CA1037876A - Touch keyboard - Google Patents

Touch keyboard

Info

Publication number
CA1037876A
CA1037876A CA233,996A CA233996A CA1037876A CA 1037876 A CA1037876 A CA 1037876A CA 233996 A CA233996 A CA 233996A CA 1037876 A CA1037876 A CA 1037876A
Authority
CA
Canada
Prior art keywords
keyboard
key
touch
gas discharge
discharge panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA233,996A
Other languages
English (en)
French (fr)
Inventor
Francis L. Challoner
Hemmige D. Varadarajan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1037876A publication Critical patent/CA1037876A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0341—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Dicing (AREA)
  • Electronic Switches (AREA)
  • Push-Button Switches (AREA)
CA233,996A 1974-12-20 1975-08-19 Touch keyboard Expired CA1037876A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2541/74A GB1487201A (en) 1974-12-20 1974-12-20 Method of manufacturing semi-conductor devices

Publications (1)

Publication Number Publication Date
CA1037876A true CA1037876A (en) 1978-09-05

Family

ID=9741400

Family Applications (1)

Application Number Title Priority Date Filing Date
CA233,996A Expired CA1037876A (en) 1974-12-20 1975-08-19 Touch keyboard

Country Status (6)

Country Link
US (1) US3953919A (en, 2012)
JP (1) JPS50105074A (en, 2012)
CA (1) CA1037876A (en, 2012)
DE (1) DE2501532A1 (en, 2012)
FR (1) FR2258707B1 (en, 2012)
GB (1) GB1487201A (en, 2012)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7609815A (nl) * 1976-09-03 1978-03-07 Philips Nv Werkwijze voor het vervaardigen van een half- geleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.
DE3044947A1 (de) * 1980-11-28 1982-07-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung sehr duenner halbleiterchips
EP0095300B1 (en) * 1982-05-25 1987-10-21 Plessey Overseas Limited Vehicle mounted doppler radar system
SE8306663L (sv) * 1982-12-08 1984-06-09 Int Rectifier Corp Forfarande for framstellning av halvledaranordning
DE3334095A1 (de) * 1983-09-21 1985-04-11 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum aetzen tiefer graeben in siliziumscheiben mit glatter oberflaeche
TW230830B (en, 2012) * 1991-11-01 1994-09-21 Furukawa Electric Co Ltd
US6127245A (en) 1997-02-04 2000-10-03 Micron Technology, Inc. Grinding technique for integrated circuits
US6017804A (en) * 1998-01-09 2000-01-25 Lucent Technologies Inc. Method and apparatus for cleaving semiconductor material
US6074934A (en) * 1998-11-20 2000-06-13 Lucent Technologies Inc. Apparatus for cleaving laser bars
US6102267A (en) * 1998-12-10 2000-08-15 Lucent Technologies, Inc. Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material
JP2004063803A (ja) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497948A (en) * 1967-09-05 1970-03-03 Transistor Automation Corp Method and apparatus for sorting semi-conductor devices
US3496617A (en) * 1967-11-08 1970-02-24 Us Navy Technique for curving piezoelectric ceramics
GB1248584A (en) * 1968-03-05 1971-10-06 Lucas Industries Ltd Thyristors and other semi-conductor devices
US3677875A (en) * 1970-08-19 1972-07-18 Raychem Corp Method and means of die matrix expansion

Also Published As

Publication number Publication date
FR2258707A1 (en, 2012) 1975-08-18
FR2258707B1 (en, 2012) 1976-12-31
GB1487201A (en) 1977-09-28
DE2501532A1 (de) 1975-07-24
JPS50105074A (en, 2012) 1975-08-19
US3953919A (en) 1976-05-04

Similar Documents

Publication Publication Date Title
US3971013A (en) Touch keyboard
US4121204A (en) Bar graph type touch switch and display device
CA1037876A (en) Touch keyboard
US4290061A (en) Electrically integrated touch input and output display system
US3772685A (en) Touch responsive electric switch and device for the use thereof
US4110749A (en) Touch display to digital encoding system
US4177354A (en) Graphic communications apparatus
EP0111879A2 (en) Touch-sensitive overlay
US7952564B2 (en) Multiple-touch sensor
US5589856A (en) System & method for dynamically labeled touch sensitive buttons in a digitizing display
US4954823A (en) Touch keyboard systems
US9123258B2 (en) Interface apparatus for touch input and tactile output communication
US5554828A (en) Integration of pen-based capability into a field emission device system
US6124848A (en) Method and apparatus for reducing flat panel display horizontal scan signal interference in the electrostatic pen operated digitizer
TW200820720A (en) Electronic device and method of arranging touch panel thereof
CN110045861B (zh) 电容检测电路和静电电容传感器设备
GB1274639A (en) Display apparatus incorporating a gas discharge panel
CN112470108A (zh) 用于触摸屏的机械键盘覆盖物
EP1847916B1 (en) Input device, electronic apparatus and method for controlling input device
JPS59119621A (ja) タツチ入力装置
EP0193177A2 (en) A touch input device
KR100453173B1 (ko) 터치패널과 그 구동장치 및 방법
JP3169217U (ja) タッチ式透明キーボード
CN210724737U (zh) 一种高灵敏度电容式硅胶按键结构和触摸式遥控器
KR20030071887A (ko) 근접 검출 매트릭스 디스플레이 장치