BR9916208A - Processos aperfeiçoados para riscar com arame padrões de circuito filamentoso com partes planas e não planas; placas riscadas com arame, cartões de interligação e cartões inteligentes aperfeiçoados fabricados por estes processos - Google Patents
Processos aperfeiçoados para riscar com arame padrões de circuito filamentoso com partes planas e não planas; placas riscadas com arame, cartões de interligação e cartões inteligentes aperfeiçoados fabricados por estes processosInfo
- Publication number
- BR9916208A BR9916208A BR9916208-3A BR9916208A BR9916208A BR 9916208 A BR9916208 A BR 9916208A BR 9916208 A BR9916208 A BR 9916208A BR 9916208 A BR9916208 A BR 9916208A
- Authority
- BR
- Brazil
- Prior art keywords
- filament
- cards
- planar
- wire
- processes
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Credit Cards Or The Like (AREA)
- Near-Field Transmission Systems (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
"PROCESSOS APERFEIçOADOS PARA RISCAR COM ARAME PADRõES DE CIRCUITO FILAMENTOSO COM PARTES PLANAS E NãO PLANAS; PLACAS RISCADAS COM ARAME, CARTõES DE INTERLIGAçãO E CARTõES INTELIGENTES APERFEIçOADOS FABRICADOS POR ESTES PROCESSOS" Trata-se de um aparelho e um processo para formar padrões de circuito filamentoso com partes planas e não planas, e de cartões de interligação, cartões inteligentes ou cartões de circuito de fibra óptica formados a partir deles. Uma trajetória de circuito filamentoso é riscada movendo-se uma guia de filamento e um substrato uma com relação ao outro, e dispensando-se um filamento sobre, ou nas proximidades de, uma superfície do substrato. O filamento ou o substrato ou ambos têm superfície(s) adesiva(s). A superfície adesiva pode ser acionada adesivamente por aplicação de energia. A energia é aplicada simultaneamente com a, ou em seguida à, marcação. Uma parte do padrão de circuito filamentoso é plana e uma outra parte é não plana. A parte não plana atravessa, mas não entra em contato com ou adere a uma área pré-selecionada do substrato. á área pré-selecionada corresponde a um apoio, um padrão de contato, um orifício, uma fenda, um detalhe levantado, uma parte da parte plana previamente riscada e um ponto de terminação de filamento. Opcionalmente, a parte não plana pode ser embutida abaixo da superfície do substrato. Uma outra parte não plana do circuito filamentoso atravessa a parte não plana, mas não entra em contato com ou adere a uma parte pré-selecionada da parte não plana previamente riscada. De acordo com o processo acima, placas de circuito riscadas com arame são formadas, incluindo cartões de interligação, cartões inteligentes ou cartões de circuito de fibra óptica.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21151198A | 1998-12-14 | 1998-12-14 | |
PCT/US1999/028795 WO2000036891A1 (en) | 1998-12-14 | 1999-12-07 | Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smart cards made by these methods |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9916208A true BR9916208A (pt) | 2001-09-04 |
Family
ID=22787224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9916208-3A BR9916208A (pt) | 1998-12-14 | 1999-12-07 | Processos aperfeiçoados para riscar com arame padrões de circuito filamentoso com partes planas e não planas; placas riscadas com arame, cartões de interligação e cartões inteligentes aperfeiçoados fabricados por estes processos |
Country Status (15)
Country | Link |
---|---|
EP (1) | EP1145609B1 (pt) |
JP (1) | JP2002532912A (pt) |
KR (1) | KR20010104312A (pt) |
CN (1) | CN1223252C (pt) |
AT (1) | ATE272305T1 (pt) |
AU (1) | AU769796B2 (pt) |
BR (1) | BR9916208A (pt) |
CA (1) | CA2353994A1 (pt) |
DE (1) | DE69919030T2 (pt) |
DK (1) | DK1145609T3 (pt) |
ES (1) | ES2224738T3 (pt) |
HK (1) | HK1042014A1 (pt) |
IL (1) | IL143654A0 (pt) |
TW (1) | TW510156B (pt) |
WO (1) | WO2000036891A1 (pt) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6883714B2 (en) * | 1998-12-14 | 2005-04-26 | Stratos Lightwave, Inc. | Methods of optical filament scribing of circuit patterns with planar and non-planar portions |
US6628240B2 (en) * | 2000-11-08 | 2003-09-30 | American Pacific Technology | Method and apparatus for rapid staking of antennae in smart card manufacture |
US7546671B2 (en) | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
