BRPI0821941A2 - Sistema para manusear peças a serem trabalhadas em câmaras - Google Patents
Sistema para manusear peças a serem trabalhadas em câmarasInfo
- Publication number
- BRPI0821941A2 BRPI0821941A2 BRPI0821941-9A BRPI0821941A BRPI0821941A2 BR PI0821941 A2 BRPI0821941 A2 BR PI0821941A2 BR PI0821941 A BRPI0821941 A BR PI0821941A BR PI0821941 A2 BRPI0821941 A2 BR PI0821941A2
- Authority
- BR
- Brazil
- Prior art keywords
- worked
- cameras
- handling parts
- handling
- parts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/968,188 US20090169341A1 (en) | 2008-01-01 | 2008-01-01 | Method and system for handling objects in chambers |
PCT/CN2008/073904 WO2009082983A1 (fr) | 2008-01-01 | 2008-12-31 | Système et procédé d'acheminement des pièces dans la chambre |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0821941A2 true BRPI0821941A2 (pt) | 2015-06-16 |
Family
ID=40798659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0821941-9A BRPI0821941A2 (pt) | 2008-01-01 | 2008-12-31 | Sistema para manusear peças a serem trabalhadas em câmaras |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090169341A1 (pt) |
EP (1) | EP2234149A4 (pt) |
CN (1) | CN101960581B (pt) |
AU (1) | AU2008342394B2 (pt) |
BR (1) | BRPI0821941A2 (pt) |
TW (1) | TW200931579A (pt) |
WO (1) | WO2009082983A1 (pt) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110107969A1 (en) * | 2008-06-06 | 2011-05-12 | Ulvac, Inc. | Apparatus for manufacturing thin-film solar cell |
CN101999173B (zh) * | 2008-06-06 | 2013-02-13 | 株式会社爱发科 | 薄膜太阳能电池制造装置 |
CN103774119A (zh) * | 2012-10-19 | 2014-05-07 | 陕西拓日新能源科技有限公司 | 用于非晶硅薄膜均匀镀膜的沉积夹具 |
CN104649045B (zh) * | 2014-12-25 | 2016-12-07 | 杭州科雷机电工业有限公司 | 一种四向输送模块及其联网式印版自动分流处理方法 |
CN108217166B (zh) * | 2018-01-15 | 2021-01-08 | 京东方科技集团股份有限公司 | 一种uv固化传送方法和系统 |
CN113658890B (zh) * | 2021-08-17 | 2023-09-29 | 长鑫存储技术有限公司 | 提高半导体设备产能的方法和系统 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4287851A (en) * | 1980-01-16 | 1981-09-08 | Dozier Alfred R | Mounting and excitation system for reaction in the plasma state |
US4328081A (en) * | 1980-02-25 | 1982-05-04 | Micro-Plate, Inc. | Plasma desmearing apparatus and method |
US4289598A (en) * | 1980-05-03 | 1981-09-15 | Technics, Inc. | Plasma reactor and method therefor |
US4664890A (en) * | 1984-06-22 | 1987-05-12 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Glow-discharge decomposition apparatus |
US5021138A (en) * | 1985-01-17 | 1991-06-04 | Babu Suryadevara V | Side source center sink plasma reactor |
US4618477A (en) * | 1985-01-17 | 1986-10-21 | International Business Machines Corporation | Uniform plasma for drill smear removal reactor |
KR930003136B1 (ko) * | 1987-10-14 | 1993-04-22 | 후루가와덴기 고오교오 가부시기가이샤 | 프라즈마 cvd에 의한 박막 형성장치 |
US4840702A (en) * | 1987-12-29 | 1989-06-20 | Action Technologies, Inc. | Apparatus and method for plasma treating of circuit boards |
JP2948842B2 (ja) * | 1989-11-24 | 1999-09-13 | 日本真空技術株式会社 | インライン型cvd装置 |
JPH08148451A (ja) * | 1994-11-18 | 1996-06-07 | Komatsu Electron Metals Co Ltd | 半導体ウェーハ自動剥し装置 |
US6245189B1 (en) * | 1994-12-05 | 2001-06-12 | Nordson Corporation | High Throughput plasma treatment system |
JPH11238785A (ja) * | 1998-02-19 | 1999-08-31 | Sharp Corp | 基板処理装置及び基板処理方法 |
JP3506208B2 (ja) * | 1998-02-20 | 2004-03-15 | 三菱住友シリコン株式会社 | ウェーハケース |
JP3624113B2 (ja) * | 1998-03-13 | 2005-03-02 | キヤノン株式会社 | プラズマ処理方法 |
KR100732148B1 (ko) * | 1999-09-09 | 2007-06-25 | 이시카와지마-하리마 주고교 가부시키가이샤 | 내부 전극 방식의 플라즈마 처리 장치 및 플라즈마 처리방법 |
JP3970815B2 (ja) * | 2002-11-12 | 2007-09-05 | シャープ株式会社 | 半導体素子製造装置 |
US6767590B1 (en) * | 2002-12-18 | 2004-07-27 | Ronald M. Kubacki | Poled plasma deposition |
JP2004288984A (ja) * | 2003-03-24 | 2004-10-14 | Sharp Corp | 成膜装置及び成膜方法 |
KR20060115734A (ko) * | 2003-10-28 | 2006-11-09 | 노드슨 코포레이션 | 플라즈마 프로세싱 시스템 및 플라즈마 처리 방법 |
TW200737533A (en) * | 2005-12-21 | 2007-10-01 | Nat Science And Technology Dev Agency | Low-cost and high performance solar cell manufacturing machine |
-
2008
- 2008-01-01 US US11/968,188 patent/US20090169341A1/en not_active Abandoned
- 2008-12-31 EP EP08867407A patent/EP2234149A4/en not_active Withdrawn
- 2008-12-31 CN CN200880121056.5A patent/CN101960581B/zh not_active Expired - Fee Related
- 2008-12-31 TW TW097151770A patent/TW200931579A/zh unknown
- 2008-12-31 BR BRPI0821941-9A patent/BRPI0821941A2/pt not_active IP Right Cessation
- 2008-12-31 AU AU2008342394A patent/AU2008342394B2/en not_active Ceased
- 2008-12-31 WO PCT/CN2008/073904 patent/WO2009082983A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2234149A4 (en) | 2013-04-03 |
CN101960581A (zh) | 2011-01-26 |
EP2234149A1 (en) | 2010-09-29 |
AU2008342394B2 (en) | 2012-01-12 |
TW200931579A (en) | 2009-07-16 |
CN101960581B (zh) | 2012-07-25 |
AU2008342394A1 (en) | 2009-07-09 |
WO2009082983A1 (fr) | 2009-07-09 |
US20090169341A1 (en) | 2009-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 6A E 7A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2343 DE 01-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |