BRPI0618866A2 - construção de diodo emissor de luz (led), método para ajuste do valor de saída de temperatura de cor de uma construção de led, e, meio para ajuste de uma temperatura de cor resultante de uma construção de led - Google Patents

construção de diodo emissor de luz (led), método para ajuste do valor de saída de temperatura de cor de uma construção de led, e, meio para ajuste de uma temperatura de cor resultante de uma construção de led

Info

Publication number
BRPI0618866A2
BRPI0618866A2 BRPI0618866A BRPI0618866A BRPI0618866A2 BR PI0618866 A2 BRPI0618866 A2 BR PI0618866A2 BR PI0618866 A BRPI0618866 A BR PI0618866A BR PI0618866 A BRPI0618866 A BR PI0618866A BR PI0618866 A2 BRPI0618866 A2 BR PI0618866A2
Authority
BR
Brazil
Prior art keywords
led construction
adjusting
color temperature
led
construction
Prior art date
Application number
BRPI0618866A
Other languages
English (en)
Inventor
Markus C Vermeulen
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of BRPI0618866A2 publication Critical patent/BRPI0618866A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
BRPI0618866A 2005-11-24 2006-11-20 construção de diodo emissor de luz (led), método para ajuste do valor de saída de temperatura de cor de uma construção de led, e, meio para ajuste de uma temperatura de cor resultante de uma construção de led BRPI0618866A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05111230 2005-11-24
PCT/IB2006/054337 WO2007060595A2 (en) 2005-11-24 2006-11-20 Light emitting diode construction

Publications (1)

Publication Number Publication Date
BRPI0618866A2 true BRPI0618866A2 (pt) 2016-09-06

Family

ID=38016469

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0618866A BRPI0618866A2 (pt) 2005-11-24 2006-11-20 construção de diodo emissor de luz (led), método para ajuste do valor de saída de temperatura de cor de uma construção de led, e, meio para ajuste de uma temperatura de cor resultante de uma construção de led

Country Status (8)

Country Link
US (1) US20080297048A1 (pt)
EP (1) EP1958257A2 (pt)
JP (1) JP2009517858A (pt)
KR (1) KR20080070770A (pt)
CN (1) CN101313405A (pt)
BR (1) BRPI0618866A2 (pt)
TW (1) TW200746459A (pt)
WO (1) WO2007060595A2 (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006023149A2 (en) 2004-07-08 2006-03-02 Color Kinetics Incorporated Led package methods and systems
JP5242939B2 (ja) * 2007-04-19 2013-07-24 スタンレー電気株式会社 光デバイス
EP2017890B1 (en) * 2007-06-07 2015-10-07 Cfg S.A. White-light LED-based device
WO2009059454A1 (fr) * 2007-11-05 2009-05-14 Lite-On It Corporation Dispositif d'éclairage dont la couleur et la température de couleur sont changées
EP2453489A4 (en) * 2009-07-07 2014-04-16 Ccs Inc LIGHT EMITTING DEVICE
KR101122020B1 (ko) * 2010-03-17 2012-03-09 한국광기술원 다중발광소자 및 이를 제조하는 방법
TWI576010B (zh) 2012-12-28 2017-03-21 財團法人工業技術研究院 光源裝置
US10485070B2 (en) 2012-12-28 2019-11-19 Industrial Technology Research Institute Light source apparatus and display apparatus
US10039169B2 (en) 2012-12-28 2018-07-31 Industrial Technology Research Institute Light source apparatus
US9693408B2 (en) 2012-12-28 2017-06-27 Industrial Technology Research Institute Light source apparatus
KR102265771B1 (ko) * 2014-01-21 2021-06-16 루미리즈 홀딩 비.브이. 패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈
JP2017527114A (ja) * 2014-08-11 2017-09-14 ゲルト オー ミュラー 白熱様減光発光ダイオード
CN113437200B (zh) * 2021-06-23 2022-10-11 上海纬而视科技股份有限公司 一种具有密封显示块的cob封装结构

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04365382A (ja) * 1991-06-13 1992-12-17 Toshiba Corp 半導体発光装置及びその駆動方法
US5803579A (en) * 1996-06-13 1998-09-08 Gentex Corporation Illuminator assembly incorporating light emitting diodes
US6670207B1 (en) * 1999-03-15 2003-12-30 Gentex Corporation Radiation emitter device having an integral micro-groove lens
DE19952932C1 (de) * 1999-11-03 2001-05-03 Osram Opto Semiconductors Gmbh LED-Weißlichtquelle mit breitbandiger Anregung
US6636003B2 (en) * 2000-09-06 2003-10-21 Spectrum Kinetics Apparatus and method for adjusting the color temperature of white semiconduct or light emitters
US7009213B2 (en) * 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
JP4378242B2 (ja) * 2003-09-25 2009-12-02 株式会社小糸製作所 車両用灯具
JP4458804B2 (ja) * 2003-10-17 2010-04-28 シチズン電子株式会社 白色ｌｅｄ
US7095056B2 (en) * 2003-12-10 2006-08-22 Sensor Electronic Technology, Inc. White light emitting device and method
EP1754121A4 (en) * 2004-03-15 2014-02-12 Philips Solid State Lighting METHODS AND SYSTEMS FOR PROVIDING LIGHTING SYSTEMS
DE202004011869U1 (de) * 2004-06-30 2005-11-10 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung

Also Published As

Publication number Publication date
KR20080070770A (ko) 2008-07-30
WO2007060595A3 (en) 2007-09-13
JP2009517858A (ja) 2009-04-30
TW200746459A (en) 2007-12-16
US20080297048A1 (en) 2008-12-04
EP1958257A2 (en) 2008-08-20
WO2007060595A2 (en) 2007-05-31
CN101313405A (zh) 2008-11-26

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B06G Technical and formal requirements: other requirements [chapter 6.7 patent gazette]

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B11Z Dismissal: petition dismissal - article 216, par 2 of industrial property law

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B06H Technical and formal requirements: requirement cancelled [chapter 6.8 patent gazette]

Free format text: O DESPACHO 6.7 ESTA SENDO ANULADO TENDO POR BASE A DETERMINACAO DO DIRETOR DE PATENTES, A QUAL E CALCADA NO PARECER NO 0003-2014 AGU/PGF/PFE/INPI/COOPHI-LBC-1.0.

B11M Dismissal: decision cancelled

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B08F Application fees: application dismissed [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]