BRPI0822814A2 - Dispositivo piezoelétrico, e, método para preservar a funcionalidade do dispositivo piezoelétrico na presença de rachaduras induzidas por tensão - Google Patents

Dispositivo piezoelétrico, e, método para preservar a funcionalidade do dispositivo piezoelétrico na presença de rachaduras induzidas por tensão

Info

Publication number
BRPI0822814A2
BRPI0822814A2 BRPI0822814-0A BRPI0822814A BRPI0822814A2 BR PI0822814 A2 BRPI0822814 A2 BR PI0822814A2 BR PI0822814 A BRPI0822814 A BR PI0822814A BR PI0822814 A2 BRPI0822814 A2 BR PI0822814A2
Authority
BR
Brazil
Prior art keywords
piezoelectric device
preserving
stress induced
induced cracks
functionality
Prior art date
Application number
BRPI0822814-0A
Other languages
English (en)
Inventor
David Alan Weston
Original Assignee
Société de Technologie Michelin
Michelin Rech Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Société de Technologie Michelin, Michelin Rech Tech filed Critical Société de Technologie Michelin
Publication of BRPI0822814A2 publication Critical patent/BRPI0822814A2/pt
Publication of BRPI0822814A8 publication Critical patent/BRPI0822814A8/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
BRPI0822814A 2008-06-26 2008-06-26 Dispositivo piezoelétrico, e, método para preservar a funcionalidade do dispositivo piezoelétrico na presença de rachaduras induzidas por tensão BRPI0822814A8 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2008/068290 WO2009157930A1 (en) 2008-06-26 2008-06-26 Sandwich piezoelectric device with solid copper electrode

Publications (2)

Publication Number Publication Date
BRPI0822814A2 true BRPI0822814A2 (pt) 2015-06-30
BRPI0822814A8 BRPI0822814A8 (pt) 2017-12-19

Family

ID=41444812

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0822814A BRPI0822814A8 (pt) 2008-06-26 2008-06-26 Dispositivo piezoelétrico, e, método para preservar a funcionalidade do dispositivo piezoelétrico na presença de rachaduras induzidas por tensão

Country Status (5)

Country Link
US (1) US8546998B2 (pt)
EP (1) EP2297776B1 (pt)
CN (1) CN102077332B (pt)
BR (1) BRPI0822814A8 (pt)
WO (1) WO2009157930A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4944145B2 (ja) * 2009-03-19 2012-05-30 太陽誘電株式会社 圧電薄膜共振子、フィルタ、通信モジュール、通信装置
US20140312737A1 (en) * 2011-03-07 2014-10-23 Bayer Intellectual Property Gmbh Layer composite comprising electroactive layers
US9780287B2 (en) 2012-11-15 2017-10-03 Compagnie Generale Des Etablissements Michelin One up, one down connection structure for piezoelectric device in tire patch
WO2015159628A1 (ja) * 2014-04-18 2015-10-22 株式会社村田製作所 押圧センサ
CN104108532B (zh) * 2014-06-23 2016-08-24 华中科技大学 一种具备自供能电子显示元件的复合包装产品
US20160027989A1 (en) * 2014-07-24 2016-01-28 Mide Technology Corporation Robust piezoelectric fluid moving devices and methods
JP2022179135A (ja) * 2021-05-21 2022-12-02 キオクシア株式会社 半導体装置
US20240072687A1 (en) * 2022-08-23 2024-02-29 Tdk Corporation Energy harvesting module and method of making an energy harvesting module

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Publication number Priority date Publication date Assignee Title
US2483677A (en) * 1946-06-24 1949-10-04 Brush Dev Co Moistureproof piezoelectric crystal and method of making same
US3046423A (en) * 1958-10-09 1962-07-24 Bliley Electric Company High shock and vibration resistant piezoelectric crystal units
US3167668A (en) * 1961-10-02 1965-01-26 Nesh Florence Piezoelectric transducers
US4190785A (en) * 1976-12-09 1980-02-26 Essex Transducers Corporation Pressure sensitive signal generator using piezoelectric coating
US4814661A (en) * 1986-05-23 1989-03-21 Washington State University Research Foundation, Inc. Systems for measurement and analysis of forces exerted during human locomotion
US5213739A (en) * 1991-06-26 1993-05-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for bonding elastomers to metals
EP0528279B1 (en) * 1991-08-09 1996-12-04 Kureha Kagaku Kogyo Kabushiki Kaisha Flexible piezoelectric device
JPH11247605A (ja) 1997-12-26 1999-09-14 United Technol Corp <Utc> タ―ボマシ―ンコンポ―ネントの振動緩衝方法及び装置
US6093997A (en) * 1998-08-03 2000-07-25 Cts Corporation Embedded piezoelectric resonator
JP4327942B2 (ja) * 1999-05-20 2009-09-09 Ｔｄｋ株式会社 薄膜圧電素子
DE10051784C1 (de) * 2000-10-19 2002-08-14 Deutsch Zentr Luft & Raumfahrt Elektromechanisches Funktionsmodul
JP2002141576A (ja) * 2000-11-02 2002-05-17 Fujitsu Ltd ピエゾ素子と電極との接合方法及び該接合方法を使用したピエゾマイクロアクチュエータ
US6639150B1 (en) * 2002-04-23 2003-10-28 Clarisay, Inc. Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the same
WO2004017063A2 (de) * 2002-07-19 2004-02-26 Siemens Aktiengesellschaft Vorrichtung und verfahren zur detektion einer substanz mithilfe eines hochfrequenten piezoakustischen dünnfilmresonators
NL1023559C2 (nl) * 2003-05-28 2004-11-30 Tno Halffabrikaat bestemd om op een trillende wand of een trillend paneel te worden bevestigd voor het actief dempen van trillingen van de wand, wand of paneel voorzien van een dergelijk halffabrikaat, systeem voorzien van een halffabrikaat en een besturingseenheid, wand of paneel voorzien van een besturingseenheid en werkwijze voor het dempen van hoorbare trillingen van een wand of paneel.
JP2005184767A (ja) * 2003-11-27 2005-07-07 Seiko Epson Corp 音叉型圧電振動片および音叉型圧電振動子の製造方法
CN101052538A (zh) 2004-11-12 2007-10-10 米其林技术公司 用于在轮胎中固定刚性结构的台面固定贴片
US7832093B2 (en) * 2007-06-11 2010-11-16 Kent State University Method of creating an electro-mechanical energy conversion device

Also Published As

Publication number Publication date
EP2297776A4 (en) 2013-02-27
WO2009157930A1 (en) 2009-12-30
EP2297776B1 (en) 2017-03-08
BRPI0822814A8 (pt) 2017-12-19
CN102077332A (zh) 2011-05-25
US20110084574A1 (en) 2011-04-14
EP2297776A1 (en) 2011-03-23
US8546998B2 (en) 2013-10-01
CN102077332B (zh) 2014-05-14

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 3A ANUIDADE

B25A Requested transfer of rights approved

Owner name: MICHELIN RECHERCHE ET TECHNIQUE S.A. (CH) , COMPAG

B08H Application fees: decision cancelled [chapter 8.8 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2336 DE 13/10/2015.

B25A Requested transfer of rights approved

Owner name: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN (FR

B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements