CA1001581A - Plating copper on aluminum - Google Patents

Plating copper on aluminum

Info

Publication number
CA1001581A
CA1001581A CA134,787A CA134787A CA1001581A CA 1001581 A CA1001581 A CA 1001581A CA 134787 A CA134787 A CA 134787A CA 1001581 A CA1001581 A CA 1001581A
Authority
CA
Canada
Prior art keywords
aluminum
plating copper
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA134,787A
Other languages
English (en)
Other versions
CA134787S (en
Inventor
Nanabhai R. Bharucha
Mohammad B.I. Janjua
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canada Wire and Cable Co Ltd
Original Assignee
Canada Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canada Wire and Cable Co Ltd filed Critical Canada Wire and Cable Co Ltd
Application granted granted Critical
Publication of CA1001581A publication Critical patent/CA1001581A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA134,787A 1971-11-10 1972-02-15 Plating copper on aluminum Expired CA1001581A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE110362 1971-11-10

Publications (1)

Publication Number Publication Date
CA1001581A true CA1001581A (en) 1976-12-14

Family

ID=3841568

Family Applications (1)

Application Number Title Priority Date Filing Date
CA134,787A Expired CA1001581A (en) 1971-11-10 1972-02-15 Plating copper on aluminum

Country Status (5)

Country Link
US (1) US3775264A (cs)
CA (1) CA1001581A (cs)
DE (1) DE2249037A1 (cs)
FR (1) FR2159239B1 (cs)
GB (1) GB1347936A (cs)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086146A (en) * 1975-11-12 1978-04-25 W. R. Grace & Co. Water treating process
EP0662223A1 (en) * 1992-09-28 1995-07-12 Ducoa L.P. Photoresist stripping process using n,n-dimethyl-bis(2-hydroxyethyl) quaternary ammonium hydroxide
KR100800531B1 (ko) * 2000-06-30 2008-02-04 가부시키가이샤 에바라 세이사꾸쇼 구리 도금액, 도금 방법 및 도금 장치
FR2818294A1 (fr) * 2000-12-15 2002-06-21 Thomson Csf Revetement metallique conducteur anticorrosion, procede de fabrication dudit revetement, et produit utilise dans ledit procede
CN102212855B (zh) * 2011-05-20 2012-07-11 湘潭大学 一种具有高耐腐蚀性能的可锡焊铝带及其制备工艺
CN103225091A (zh) * 2013-05-22 2013-07-31 南通鑫平制衣有限公司 一种铝材镀铜液
FR3053352A1 (fr) 2016-07-04 2018-01-05 Airbus Safran Launchers Sas Composition de protection anticorrosion
WO2020217937A1 (ja) * 2019-04-26 2020-10-29 住友電気工業株式会社 アルミニウム基線材、撚り線、及びアルミニウム基線材の製造方法
CN111769300B (zh) * 2020-02-28 2023-06-30 上海市机电设计研究院有限公司 全钒液流电池用铝基镀铜集流板的制备方法
TWI800244B (zh) * 2022-01-28 2023-04-21 奇鋐科技股份有限公司 具有熱管之散熱器總成
CN118316266A (zh) * 2023-01-06 2024-07-09 通用汽车环球科技运作有限责任公司 中空铜电导体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195454A (en) * 1939-01-07 1940-04-02 Louis Weisberg Inc Electrodeposition of copper
US2872346A (en) * 1956-05-21 1959-02-03 Miller Adolph Metal plating bath
NL199518A (cs) * 1956-10-22
SU116447A1 (ru) * 1958-06-11 1958-11-30 А.М. Ямпольский Способ нанесени медных покрытий электролизом нецианистых электролитов
NL123240C (cs) * 1960-07-23
US3280736A (en) * 1964-06-08 1966-10-25 Metalgamica S A Multi-metal planographic printing plates
CA898183A (en) * 1970-05-25 1972-04-18 R. Bharucha Nanabhai Method of plating copper on aluminum

Also Published As

Publication number Publication date
DE2249037A1 (de) 1973-05-17
GB1347936A (en) 1974-02-27
US3775264A (en) 1973-11-27
FR2159239A1 (cs) 1973-06-22
FR2159239B1 (cs) 1977-06-17

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