CA1003045A - Method and apparatus for determining the location of electrically conductive members on a structure - Google Patents

Method and apparatus for determining the location of electrically conductive members on a structure

Info

Publication number
CA1003045A
CA1003045A CA186,121A CA186121A CA1003045A CA 1003045 A CA1003045 A CA 1003045A CA 186121 A CA186121 A CA 186121A CA 1003045 A CA1003045 A CA 1003045A
Authority
CA
Canada
Prior art keywords
location
determining
electrically conductive
conductive members
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA186,121A
Other languages
English (en)
Other versions
CA186121S (en
Inventor
Ronald Bove
Eric M. Hubacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1003045A publication Critical patent/CA1003045A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07392—Multiple probes manipulating each probe element or tip individually

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Molecular Biology (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Tests Of Electronic Circuits (AREA)
CA186,121A 1972-12-26 1973-11-19 Method and apparatus for determining the location of electrically conductive members on a structure Expired CA1003045A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00318155A US3806800A (en) 1972-12-26 1972-12-26 Method and apparatus for determining the location of electrically conductive members on a structure

Publications (1)

Publication Number Publication Date
CA1003045A true CA1003045A (en) 1977-01-04

Family

ID=23236906

Family Applications (1)

Application Number Title Priority Date Filing Date
CA186,121A Expired CA1003045A (en) 1972-12-26 1973-11-19 Method and apparatus for determining the location of electrically conductive members on a structure

Country Status (6)

Country Link
US (1) US3806800A (US20080094685A1-20080424-C00004.png)
JP (1) JPS5122345B2 (US20080094685A1-20080424-C00004.png)
CA (1) CA1003045A (US20080094685A1-20080424-C00004.png)
DE (1) DE2360801C2 (US20080094685A1-20080424-C00004.png)
FR (1) FR2211658B1 (US20080094685A1-20080424-C00004.png)
GB (1) GB1431226A (US20080094685A1-20080424-C00004.png)