US7979975B2 (en) | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
WO2008037592A1 (en) | 2006-09-26 | 2008-04-03 | Advanced Micromechanic And Automation Technology Ltd | Method of connecting an antenna to a transponder chip and corresponding transponder inlay |
US8240022B2 (en) | 2006-09-26 | 2012-08-14 | Feinics Amatech Teorowita | Methods of connecting an antenna to a transponder chip |
US7581308B2 (en) | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
US7980477B2 (en) | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
DE102009012255A1 (de) * | 2009-03-07 | 2010-09-09 | Michalk, Manfred, Dr. | Schaltungsanordnung |
JP5488886B2 (ja) * | 2009-10-29 | 2014-05-14 | 日立化成株式会社 | マルチワイヤ配線板の製造方法 |
US9414501B2 (en) | 2012-01-04 | 2016-08-09 | Board Of Regents, The University Of Texas System | Method for connecting inter-layer conductors and components in 3D structures |
US10748867B2 (en) | 2012-01-04 | 2020-08-18 | Board Of Regents, The University Of Texas System | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices |
US10518490B2 (en) | 2013-03-14 | 2019-12-31 | Board Of Regents, The University Of Texas System | Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices |
US9908037B2 (en) | 2013-07-11 | 2018-03-06 | Board Of Regents, The University Of Texas System | Electronic gaming die |
WO2016140909A1 (en) * | 2015-03-02 | 2016-09-09 | Board Of Regents, The University Of Texas System | Embedding apparatus and method utilizing additive manufacturing |
FR3054640B1 (fr) * | 2016-07-28 | 2020-06-12 | Linxens Holding | Dispositif emetteur de lumiere |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3674914A (en) * | 1968-02-09 | 1972-07-04 | Photocircuits Corp | Wire scribed circuit boards and method of manufacture |
US3674602A (en) * | 1969-10-09 | 1972-07-04 | Photocircuits Corp | Apparatus for making wire scribed circuit boards |
US4533787A (en) * | 1981-11-26 | 1985-08-06 | Autophon Ag. | Printed circuit assembly |
DE69331433T2 (de) * | 1992-10-22 | 2002-10-02 | Advanced Interconnection Tech | Einrichtung zur automatischen optischen Prüfung von Leiterplatten mit darin verlegten Drähten |
DE4410732C2 (de) * | 1994-03-28 | 1997-05-07 | Amatech Gmbh & Co Kg | Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit |
US6233818B1 (en) * | 1996-02-12 | 2001-05-22 | David Finn | Method and device for bonding a wire conductor |
DE19619771A1 (de) * | 1996-02-12 | 1997-08-14 | David Finn | Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate |
-
1999
- 1999-12-07 KR KR1020017007369A patent/KR20010104312A/ko not_active Application Discontinuation
- 1999-12-07 JP JP2000589015A patent/JP2002532912A/ja active Pending
- 1999-12-07 DE DE69919030T patent/DE69919030T2/de not_active Expired - Fee Related
- 1999-12-07 BR BR9916208-3A patent/BR9916208A/pt not_active Application Discontinuation
- 1999-12-07 DK DK99965125T patent/DK1145609T3/da active
- 1999-12-07 CA CA002353994A patent/CA2353994A1/en not_active Abandoned
- 1999-12-07 CN CNB99814455XA patent/CN1223252C/zh not_active Expired - Fee Related
- 1999-12-07 ES ES99965125T patent/ES2224738T3/es not_active Expired - Lifetime
- 1999-12-07 EP EP99965125A patent/EP1145609B1/en not_active Expired - Lifetime
- 1999-12-07 AU AU31108/00A patent/AU769796B2/en not_active Ceased
- 1999-12-07 IL IL14365498A patent/IL143654A0/xx unknown
- 1999-12-07 WO PCT/US1999/028795 patent/WO2000036891A1/en not_active Application Discontinuation
- 1999-12-07 AT AT99965125T patent/ATE272305T1/de not_active IP Right Cessation
- 1999-12-14 TW TW088121890A patent/TW510156B/zh not_active IP Right Cessation
-
2002
- 2002-05-22 HK HK02103830.6A patent/HK1042014A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW510156B (en) | 2002-11-11 |
DK1145609T3 (da) | 2004-12-06 |
EP1145609A1 (en) | 2001-10-17 |
ES2224738T3 (es) | 2005-03-01 |
ATE272305T1 (de) | 2004-08-15 |
KR20010104312A (ko) | 2001-11-24 |
CA2353994A1 (en) | 2000-06-22 |
WO2000036891A9 (en) | 2000-11-09 |
AU3110800A (en) | 2000-07-03 |
JP2002532912A (ja) | 2002-10-02 |
HK1042014A1 (zh) | 2002-07-26 |
IL143654A0 (en) | 2002-04-21 |
DE69919030D1 (de) | 2004-09-02 |
CN1223252C (zh) | 2005-10-12 |
EP1145609B1 (en) | 2004-07-28 |
DE69919030T2 (de) | 2005-08-18 |
WO2000036891A1 (en) | 2000-06-22 |
AU769796B2 (en) | 2004-02-05 |
CN1330857A (zh) | 2002-01-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |