BRPI0620920B1 - dispositivo para inscriÇço - Google Patents
dispositivo para inscriÇçoInfo
- Publication number
- BRPI0620920B1 BRPI0620920B1 BRPI0620920-3B1A BRPI0620920A BRPI0620920B1 BR PI0620920 B1 BRPI0620920 B1 BR PI0620920B1 BR PI0620920 A BRPI0620920 A BR PI0620920A BR PI0620920 B1 BRPI0620920 B1 BR PI0620920B1
- Authority
- BR
- Brazil
- Prior art keywords
- inscription
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
- H01S3/067—Fibre lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/44—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements
- B41J2/442—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements using lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/094003—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light the pumped medium being a fibre
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/094042—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a fibre laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/094049—Guiding of the pump light
- H01S3/094053—Fibre coupled pump, e.g. delivering pump light using a fibre or a fibre bundle
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Radiation-Therapy Devices (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006002573.3 | 2006-01-18 | ||
DE102006002573A DE102006002573A1 (de) | 2006-01-18 | 2006-01-18 | Vorrichtung zur Beschriftung von Kennzeichnungsschildern |
PCT/EP2006/012285 WO2007082583A2 (de) | 2006-01-18 | 2006-12-20 | Vorrichtung zur beschriftung von kennzeichnungsschildern |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0620920A2 BRPI0620920A2 (pt) | 2011-11-29 |
BRPI0620920B1 true BRPI0620920B1 (pt) | 2013-09-03 |
Family
ID=38022833
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0620920-3B1A BRPI0620920B1 (pt) | 2006-01-18 | 2006-12-20 | dispositivo para inscriÇço |
Country Status (8)
Country | Link |
---|---|
US (1) | US20110031227A1 (pt) |
EP (1) | EP1991385B1 (pt) |
JP (1) | JP2009524225A (pt) |
CN (1) | CN101360583B (pt) |
AU (1) | AU2006336088A1 (pt) |
BR (1) | BRPI0620920B1 (pt) |
DE (1) | DE102006002573A1 (pt) |
WO (1) | WO2007082583A2 (pt) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007011179A1 (de) * | 2007-03-06 | 2008-09-11 | Murrplastik Systemtechnik Gmbh | Vorrichtung zur Beschriftung von Kennzeichnungsschildern |
DE102010010071A1 (de) * | 2010-02-26 | 2011-09-01 | Bundesdruckerei Gmbh | Markierungsvorrichtung und Verfahren zum Markieren von Wert- oder Sicherheitsdokumenten unter Verwendung von Lichtleitfasern |
DE102010051539A1 (de) * | 2010-11-18 | 2012-05-24 | Murrplastik Systemtechnik Gmbh | Vorrichtung zur Beschriftung von Kennzeichnungsschildern |
DE102012202330B4 (de) * | 2012-02-16 | 2017-08-17 | Trumpf Laser Gmbh | Laserbearbeitungsvorrichtung mit einem relativ zu einer Spannpratze beweglichen Laserbearbeitungskopf |
DE102012215147B4 (de) * | 2012-08-27 | 2017-04-27 | Trumpf Laser Gmbh | Laserbearbeitungskopf mit federbeweglichen Abschirmungsblechen |
DE102012109088B4 (de) * | 2012-09-26 | 2019-05-09 | Schott Ag | Faseroptisches Konversionsmodul |
DE102014012055A1 (de) | 2014-08-18 | 2016-02-18 | Murrplastik Systemtechnik Gmbh | Vorrichtung zur Beschriftung von Kennzeichnungseinheiten |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4681396A (en) * | 1984-10-09 | 1987-07-21 | General Electric Company | High power laser energy delivery system |
US5504301A (en) * | 1994-03-21 | 1996-04-02 | Laser Cut Images International, Inc. | Apparatus and method for laser engraving thin sheet-like materials |
