BRPI0908922A2 - processo de moldagem de resina e dispositivo de molde de moldagem de resina - Google Patents
processo de moldagem de resina e dispositivo de molde de moldagem de resinaInfo
- Publication number
- BRPI0908922A2 BRPI0908922A2 BRPI0908922A BRPI0908922A BRPI0908922A2 BR PI0908922 A2 BRPI0908922 A2 BR PI0908922A2 BR PI0908922 A BRPI0908922 A BR PI0908922A BR PI0908922 A BRPI0908922 A BR PI0908922A BR PI0908922 A2 BRPI0908922 A2 BR PI0908922A2
- Authority
- BR
- Brazil
- Prior art keywords
- resin molding
- molding process
- molding device
- resin
- molding
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/57—Exerting after-pressure on the moulding material
- B29C45/572—Exerting after-pressure on the moulding material using movable mould wall or runner parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C45/561—Injection-compression moulding
- B29C2045/5645—Resilient compression means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008092323A JP4979627B2 (ja) | 2008-03-31 | 2008-03-31 | 樹脂成形方法および樹脂成形用金型装置 |
PCT/JP2009/054509 WO2009122866A1 (ja) | 2008-03-31 | 2009-03-10 | 樹脂成形方法および樹脂成形用金型装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0908922A2 true BRPI0908922A2 (pt) | 2018-02-06 |
Family
ID=41135253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0908922A BRPI0908922A2 (pt) | 2008-03-31 | 2009-03-10 | processo de moldagem de resina e dispositivo de molde de moldagem de resina |
Country Status (5)
Country | Link |
---|---|
US (1) | US7988904B2 (pt) |
JP (1) | JP4979627B2 (pt) |
CN (1) | CN101980850B (pt) |
BR (1) | BRPI0908922A2 (pt) |
WO (1) | WO2009122866A1 (pt) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013078929A (ja) * | 2011-06-29 | 2013-05-02 | Sony Corp | 成形装置、成形品の成形方法及び成形品 |
US20160062373A1 (en) * | 2014-08-29 | 2016-03-03 | Intel Corporation | Adaptive loading and cooling |
WO2020017579A1 (ja) * | 2018-07-18 | 2020-01-23 | クミ化成株式会社 | 射出成形用金型、および成形品の製造方法 |
JP7262986B2 (ja) * | 2018-12-05 | 2023-04-24 | キヤノン株式会社 | 射出成形型、射出成形型の製造方法、射出成形機、および樹脂成形品の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51119062A (en) * | 1975-03-26 | 1976-10-19 | Nissan Chemical Ind Ltd | Low pressure extrusion molding method |
US4832676A (en) * | 1986-12-08 | 1989-05-23 | James River-Norwalk, Inc. | Method and apparatus for forming paperboard containers |
JP3253991B2 (ja) * | 1991-10-24 | 2002-02-04 | 旭化成株式会社 | 射出成形方法 |
US5439371A (en) * | 1992-10-07 | 1995-08-08 | Sumitomo Heavy Industries, Ltd. | Locally pressurizing injection molding machine |
JP3512595B2 (ja) | 1996-11-07 | 2004-03-29 | 株式会社リコー | プラスチック成形品の成形方法およびプラスチック成形品の成形用金型 |
US5656234A (en) * | 1994-08-12 | 1997-08-12 | Mitsubishi Gas Chemical Company, Inc. | Mold apparatus and injection molding method for producing hollow-structured article by injection molding |
US6929761B2 (en) * | 2001-04-19 | 2005-08-16 | Sagoma Plastics Corporation | Molded hologram apparatus method and product |
JP2002326260A (ja) * | 2001-05-07 | 2002-11-12 | Ricoh Co Ltd | プラスチック成形品の成形方法及び金型 |
JP5116194B2 (ja) * | 2001-09-04 | 2013-01-09 | 株式会社ヤクルト本社 | 炎症性腸疾患予防治療剤 |
JP2004082482A (ja) * | 2002-08-26 | 2004-03-18 | Olympus Corp | 射出成形用金型、射出成形方法及び光学素子 |
JP3963314B2 (ja) * | 2002-08-26 | 2007-08-22 | ダイキョーニシカワ株式会社 | 表皮一体成形体の成形方法 |
JP4211555B2 (ja) * | 2003-10-01 | 2009-01-21 | トヨタ自動車株式会社 | コアバック射出成形方法および射出成形品 |
JP4087818B2 (ja) * | 2004-06-09 | 2008-05-21 | 株式会社日本製鋼所 | 厚肉導光板の成形方法 |
JP4579781B2 (ja) * | 2005-06-30 | 2010-11-10 | 日本写真印刷株式会社 | 圧縮成形方法およびその装置 |
KR100644926B1 (ko) * | 2005-08-30 | 2006-11-10 | 강명호 | 분리형 금형을 구비한 사출장치 및 그 제어방법 |
-
2008
- 2008-03-31 JP JP2008092323A patent/JP4979627B2/ja active Active
-
2009
- 2009-03-10 US US12/921,511 patent/US7988904B2/en not_active Expired - Fee Related
- 2009-03-10 BR BRPI0908922A patent/BRPI0908922A2/pt not_active IP Right Cessation
- 2009-03-10 CN CN2009801113199A patent/CN101980850B/zh not_active Expired - Fee Related
- 2009-03-10 WO PCT/JP2009/054509 patent/WO2009122866A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101980850B (zh) | 2013-05-15 |
CN101980850A (zh) | 2011-02-23 |
US7988904B2 (en) | 2011-08-02 |
US20110001266A1 (en) | 2011-01-06 |
WO2009122866A1 (ja) | 2009-10-08 |
JP4979627B2 (ja) | 2012-07-18 |
JP2009241480A (ja) | 2009-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 10A ANUIDADE. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2506 DE 15-01-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |