scale integration and method for increasing signal transmission speeds
US4816773A (en) * 1987-05-01 1989-03-28 International Business Machines Corporation Non-inverting repeater circuit for use in semiconductor circuit interconnections
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
DE3802796A1 (de) * 1988-01-30 1989-08-10 Bosch Gmbh Robert Elektronisches geraet mit schaltmitteln zur daempfung von nach aussen dringenden hochfrequenten stoerspannungen
US5087900A (en) * 1990-11-19 1992-02-11 Reliability Incorporated Transmission line network for multiple capacitive loads
JPH07123150B2 (ja) * 1992-03-06 1995-12-25 インターナショナル・ビジネス・マシーンズ・コーポレイション ハイブリッド半導体モジュール
US5266036A (en) * 1992-06-02 1993-11-30 Hewlett-Packard Company Reduction of radio frequency emissions through terminating geometrically induced transmission lines in computer products
US5508938A (en) * 1992-08-13 1996-04-16 Fujitsu Limited Special interconnect layer employing offset trace layout for advanced multi-chip module packages
US5378927A (en) * 1993-05-24 1995-01-03 International Business Machines Corporation Thin-film wiring layout for a non-planar thin-film structure
FR2714541B1 (fr) * 1993-12-28 1996-01-26 Thomson Csf Procédé d'interconnexion de fonctions hyperfréquence.
SE9702490D0 (sv) * 1997-06-27 1997-06-27 Ericsson Telefon Ab L M Microstrip structure
JPH11177189A (ja) * 1997-12-12 1999-07-02 Fujitsu Ltd プリント基板上配線の終端構造
JP2003204340A (ja) * 2001-10-31 2003-07-18 Yazaki Corp 車載用多重通信装置
DE10319248B4 (de) * 2003-04-28 2010-11-25 Schleifring Und Apparatebau Gmbh Schleifring mit verlustbehafteter Leiterbahn
WO2005062414A1 (en) * 2003-12-24 2005-07-07 Adelaide Research & Innovation Pty Ltd Thin film impedance termination
US8213894B2 (en) 2005-12-29 2012-07-03 Intel Corporation Integrated circuit passive signal distribution
TWI381575B (zh) * 2008-12-19 2013-01-01 Askey Computer Corp 用於傳輸高頻訊號之載體及載體佈線方法
EP2849543B1 (en) * 2013-09-12 2021-02-24 Socionext Inc. Components and circuits for output termination

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3333119A (en) * 1966-06-21 1967-07-25 John G Anderson Attenuation of high frequencies in commercial frequency power trans-mission lines
US3466634A (en) * 1966-08-04 1969-09-09 Ibm Thin film microwave absorption structure
US3634789A (en) * 1969-06-30 1972-01-11 Ibm Geometrically dependent distributed-section transmission line attenuator
DE1948780A1 (de) * 1969-09-26 1971-04-08 Siemens Ag Verfahren zum Abgleichen homogener elektrischer Daempfungsglieder
US3585533A (en) * 1970-02-26 1971-06-15 Sperry Rand Corp Microwave microcircuit element with resistive high grequency energy absorber
US4060780A (en) * 1974-06-19 1977-11-29 Matsushita Electric Industrial Co., Ltd. Signal attenuator
DE2541569A1 (de) * 1975-09-18 1977-03-31 Licentia Gmbh Frequenzabhaengiges daempfungsglied
CA1073557A (en) * 1976-06-30 1980-03-11 Ven Y. Doo Multilayer interconnect system, and method of making

Also Published As

Publication number Publication date
US4210885A (en) 1980-07-01
GB2024525B (en) 1982-07-28
FR2430094B1 (US20030199744A1-20031023-C00003.png) 1984-05-11
JPS558096A (en) 1980-01-21
GB2024525A (en) 1980-01-09
JPS5758069B2 (US20030199744A1-20031023-C00003.png) 1982-12-08
DE2920564C2 (US20030199744A1-20031023-C00003.png) 1987-02-19
DE2920564A1 (de) 1980-01-10
FR2430094A1 (fr) 1980-01-25

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