CA1099338A - Cooling capsule for thyristors - Google Patents

Cooling capsule for thyristors

Info

Publication number
CA1099338A
CA1099338A CA287,188A CA287188A CA1099338A CA 1099338 A CA1099338 A CA 1099338A CA 287188 A CA287188 A CA 287188A CA 1099338 A CA1099338 A CA 1099338A
Authority
CA
Canada
Prior art keywords
cooling
capsule
core
helix
subsections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA287,188A
Other languages
English (en)
French (fr)
Inventor
Heribert Ruger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of CA1099338A publication Critical patent/CA1099338A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Microwave Tubes (AREA)
  • Rectifiers (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
CA287,188A 1976-09-24 1977-09-21 Cooling capsule for thyristors Expired CA1099338A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2643072A DE2643072C2 (de) 1976-09-24 1976-09-24 Kühldose für Thyristoren
DEP2643072.8 1976-09-24

Publications (1)

Publication Number Publication Date
CA1099338A true CA1099338A (en) 1981-04-14

Family

ID=5988777

Family Applications (1)

Application Number Title Priority Date Filing Date
CA287,188A Expired CA1099338A (en) 1976-09-24 1977-09-21 Cooling capsule for thyristors

Country Status (11)

Country Link
US (1) US4161980A (en:Method)
JP (1) JPS5340826A (en:Method)
AT (1) AT354567B (en:Method)
BE (1) BE858941A (en:Method)
CA (1) CA1099338A (en:Method)
DE (1) DE2643072C2 (en:Method)
FR (1) FR2365884A1 (en:Method)
GB (1) GB1532369A (en:Method)
IN (1) IN148337B (en:Method)
SE (1) SE7709899L (en:Method)
SU (1) SU683648A3 (en:Method)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU555193B2 (en) * 1980-11-10 1986-09-18 Edwin James Freeburn Cooling device
CH651994A5 (de) * 1981-03-10 1985-10-15 Injecta Ag Fluessigkeitsgekuehlte elektrische baugruppe sowie verfahren zu deren herstellung.
US4633371A (en) * 1984-09-17 1986-12-30 Amdahl Corporation Heat pipe heat exchanger for large scale integrated circuits
US4768539A (en) * 1987-09-18 1988-09-06 Camco, Incorporated Pipeline safety valve
US4928755A (en) * 1988-05-31 1990-05-29 Doty Scientific, Inc. Microtube strip surface exchanger
DE8915913U1 (de) * 1989-02-25 1992-02-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung zur Kühlung von Leistungshalbleitern über Wärmerohre
DE4301865A1 (de) * 1993-01-25 1994-07-28 Abb Management Ag Kühldose
US6536450B1 (en) * 1999-07-07 2003-03-25 Semitool, Inc. Fluid heating system for processing semiconductor materials
WO2001002108A1 (en) 1999-07-06 2001-01-11 Semitool, Inc. Fluid heating system for processing semiconductor materials
JP4543279B2 (ja) * 2004-03-31 2010-09-15 Ｄｏｗａメタルテック株式会社 アルミニウム接合部材の製造方法
US20060005955A1 (en) * 2004-07-12 2006-01-12 Orr Troy J Heat exchanger apparatus and methods for controlling the temperature of a high purity, re-circulating liquid
US20070075595A1 (en) * 2005-09-30 2007-04-05 Rajmohan Narayanan Motor frame having embedded cooling coil
WO2016208027A1 (ja) * 2015-06-25 2016-12-29 日産自動車株式会社 鋳造装置及び鋳造方法
ES2906154T3 (es) * 2017-05-10 2022-04-13 Gea Food Solutions Weert Bv Medio de calentamiento para una máquina de envolver de flujo
GB2569306A (en) * 2017-12-12 2019-06-19 Rolls Royce Plc Thermal management device
DE112020005982B4 (de) * 2019-12-06 2025-07-31 Mitsubishi Electric Corporation Wärmesenke und Wärmesenke-Herstellungsverfahren
DE102022133174A1 (de) 2022-12-13 2024-06-13 Semikron Danfoss GmbH Kühlvorrichtung zur Kühlung elektronischer Komponenten, Verwendung derselben und Verfahren zu ihrer Herstellung
WO2024231485A1 (en) 2023-05-09 2024-11-14 Semikron Danfoss GmbH Cooling device for cooling electronic components

