BRPI1011039A2 - sistema de soldagem a laser e método para soldagem por meio de um feixe de laser - Google Patents

sistema de soldagem a laser e método para soldagem por meio de um feixe de laser

Info

Publication number
BRPI1011039A2
BRPI1011039A2 BRPI1011039A BRPI1011039A BRPI1011039A2 BR PI1011039 A2 BRPI1011039 A2 BR PI1011039A2 BR PI1011039 A BRPI1011039 A BR PI1011039A BR PI1011039 A BRPI1011039 A BR PI1011039A BR PI1011039 A2 BRPI1011039 A2 BR PI1011039A2
Authority
BR
Brazil
Prior art keywords
laser
welding
laser beam
welding system
beam welding
Prior art date
Application number
BRPI1011039A
Other languages
English (en)
Inventor
Markus Haag
Martin Bleicher
Original Assignee
Tyco Electronics Amp Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Gmbh filed Critical Tyco Electronics Amp Gmbh
Publication of BRPI1011039A2 publication Critical patent/BRPI1011039A2/pt
Publication of BRPI1011039B1 publication Critical patent/BRPI1011039B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

abstract not avaible
BRPI1011039-9A 2009-05-07 2010-04-26 sistema de soldagem a laser e método para soldagem por meio de um feixe de laser BRPI1011039B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009020272.2A DE102009020272B4 (de) 2009-05-07 2009-05-07 Laserschweißsystem
PCT/EP2010/055533 WO2010127955A1 (en) 2009-05-07 2010-04-26 Laser welding system and method for welding by means of a laser beam

Publications (2)

Publication Number Publication Date
BRPI1011039A2 true BRPI1011039A2 (pt) 2017-01-17
BRPI1011039B1 BRPI1011039B1 (pt) 2019-11-05

Family

ID=42307923

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1011039-9A BRPI1011039B1 (pt) 2009-05-07 2010-04-26 sistema de soldagem a laser e método para soldagem por meio de um feixe de laser

Country Status (13)

Country Link
US (1) US20120048837A1 (pt)
EP (1) EP2427297B1 (pt)
JP (1) JP5885253B2 (pt)
KR (2) KR20120025509A (pt)
CN (1) CN102421564B (pt)
BR (1) BRPI1011039B1 (pt)
DE (1) DE102009020272B4 (pt)
HU (1) HUE038913T2 (pt)
MX (1) MX2011011771A (pt)
PL (1) PL2427297T3 (pt)
RU (1) RU2532686C9 (pt)
WO (1) WO2010127955A1 (pt)
ZA (1) ZA201108156B (pt)

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EP2478990B1 (de) * 2011-01-21 2019-04-17 Leister Technologies AG Verfahren zum Einstellen eines Laserlichtspots zur Laserbearbeitung von Werkstücken sowie Laseranordnung zur Durchführung des Verfahrens
CN104317065B (zh) * 2013-11-28 2017-02-01 中国航空工业集团公司洛阳电光设备研究所 一种双波长激光准直光学系统
DE102016106724A1 (de) * 2016-04-12 2017-10-12 Gemü Gebr. Müller Apparatebau Gmbh & Co. Kommanditgesellschaft Ventilkörper und Verfahren zum Herstellen des Ventilkörpers
DE102016116779A1 (de) * 2016-09-07 2018-03-08 Rofin-Sinar Laser Gmbh Resonatorspiegel für einen optischen Resonator einer Laservorrichtung und Laservorrichtung
KR102423197B1 (ko) * 2017-09-07 2022-07-21 솔루스첨단소재 주식회사 유기 화합물 및 이를 포함하는 유기 전계 발광 소자
RU192565U1 (ru) * 2019-04-18 2019-09-23 Федеральное государственное бюджетное образовательное учреждение высшего образования "Сибирский государственный университет геосистем и технологий" (СГУГиТ) Устройство для лазерной сварки с помощью лазерного излучения
JP2023546373A (ja) * 2020-10-09 2023-11-02 アイピージー フォトニクス コーポレーション レーザ溶接の過程におけるビーム成形システム
US11945130B2 (en) * 2021-05-03 2024-04-02 The Gillette Company Llc Methods of forming a razor blade assembly
DE102021124893A1 (de) 2021-09-27 2023-03-30 André LeGuin Vorrichtung zum Beaufschlagen eines Werkstücks mit einem Laserstrahl