FR2728104A1 (fr) * | 1994-12-09 | 1996-06-14 | Sgs Thomson Microelectronics | Procede de marquage de circuits integres avec un laser, et appareil de marquage s'y rapportant |
KR100394409B1 (ko) * | 1995-01-13 | 2003-11-28 | 도카이 고교 미싱 가부시키가이샤 | 레이저가공기및레이저가공기능을가진미싱 |
JPH09136177A (ja) * | 1995-11-10 | 1997-05-27 | Fuji Electric Co Ltd | レーザ加工装置 |
JPH09174262A (ja) * | 1995-12-27 | 1997-07-08 | Hitachi Ltd | レーザマーカ |
DE19706038A1 (de) * | 1997-02-06 | 1998-08-20 | Chromatron Laser Sys Gmbh | Vorrichtung zum Beschriften von Materialien mit einem Laser |
WO1998053949A1 (en) * | 1997-05-27 | 1998-12-03 | Sdl, Inc. | Laser marking system and method of energy control |
US6275250B1 (en) * | 1998-05-26 | 2001-08-14 | Sdl, Inc. | Fiber gain medium marking system pumped or seeded by a modulated laser diode source and method of energy control |
DE19839482C2 (de) * | 1998-08-29 | 2002-09-19 | Sam Saechsische Anlagen Und Ma | Frei führbarer Einhandbearbeitungskopf für die Materialbearbeitung mittels Hochleistungsdiodenlaser über 500 W Leistung |
JP2000091678A (ja) * | 1998-09-11 | 2000-03-31 | Nec Corp | ファイバレーザ照射装置 |
JP2000334585A (ja) * | 1999-05-25 | 2000-12-05 | Ando Electric Co Ltd | レーザマーキング装置、及びレーザマーキング方法 |
JP2001150176A (ja) * | 1999-11-22 | 2001-06-05 | Matsushita Electronics Industry Corp | レーザマーキング集塵装置 |
US6326590B1 (en) * | 2000-01-25 | 2001-12-04 | Eastman Kodak Company | Nozzle element adaptable to a laser beam tube used in laser edge marking equipment |
US6400389B1 (en) * | 2000-01-25 | 2002-06-04 | Eastman Kodak Company | Apparatus for laser marking indicia on a photosensitive web |
JP2002160078A (ja) * | 2000-11-29 | 2002-06-04 | Y E Data Inc | マーキング装置 |
JP2002224866A (ja) * | 2001-02-06 | 2002-08-13 | Ishikawajima Harima Heavy Ind Co Ltd | レーザ出射停止システム |
CN2470142Y (zh) * | 2001-04-11 | 2002-01-09 | 合肥国敏科技发展有限责任公司 | 激光雕刻机 |
US6927359B2 (en) * | 2001-06-14 | 2005-08-09 | Advanced Cardiovascular Systems, Inc. | Pulsed fiber laser cutting system for medical implants |
CN2487492Y (zh) * | 2001-07-20 | 2002-04-24 | 周志勇 | 激光聚焦镜头的气流保护装置 |
CN2526191Y (zh) * | 2001-11-08 | 2002-12-18 | 梁伟 | 电脑数控全功能雕刻、精饰一体机 |
JP2003290945A (ja) * | 2002-04-01 | 2003-10-14 | Nippon Steel Corp | レーザ表面加工装置 |
JP3978066B2 (ja) * | 2002-04-08 | 2007-09-19 | 新日本製鐵株式会社 | レーザ加工装置 |
JP2003236685A (ja) * | 2003-01-06 | 2003-08-26 | Sunx Ltd | レーザマーキング装置 |
-
2006
- 2006-01-18 DE DE102006002573A patent/DE102006002573A1/de not_active Withdrawn
- 2006-12-20 JP JP2008550645A patent/JP2009524225A/ja active Pending
- 2006-12-20 AU AU2006336088A patent/AU2006336088A1/en not_active Abandoned
- 2006-12-20 BR BRPI0620920-3B1A patent/BRPI0620920B1/pt not_active IP Right Cessation
- 2006-12-20 CN CN200680051342XA patent/CN101360583B/zh not_active Expired - Fee Related
- 2006-12-20 WO PCT/EP2006/012285 patent/WO2007082583A2/de active Application Filing
- 2006-12-20 EP EP06829766A patent/EP1991385B1/de not_active Not-in-force
- 2006-12-20 US US12/087,907 patent/US20110031227A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20110031227A1 (en) | 2011-02-10 |
JP2009524225A (ja) | 2009-06-25 |
BRPI0620920A2 (pt) | 2011-11-29 |
WO2007082583A3 (de) | 2007-12-06 |
EP1991385A2 (de) | 2008-11-19 |
CN101360583B (zh) | 2011-08-24 |
AU2006336088A1 (en) | 2007-07-26 |
DE102006002573A1 (de) | 2007-07-19 |
WO2007082583A2 (de) | 2007-07-26 |
EP1991385B1 (de) | 2012-06-13 |
CN101360583A (zh) | 2009-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 20/12/2006, OBSERVADAS AS CONDICOES LEGAIS. |
|
B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time | ||
B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |