BRPI0901827C8 - caixa de componentes, método para aumentar a refrigeração de uma caixa e sistema de componente eletrônico - Google Patents

caixa de componentes, método para aumentar a refrigeração de uma caixa e sistema de componente eletrônico

Info

Publication number
BRPI0901827C8
BRPI0901827C8 BRPI0901827A BRPI0901827A BRPI0901827C8 BR PI0901827 C8 BRPI0901827 C8 BR PI0901827C8 BR PI0901827 A BRPI0901827 A BR PI0901827A BR PI0901827 A BRPI0901827 A BR PI0901827A BR PI0901827 C8 BRPI0901827 C8 BR PI0901827C8
Authority
BR
Brazil
Prior art keywords
box
jet
synthetic jet
component
cooling
Prior art date
Application number
BRPI0901827A
Other languages
English (en)
Inventor
Russell Bult Jeffrey
Arik Mehmet
Dwight Gerstler William
Utturkar Yogen
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of BRPI0901827A2 publication Critical patent/BRPI0901827A2/pt
Publication of BRPI0901827B1 publication Critical patent/BRPI0901827B1/pt
Publication of BRPI0901827B8 publication Critical patent/BRPI0901827B8/pt
Publication of BRPI0901827C8 publication Critical patent/BRPI0901827C8/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • F15D1/08—Influencing flow of fluids of jets leaving an orifice
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)

Abstract

sistemas e métodos para a refrigeração natural melhorada por jato sintético. é prevista uma caixa de componentes (100, 300). a caixa de componentes inclui uma ou mais paredes laterais (102, 302), definindo um volume, configurado de modo à substancialmente envolver um componente gerador de calor (506) posicionado dentro do dito volume, e um conjunto de jato sintético (304, 600) posicionado em adjacência a ao menos uma das paredes laterais, o conjunto de jato sintético incluindo ao menos um ejetor do jato sintético (502) compreendendo uma porta de jato (306), a dita porta do jato sendo alinhada ao menos de uma forma perpendicular, paralela ou obliqua em relação à superfície (504) da dita ao menos uma parede lateral, o dito conjunto de jato sintético sendo configurado de modo a direcionar um jato de um fluido (510) através da dita porta, ao menos de uma forma substancialmente perpendicular a superfície, paralela a superfície ou obliqua na direção da dita superfície.
BRPI0901827A 2008-05-09 2009-05-07 caixa de componentes, método para aumentar a refrigeração de uma caixa e sistema de componente eletrônico BRPI0901827C8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/118,435 US7990705B2 (en) 2008-05-09 2008-05-09 Systems and methods for synthetic jet enhanced natural cooling
US12/118,435 2008-05-09

Publications (4)

Publication Number Publication Date
BRPI0901827A2 BRPI0901827A2 (pt) 2010-01-26
BRPI0901827B1 BRPI0901827B1 (pt) 2019-04-02
BRPI0901827B8 BRPI0901827B8 (pt) 2019-05-07
BRPI0901827C8 true BRPI0901827C8 (pt) 2019-06-25

Family

ID=40935660

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0901827A BRPI0901827C8 (pt) 2008-05-09 2009-05-07 caixa de componentes, método para aumentar a refrigeração de uma caixa e sistema de componente eletrônico

Country Status (6)

Country Link
US (2) US7990705B2 (pt)
EP (1) EP2116730B1 (pt)
JP (1) JP5237878B2 (pt)
CN (1) CN101577144B (pt)
BR (1) BRPI0901827C8 (pt)
CA (1) CA2665056C (pt)

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Also Published As

Publication number Publication date
EP2116730B1 (en) 2017-03-15
EP2116730A3 (en) 2010-03-10
JP2009272626A (ja) 2009-11-19
US7990705B2 (en) 2011-08-02
US20100271775A1 (en) 2010-10-28
BRPI0901827A2 (pt) 2010-01-26
EP2116730A2 (en) 2009-11-11
CA2665056C (en) 2013-08-20
CN101577144B (zh) 2014-08-13
JP5237878B2 (ja) 2013-07-17
USRE47790E1 (en) 2019-12-31
CA2665056A1 (en) 2009-11-09
CN101577144A (zh) 2009-11-11
BRPI0901827B1 (pt) 2019-04-02
BRPI0901827B8 (pt) 2019-05-07

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Legal Events

Date Code Title Description
B03A Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/05/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/05/2009, OBSERVADAS AS CONDICOES LEGAIS

B16C Correction of notification of the grant [chapter 16.3 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/05/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) REFERENTE A RPI 2517 DE 02/04/2019, QUANTO AO DESENHO.

B16C Correction of notification of the grant [chapter 16.3 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/05/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) REFERENTE A RPI 2522 DE 07/05/2019, QUANTO AO DESENHO.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 13A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2669 DE 03-03-2022 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.