BRPI0811798A2 - "HEAT SINK UNIT DETAILED HEAT SINK UNIT AND LED LAMP WITHOUT FAN USING THE DEVICE" - Google Patents

"HEAT SINK UNIT DETAILED HEAT SINK UNIT AND LED LAMP WITHOUT FAN USING THE DEVICE"

Info

Publication number
BRPI0811798A2
BRPI0811798A2 BRPI0811798-5A2A BRPI0811798A BRPI0811798A2 BR PI0811798 A2 BRPI0811798 A2 BR PI0811798A2 BR PI0811798 A BRPI0811798 A BR PI0811798A BR PI0811798 A2 BRPI0811798 A2 BR PI0811798A2
Authority
BR
Brazil
Prior art keywords
heat sink
sink unit
fan
led lamp
detailed
Prior art date
Application number
BRPI0811798-5A2A
Other languages
Portuguese (pt)
Inventor
Young Ho
Original Assignee
Fawoo Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fawoo Technology Co Ltd filed Critical Fawoo Technology Co Ltd
Publication of BRPI0811798A2 publication Critical patent/BRPI0811798A2/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
BRPI0811798-5A2A 2007-07-05 2008-07-01 "HEAT SINK UNIT DETAILED HEAT SINK UNIT AND LED LAMP WITHOUT FAN USING THE DEVICE" BRPI0811798A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20070067755 2007-07-05
KR20070071536 2007-07-18
KR20070071537 2007-07-18
PCT/KR2008/003870 WO2009005285A2 (en) 2007-07-05 2008-07-01 Heat dissipating device having linear heat dissipating unit and fanless led lamp using the device

Publications (1)

Publication Number Publication Date
BRPI0811798A2 true BRPI0811798A2 (en) 2014-11-11

Family

ID=40226664

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0811798-5A2A BRPI0811798A2 (en) 2007-07-05 2008-07-01 "HEAT SINK UNIT DETAILED HEAT SINK UNIT AND LED LAMP WITHOUT FAN USING THE DEVICE"

Country Status (11)

Country Link
US (1) US20110012494A1 (en)
EP (1) EP2168412A4 (en)
JP (1) JP2010531536A (en)
KR (1) KR100879716B1 (en)
CN (1) CN101690441A (en)
AU (1) AU2008271463B2 (en)
BR (1) BRPI0811798A2 (en)
CA (1) CA2691738A1 (en)
MX (1) MX2009014221A (en)
WO (1) WO2009005285A2 (en)
ZA (1) ZA200909151B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5203031B2 (en) * 2008-04-28 2013-06-05 臼井国際産業株式会社 Heat transfer surface structure having flat coiled fin member and manufacturing method thereof
TWI357479B (en) * 2008-11-28 2012-02-01 Univ Nat Taiwan Science Tech A thermal module for light source
CN102032474B (en) * 2009-09-30 2013-04-24 富士迈半导体精密工业（上海）有限公司 Light-emitting diode lamp
KR101146693B1 (en) * 2009-10-07 2012-05-23 김수경 A Cooling structure of LED lamp
KR100951553B1 (en) * 2010-01-25 2010-04-09 엔 하이테크 주식회사 Canopy lamp
KR101255221B1 (en) * 2011-12-09 2013-04-23 한국해양대학교 산학협력단 An apparatus for radiating heat of led explosion-proof lamp
KR101340411B1 (en) * 2013-09-04 2013-12-13 인지전기공업 주식회사 Heat-sink apparatus for led lighting equipment
CN103954155B (en) * 2014-05-09 2017-08-25 中国科学院工程热物理研究所 The non-phase transformation of antigravity type coil takes thermal
EP3320557A1 (en) * 2015-07-06 2018-05-16 General Electric Company Thermal management system
US10317020B1 (en) 2015-11-03 2019-06-11 Thomas McChesney Paint color matching light
CN105953191B (en) * 2016-06-22 2019-06-04 东莞市闻誉实业有限公司 Radiating lamp
CN105953197A (en) * 2016-06-22 2016-09-21 东莞市闻誉实业有限公司 LED lighting device with efficient radiator
CN106016206B (en) * 2016-06-22 2019-06-04 东莞市闻誉实业有限公司 LED illumination device
CN106195950A (en) * 2016-08-12 2016-12-07 广东工业大学 A kind of radiator and light fixture
EP3293453A1 (en) * 2016-09-09 2018-03-14 Valeo Iluminacion Lighting device with a heat dissipation element
JP2018141614A (en) * 2017-02-28 2018-09-13 三菱マテリアル株式会社 Heat exchange member
JP7098954B2 (en) * 2018-02-21 2022-07-12 三菱マテリアル株式会社 heatsink
JP6863512B2 (en) * 2019-08-06 2021-04-21 三菱マテリアル株式会社 heatsink
KR102275357B1 (en) * 2020-06-30 2021-07-09 주식회사 레딕스 A LED Module device that is including on heat-pipes

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275746A (en) * 1993-03-18 1994-09-30 Hitachi Ltd Semiconductor device
JPH1154676A (en) * 1997-08-07 1999-02-26 Ebara Densen Kk Heat radiating parts
US5927386A (en) * 1998-08-24 1999-07-27 Macase Industrial Group Ga., Inc. Computer hard drive heat sink assembly
KR20020079296A (en) * 2001-04-11 2002-10-19 주식회사 태림테크 Heat Pipe and Cooler of IC using It
JP2005166578A (en) * 2003-12-05 2005-06-23 Hamai Denkyu Kogyo Kk Electric-bulb-shaped led lamp
KR20040027642A (en) * 2004-02-19 2004-04-01 (주) 케이티지 Hybrid ic type led lamp
JP4601610B2 (en) * 2004-03-31 2010-12-22 株式会社事業創造研究所 Heat sink manufacturing method
JP4601667B2 (en) * 2005-03-30 2010-12-22 株式会社事業創造研究所 Heat sink and manufacturing method thereof
KR100684429B1 (en) * 2005-06-30 2007-02-16 서울반도체 주식회사 Light-emitting diode lamp
EP1780804A1 (en) * 2005-10-25 2007-05-02 L&C Lighting Technology Corp. LED device with an active heat-dissipation device
JP4969973B2 (en) * 2005-11-16 2012-07-04 臼井国際産業株式会社 heatsink

Also Published As

Publication number Publication date
MX2009014221A (en) 2010-01-28
WO2009005285A3 (en) 2009-03-12
AU2008271463A1 (en) 2009-01-08
CA2691738A1 (en) 2009-01-08
WO2009005285A2 (en) 2009-01-08
KR20090004673A (en) 2009-01-12
KR100879716B1 (en) 2009-01-22
AU2008271463B2 (en) 2011-05-12
ZA200909151B (en) 2011-02-23
EP2168412A4 (en) 2011-04-27
EP2168412A2 (en) 2010-03-31
CN101690441A (en) 2010-03-31
US20110012494A1 (en) 2011-01-20
JP2010531536A (en) 2010-09-24

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 4A, 5A, 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2329 DE 25-08-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

B350 Update of information on the portal [chapter 15.35 patent gazette]