BRPI0503833A - selective corrosion method using corrosion interruption layer - Google Patents
selective corrosion method using corrosion interruption layerInfo
- Publication number
- BRPI0503833A BRPI0503833A BRPI0503833-2A BRPI0503833A BRPI0503833A BR PI0503833 A BRPI0503833 A BR PI0503833A BR PI0503833 A BRPI0503833 A BR PI0503833A BR PI0503833 A BRPI0503833 A BR PI0503833A
- Authority
- BR
- Brazil
- Prior art keywords
- corrosion
- layer
- interruption
- selective
- interruption layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
- B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
- B81C1/00793—Avoid contamination, e.g. absorption of impurities or oxidation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
- B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
- B81C1/00801—Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0135—Controlling etch progression
- B81C2201/014—Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
"MéTODO DE CORROSãO SELETIVA UTILIZANDO CAMADA DE INTERRUPçãO DE CORROSãO". A fabricação de um dispositivo MEMS como um modulador interferométrico é aperfeiçoada pelo emprego de uma camada de interrupção de corrosão entre uma camada de sacrifício e uma camada de espelho. A interrupção de corrosão pode reduzir a corrosão em excesso indesejável da camada de sacrifício e camada de espelho. A camada de interrupção de corrosão também pode servir como uma camada de barreira, camada que serve de substrato e/ou camada modelo."SELECTIVE CORROSION METHOD USING CORROSION INTERRUPTION LAYER". The manufacture of a MEMS device as an interferometric modulator is enhanced by employing a corrosion interruption layer between a sacrificial layer and a mirror layer. Interruption of corrosion can reduce undesirable excess corrosion of the sacrificial layer and mirror layer. The corrosion interruption layer may also serve as a barrier layer, substrate layer and / or model layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61341004P | 2004-09-27 | 2004-09-27 | |
US11/090,773 US20060066932A1 (en) | 2004-09-27 | 2005-03-25 | Method of selective etching using etch stop layer |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0503833A true BRPI0503833A (en) | 2006-05-09 |
Family
ID=35462575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0503833-2A BRPI0503833A (en) | 2004-09-27 | 2005-09-23 | selective corrosion method using corrosion interruption layer |
Country Status (11)
Country | Link |
---|---|
US (1) | US20060066932A1 (en) |
EP (1) | EP1640768A1 (en) |
JP (1) | JP2006091852A (en) |
KR (1) | KR20060092871A (en) |
AU (1) | AU2005203258A1 (en) |
BR (1) | BRPI0503833A (en) |
CA (1) | CA2514349A1 (en) |
MX (1) | MXPA05009864A (en) |
RU (1) | RU2005129861A (en) |
SG (1) | SG121046A1 (en) |
TW (1) | TW200626481A (en) |
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TWI232333B (en) * | 2003-09-03 | 2005-05-11 | Prime View Int Co Ltd | Display unit using interferometric modulation and manufacturing method thereof |
US6982820B2 (en) * | 2003-09-26 | 2006-01-03 | Prime View International Co., Ltd. | Color changeable pixel |
US20050068583A1 (en) * | 2003-09-30 | 2005-03-31 | Gutkowski Lawrence J. | Organizing a digital image |
US6861277B1 (en) * | 2003-10-02 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Method of forming MEMS device |
US7183215B2 (en) * | 2004-07-21 | 2007-02-27 | Hewlett-Packard Development Company, L.P. | Etching with electrostatically attracted ions |
-
2005
- 2005-03-25 US US11/090,773 patent/US20060066932A1/en not_active Abandoned
- 2005-07-25 JP JP2005214923A patent/JP2006091852A/en active Pending
- 2005-07-26 SG SG200504626A patent/SG121046A1/en unknown
- 2005-07-26 AU AU2005203258A patent/AU2005203258A1/en not_active Abandoned
- 2005-07-29 CA CA002514349A patent/CA2514349A1/en not_active Abandoned
- 2005-08-10 TW TW094127155A patent/TW200626481A/en unknown
- 2005-09-09 KR KR1020050084154A patent/KR20060092871A/en not_active Application Discontinuation
- 2005-09-14 EP EP05255661A patent/EP1640768A1/en not_active Withdrawn
- 2005-09-14 MX MXPA05009864A patent/MXPA05009864A/en not_active Application Discontinuation
- 2005-09-23 BR BRPI0503833-2A patent/BRPI0503833A/en not_active IP Right Cessation
- 2005-09-26 RU RU2005129861/28A patent/RU2005129861A/en not_active Application Discontinuation
Also Published As
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SG121046A1 (en) | 2006-04-26 |
MXPA05009864A (en) | 2006-03-29 |
US20060066932A1 (en) | 2006-03-30 |
KR20060092871A (en) | 2006-08-23 |
CA2514349A1 (en) | 2006-03-27 |
EP1640768A1 (en) | 2006-03-29 |
AU2005203258A1 (en) | 2006-04-13 |
RU2005129861A (en) | 2007-04-10 |
TW200626481A (en) | 2006-08-01 |
JP2006091852A (en) | 2006-04-06 |
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