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US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JPS51145158U (US20080094685A1-20080424-C00004.png) * 1975-05-16 1976-11-22
US4019129A (en) * 1975-06-02 1977-04-19 Bell Telephone Laboratories, Incorporated Metallic plating testing apparatus
US4038501A (en) * 1975-07-10 1977-07-26 Volk Victor F Apparatus and method for automatically connecting to the individual conductors of a multiconductor cable
US4052793A (en) * 1976-10-04 1977-10-11 International Business Machines Corporation Method of obtaining proper probe alignment in a multiple contact environment
US4099119A (en) * 1977-02-03 1978-07-04 Honeywell Inc. Probe apparatus for in place testing of electrical circuit boards
US4214201A (en) * 1978-02-24 1980-07-22 Teradyne, Inc. Integrated circuit testing probe
US4218745A (en) * 1978-09-11 1980-08-19 Lockheed Corporation Microcomputer assisted electrical harness fabrication and testing system
JPS55164376A (en) * 1979-06-11 1980-12-22 Nippon Telegr & Teleph Corp <Ntt> Integrated circuit testing unit
DE2938567C2 (de) * 1979-09-24 1982-04-29 Siemens AG, 1000 Berlin und 8000 München Gehäuse für hochintegrierte Schaltkreise
US4463310A (en) * 1980-07-11 1984-07-31 Rca Corporation Apparatus for detecting the presence of components on a printed circuit board
US4443756A (en) * 1980-11-25 1984-04-17 Lightbody James D Apparatus and method for testing circuit boards
DE3223664A1 (de) * 1982-06-24 1983-12-29 Siemens AG, 1000 Berlin und 8000 München Messanordnung fuer duenne schichten und duennschichtbauelemente auf scheibenfoermigen substraten
DE3235119A1 (de) * 1982-09-22 1984-03-22 Siemens AG, 1000 Berlin und 8000 München Anordnung fuer die pruefung von mikroverdrahtungen und verfahren zu ihrem betrieb
US4565966A (en) * 1983-03-07 1986-01-21 Kollmorgen Technologies Corporation Method and apparatus for testing of electrical interconnection networks
US4633175A (en) * 1984-11-23 1986-12-30 Avx Corporation Testing method and apparatus for electronic components
JPS62106170U (US20080094685A1-20080424-C00004.png) * 1985-12-23 1987-07-07
EP0285799B1 (de) * 1987-03-31 1993-07-28 Siemens Aktiengesellschaft Vorrichtung für die elektrische Funktionsprüfung von Verdrahtungsfeldern, insbesondere von Leiterplatten
US4949035A (en) * 1989-01-06 1990-08-14 Digital Equipment Corporation Connector alignment verification and monitoring system
US5235740A (en) * 1991-03-22 1993-08-17 International Business Machines Corporation Press with pin detection for interference connectors
JPH05166903A (ja) * 1991-12-12 1993-07-02 Mitsubishi Electric Corp 半導体検査装置
US5420520A (en) * 1993-06-11 1995-05-30 International Business Machines Corporation Method and apparatus for testing of integrated circuit chips
JPH0763788A (ja) * 1993-08-21 1995-03-10 Hewlett Packard Co <Hp> プローブおよび電気部品／回路検査装置ならびに電気部品／回路検査方法
US5543724A (en) * 1994-10-03 1996-08-06 Motorola, Inc. Method and apparatus for locating conductive features and testing semiconductor devices
US5861743A (en) * 1995-12-21 1999-01-19 Genrad, Inc. Hybrid scanner for use in an improved MDA tester
WO1997038324A1 (en) * 1996-04-09 1997-10-16 Phase Metrics Testing of multiple magnetic recording heads
US6140827A (en) * 1997-12-18 2000-10-31 Micron Technology, Inc. Method and apparatus for testing bumped die
US6255827B1 (en) 1999-04-30 2001-07-03 International Business Machines Corporation Search routine for 2-point electrical tester
US20070245553A1 (en) * 1999-05-27 2007-10-25 Chong Fu C Fine pitch microfabricated spring contact structure & method
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6710609B2 (en) * 2002-07-15 2004-03-23 Nanonexus, Inc. Mosaic decal probe
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6297653B1 (en) * 1999-06-28 2001-10-02 Micron Technology, Inc. Interconnect and carrier with resistivity measuring contacts for testing semiconductor components
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
US7579848B2 (en) * 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
CN1575350A (zh) * 2001-08-24 2005-02-02 纳米纳克斯公司 用于在溅射薄膜中产生均匀、各向同性应力的方法和装置
US6933730B2 (en) * 2003-10-09 2005-08-23 Agilent Technologies, Inc. Methods and apparatus for testing continuity of electrical paths through connectors of circuit assemblies
US9668356B2 (en) * 2013-10-01 2017-05-30 Sierra Wireless, Inc. Method and apparatus for electrical keying of an integrated circuit package having rotationally symmetric footprint
CN109765479B (zh) * 2019-01-28 2021-10-01 合肥京东方视讯科技有限公司 一种电路板缺件检测装置和方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2887622A (en) * 1953-08-07 1959-05-19 Charles C Rayburn Electrical circuit pattern tester
US2977530A (en) * 1958-05-16 1961-03-28 Walter R Oreamuno & Co Circuit indicator device for wired control panels of business machines
US3052842A (en) * 1959-10-15 1962-09-04 Lockheed Aircraft Corp Patchcord connection aid and checking system
US3217245A (en) * 1962-03-27 1965-11-09 Whitney Blake Co Method of testing a packaged insulated cable wound on an annular core
US3528104A (en) * 1968-03-08 1970-09-08 Western Electric Co Bridge circuit methods of and apparatus for testing and locating faults in electrical circuits
DE1800657C3 (de) * 1968-10-02 1975-05-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Kontaktvorrichtung, insbesondere zur elektrischen Prüfung der Leitungszüge gedruckter oder geätzter Schaltungsplatten
GB1263644A (en) * 1969-08-07 1972-02-16 Olivetti & Co Spa Apparatus for automatically testing electronic circuits
US3654585A (en) * 1970-03-11 1972-04-04 Brooks Research And Mfg Inc Coordinate conversion for the testing of printed circuit boards

Also Published As

Publication number Publication date
JPS5122345B2 (US20080094685A1-20080424-C00004.png) 1976-07-09
JPS4991775A (US20080094685A1-20080424-C00004.png) 1974-09-02
US3806800A (en) 1974-04-23
DE2360801C2 (de) 1985-08-22
DE2360801A1 (de) 1974-06-27
GB1431226A (en) 1976-04-07
FR2211658B1 (US20080094685A1-20080424-C00004.png) 1978-12-01
FR2211658A1 (US20080094685A1-20080424-C00004.png) 1974-07-19

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