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DE3831743A1 (de) * 1988-09-17 1990-03-29 Philips Patentverwaltung Vorrichtung zur bearbeitung eines werkstueckes mit laserlicht und verwendung dieser vorrichtung
JPH082511B2 (ja) * 1989-05-08 1996-01-17 松下電器産業株式会社 レーザ加工装置
US5864430A (en) * 1996-09-10 1999-01-26 Sandia Corporation Gaussian beam profile shaping apparatus, method therefor and evaluation thereof
DE19846368C1 (de) * 1998-10-08 2000-04-13 Univ Stuttgart Strahlwerkzeuge Vorrichtung zum Schneiden, Schweißen, Bohren oder Abtragen eines Werkstückes mittels eines Laserstrahles
FR2803549B1 (fr) * 2000-01-10 2002-03-29 Air Liquide Procede et installation de coupage laser d'acier doux ou de construction avec optique multifocale
DE10295946B4 (de) * 2001-02-01 2013-09-26 Electro Scientific Industries, Inc. Verfahren zum Lasertrimmen eines Schichtwiderstandes
JP3925169B2 (ja) * 2001-11-26 2007-06-06 株式会社デンソー レーザー光による材料の同時一括溶融方法及び装置
US6593540B1 (en) * 2002-02-08 2003-07-15 Honeywell International, Inc. Hand held powder-fed laser fusion welding torch
JP2003285171A (ja) * 2002-03-26 2003-10-07 Toshiba Corp レーザ除去加工装置、ハンディトーチ及びレーザ除去加工方法
JP4102092B2 (ja) * 2002-04-01 2008-06-18 新日本製鐵株式会社 レーザ溶接方法
JP2003311452A (ja) * 2002-04-26 2003-11-05 Nissan Motor Co Ltd レーザブレージング加工方法および加工装置
US20060255019A1 (en) * 2002-05-24 2006-11-16 Martukanitz Richard P Apparatus and methods for conducting laser stir welding
US20040195222A1 (en) * 2002-12-25 2004-10-07 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device
DE10308708A1 (de) * 2003-02-28 2004-09-09 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co.Kg Vorrichtung zur Beaufschlagung eines Objektes mit Laserstrahlung, Bearbeitungsvorrichtung für die Bearbeitung eines Objektes sowie Druckvorrichtung für das Drucken von Bildinformationen
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JP4630827B2 (ja) * 2006-01-30 2011-02-09 株式会社アルファ・オイコス レーザ加熱装置
JP5110830B2 (ja) * 2006-08-31 2012-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
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US8198565B2 (en) * 2007-04-11 2012-06-12 Chrysler Group Llc Laser-welding apparatus and method
DE102007018400B4 (de) * 2007-04-17 2009-04-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches System für einen Lasermaterialbearbeitungskopf

Also Published As

Publication number Publication date
US20120048837A1 (en) 2012-03-01
EP2427297B1 (en) 2018-03-21
PL2427297T3 (pl) 2018-08-31
BRPI1011039B1 (pt) 2019-11-05
KR20170007552A (ko) 2017-01-18
ZA201108156B (en) 2013-01-30
DE102009020272A1 (de) 2010-11-11
KR20120025509A (ko) 2012-03-15
WO2010127955A1 (en) 2010-11-11
JP5885253B2 (ja) 2016-03-15
JP2012525980A (ja) 2012-10-25
CN102421564A (zh) 2012-04-18
RU2532686C9 (ru) 2015-02-10
KR102034068B1 (ko) 2019-10-18
CN102421564B (zh) 2015-11-25
EP2427297A1 (en) 2012-03-14
RU2011149136A (ru) 2013-06-20
DE102009020272B4 (de) 2014-09-11
MX2011011771A (es) 2011-12-16
HUE038913T2 (hu) 2018-12-28
RU2532686C2 (ru) 2014-11-10

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Legal Events

Date Code Title Description
B15G Petition not considered as such [chapter 15.7 patent gazette]

Free format text: PETICAO NO870160067569 DE 16/11/2016 DESCONHECIDA COM BASE NO ART. 219, INCISO II DA LPI, POIS O ATO FOI PRATICADO POR TE CONNECTIVITY GERMANY GMBH, PESSOA DIVERGENTE DO DEPOSITANTE DA ENTRADA DA FASE NACIONAL DO PEDIDO TYCO ELECTRONICS AMP GMBH.

B25D Requested change of name of applicant approved

Owner name: TE CONNECTIVITY GERMANY GMBH (DE)

B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 26/04/2010, OBSERVADAS AS CONDICOES LEGAIS.