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1847573A (en) * 1930-03-12 1932-03-01 Commercial Iron Works Platen for presses with heating coils
US2282627A (en) * 1941-01-06 1942-05-12 Weiss Louis Draft assembly for chilled beverages
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
DE1514511C3 (de) * 1965-07-21 1979-03-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung mit elektrisch zwangsgekühlten Halbleiterbauelementen
DE1514679A1 (de) * 1966-01-29 1969-06-19 Siemens Ag Anordnung zur Fluessigkeitskuehlung einer Gleichrichterzelle
DE1564694B2 (de) * 1966-08-27 1974-08-08 Ag Brown, Boveri & Cie, Baden (Schweiz) Gleichrichteranordnung für hohe Spannung
JPS4530270Y1 (en:Method) * 1967-02-02 1970-11-20
DE2124303A1 (en:Method) * 1971-05-17 1972-10-26
DE2160302C3 (de) * 1971-12-04 1975-07-17 Siemens Ag Kühldose zum Einbau in Scheibenzellenstapel

Also Published As

Publication number Publication date
SU683648A3 (ru) 1979-08-30
BE858941A (fr) 1978-01-16
SE7709899L (sv) 1978-03-25
US4161980A (en) 1979-07-24
IN148337B (en:Method) 1981-01-17
DE2643072C2 (de) 1982-06-03
FR2365884A1 (fr) 1978-04-21
AT354567B (de) 1979-01-10
ATA507877A (de) 1979-06-15
DE2643072A1 (de) 1978-03-30
FR2365884B1 (en:Method) 1980-08-01
JPS5340826A (en) 1978-04-13
GB1532369A (en) 1978-11-15

Similar Documents

Publication Publication Date Title
CA1099338A (en) Cooling capsule for thyristors
JPH06101524B2 (ja) 半導体素子用冷却体
DE19835414C2 (de) Spulensystem für MR-Anlagen mit integrierter Kühleinheit
US5002123A (en) Low pressure high heat transfer fluid heat exchanger
KR101936972B1 (ko) 한류기
US4487253A (en) Heat exchanger for cryosurgical instruments
JP2003047258A (ja) 水冷式ヒートシンク
JPH0232762B2 (en:Method)
US4395584A (en) Cable shaped cryogenically cooled stabilized superconductor
JPS6137764B2 (en:Method)
DE19747321C2 (de) Flüssigkeitskühler für Leistungshalbleiterbauelemente
SU1199208A3 (ru) Сверхпроводник с охлаждением внутреннего типа
JPH08241943A (ja) パワー半導体素子用の液冷式冷却体
JP3468635B2 (ja) 熱交換器及び化学蓄熱式ヒートポンプ
JPS63241956A (ja) 半導体素子用冷却体
JPS62284194A (ja) フイン付ヒ−トパイプ
JP2720565B2 (ja) 永久電流スイッチ
US4038492A (en) Current feeding device for electrical apparatus with conductors cooled to a low temperature
EP0417299A1 (en) Electrically insulated heat pipe-type semiconductor cooling device
JPH0387050A (ja) 電気絶縁型ヒートパイプ式半導体冷却器
JPH0510027B2 (en:Method)
JPS59150487A (ja) 極低温電流リ−ド装置
JPH11329114A (ja) 強制冷却超電導導体およびそれを用いた超電導コイル
JPH0546711B2 (en:Method)
JPS6133264Y2 (en:Method)

Legal Events

Date Code Title Description
MKEX Expiry