CA1116708A - Connector system for connection of leadless large scale integrated circuit devices to a printed circuit board - Google Patents
Connector system for connection of leadless large scale integrated circuit devices to a printed circuit boardInfo
- Publication number
- CA1116708A CA1116708A CA000325654A CA325654A CA1116708A CA 1116708 A CA1116708 A CA 1116708A CA 000325654 A CA000325654 A CA 000325654A CA 325654 A CA325654 A CA 325654A CA 1116708 A CA1116708 A CA 1116708A
- Authority
- CA
- Canada
- Prior art keywords
- contact
- carrier
- leadless
- connector system
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90815278A | 1978-05-22 | 1978-05-22 | |
US908,152 | 1978-05-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1116708A true CA1116708A (en) | 1982-01-19 |
Family
ID=25425284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000325654A Expired CA1116708A (en) | 1978-05-22 | 1979-04-18 | Connector system for connection of leadless large scale integrated circuit devices to a printed circuit board |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS54153570A (de) |
CA (1) | CA1116708A (de) |
DE (2) | DE7915004U1 (de) |
FR (1) | FR2427029A1 (de) |
GB (1) | GB2021878B (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2479563A1 (fr) * | 1980-03-26 | 1981-10-02 | Ouest Electronic Connecteurs | Etrier de verrouillage pour circuit integre |
US4351580A (en) * | 1980-05-15 | 1982-09-28 | Augat Inc. | Carrier socket for leadless integrated circuit devices |
US4359252A (en) * | 1980-09-08 | 1982-11-16 | Amp Incorporated | Socket for a bubble memory package |
JPS5826152B2 (ja) * | 1980-11-14 | 1983-06-01 | 日本電信電話株式会社 | 多極コネクタ |
US4491377A (en) * | 1982-04-19 | 1985-01-01 | Pfaff Wayne | Mounting housing for leadless chip carrier |
US4620761A (en) * | 1985-01-30 | 1986-11-04 | Texas Instruments Incorporated | High density chip socket |
US4761140A (en) * | 1987-02-20 | 1988-08-02 | Augat Inc. | Minimum insertion force self-cleaning anti-overstress PLCC receiving socket |
JPH02113573U (de) * | 1989-02-28 | 1990-09-11 | ||
JPH02113574U (de) * | 1989-02-28 | 1990-09-11 | ||
JPH02113575U (de) * | 1989-02-28 | 1990-09-11 | ||
JPH0675416B2 (ja) * | 1991-12-20 | 1994-09-21 | 山一電機株式会社 | 接続器 |
DE102005048450B4 (de) * | 2005-10-07 | 2010-07-15 | Eads Deutschland Gmbh | Sensor mit einem auswechselbaren Sensorelement, insbesondere Drucksensor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE789688A (fr) * | 1971-10-06 | 1973-04-04 | Amp Inc | Connecteur |
US3831131A (en) * | 1971-11-08 | 1974-08-20 | Bunker Ramo | Integrated circuit package connectors |
US3999827A (en) * | 1975-10-10 | 1976-12-28 | Burroughs Corporation | Electrical connector for semiconductor device package |
-
1979
- 1979-04-18 CA CA000325654A patent/CA1116708A/en not_active Expired
- 1979-05-21 JP JP6255879A patent/JPS54153570A/ja active Granted
- 1979-05-21 DE DE19797915004 patent/DE7915004U1/de not_active Expired
- 1979-05-21 DE DE19792920943 patent/DE2920943A1/de active Granted
- 1979-05-21 FR FR7912858A patent/FR2427029A1/fr active Granted
- 1979-05-21 GB GB7917547A patent/GB2021878B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2427029A1 (fr) | 1979-12-21 |
GB2021878A (en) | 1979-12-05 |
JPS6225262B2 (de) | 1987-06-02 |
DE7915004U1 (de) | 1979-10-31 |
DE2920943A1 (de) | 1979-11-29 |
DE2920943C2 (de) | 1989-06-08 |
JPS54153570A (en) | 1979-12-03 |
GB2021878B (en) | 1983-02-23 |
FR2427029B1 (de) | 1985-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |