BR9606213A - Colocação de componentes - Google Patents

Colocação de componentes

Info

Publication number
BR9606213A
BR9606213A BR9606213A BR9606213A BR9606213A BR 9606213 A BR9606213 A BR 9606213A BR 9606213 A BR9606213 A BR 9606213A BR 9606213 A BR9606213 A BR 9606213A BR 9606213 A BR9606213 A BR 9606213A
Authority
BR
Brazil
Prior art keywords
component placement
placement
component
Prior art date
Application number
BR9606213A
Other languages
English (en)
Inventor
Paul D Tindall
Alexander S Dalgleish
Original Assignee
Compaq Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compaq Computer Corp filed Critical Compaq Computer Corp
Publication of BR9606213A publication Critical patent/BR9606213A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
BR9606213A 1995-12-29 1996-12-30 Colocação de componentes BR9606213A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/580,882 US5933349A (en) 1995-12-29 1995-12-29 Component placement

Publications (1)

Publication Number Publication Date
BR9606213A true BR9606213A (pt) 1998-08-25

Family

ID=24322969

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9606213A BR9606213A (pt) 1995-12-29 1996-12-30 Colocação de componentes

Country Status (7)

Country Link
US (1) US5933349A (pt)
JP (1) JPH1022695A (pt)
CN (1) CN1104836C (pt)
BR (1) BR9606213A (pt)
GB (1) GB2308682B (pt)
SG (1) SG94693A1 (pt)
TW (2) TW404150B (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980007918A (ko) * 1996-06-29 1998-03-30 배순훈 자삽 경로 작성장치 및 그 자삽 경로생성 방법
JP2917969B2 (ja) * 1997-06-06 1999-07-12 日本電気株式会社 論理等価性検証方法および論理等価性検証装置
US6195618B1 (en) * 1998-10-15 2001-02-27 Microscribe, Llc Component position verification using a probe apparatus
US6779726B1 (en) * 1999-11-03 2004-08-24 Solectron Corporation Method and apparatus for controlling a production operation using printed information on a component tape
US6689035B1 (en) * 2000-04-11 2004-02-10 Gerber Scientific Products, Inc. Method and apparatus for designing and creating a package
US6832122B1 (en) * 2000-07-06 2004-12-14 Siemens Electronics Assembly Systems, Inc. System and method for comparing electronics manufacturing data
US6594531B2 (en) * 2000-12-22 2003-07-15 Koninklijke Philips Electronics N.V. Modular optimizer with foreign module learning feature for optimization of component placement machines
JP4108298B2 (ja) * 2001-07-06 2008-06-25 松下電器産業株式会社 電子部品実装装置における生産シミュレーション装置および生産シミュレーション方法
JP3711054B2 (ja) * 2001-09-21 2005-10-26 三洋電機株式会社 部品装着装置における部品配置方法
US6829514B2 (en) * 2003-01-17 2004-12-07 Motorola, Inc. Balancing workloads in an electronics assembly factory
EP1583411A3 (en) * 2004-03-16 2007-10-24 Assembléon N.V. Method and system for placing components by means of at least one component placement unit
US7475472B2 (en) * 2004-08-31 2009-01-13 Milegon Llc System for assembling a customized printed circuit board
US7295888B2 (en) * 2005-09-30 2007-11-13 Caterpillar Inc. System for evaluating a parts carrier
US9008836B2 (en) * 2007-01-09 2015-04-14 Abb Inc. Method and system for robotic assembly parameter optimization
TWI406045B (zh) * 2008-06-30 2013-08-21 Ibm 具有ｓｍｔ元件作為光閘之光學接觸面板及在該面板上之形成光閘的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4593363A (en) * 1983-08-12 1986-06-03 International Business Machines Corporation Simultaneous placement and wiring for VLSI chips
US4910859A (en) * 1984-04-06 1990-03-27 Holcomb Gregory W Circuit assembly system
JPH0668696B2 (ja) * 1985-02-22 1994-08-31 株式会社日立製作所 挿入機用ｎｃデータ作成方法
US4914808A (en) * 1987-10-16 1990-04-10 Sanyo Electric Co., Ltd Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences
JP2503082B2 (ja) * 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
US5155679A (en) * 1989-12-18 1992-10-13 Hewlett-Packard Company Set-up optimization for flexible manufacturing systems
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
JP2800064B2 (ja) * 1990-06-21 1998-09-21 松下電器産業株式会社 電子部品実装装置およびこれを利用する電子部品実装方法
JP2547658B2 (ja) * 1990-08-10 1996-10-23 三洋電機株式会社 部品装着装置
US5212881A (en) * 1990-09-20 1993-05-25 Tokico Ltd. Electronic component mounting apparatus
JP2793033B2 (ja) * 1990-10-24 1998-09-03 三洋電機株式会社 部品装着装置
JP2966082B2 (ja) * 1990-11-06 1999-10-25 株式会社日立製作所 実装順序決定方法及びその実装方法
JPH056212A (ja) * 1991-06-27 1993-01-14 Mitsubishi Electric Corp 部品搭載機用データ作成方法
JPH05304396A (ja) * 1991-07-12 1993-11-16 Canon Inc 部品の実装順序の決定方法及びその装置
JPH0618215A (ja) * 1992-07-01 1994-01-25 Yamaha Motor Co Ltd 部品装着方法及び装置
JP3461532B2 (ja) * 1993-07-02 2003-10-27 松下電器産業株式会社 実装順序の決定方法

Also Published As

Publication number Publication date
CN1104836C (zh) 2003-04-02
GB9626811D0 (en) 1997-02-12
GB2308682B (en) 2000-03-08
CN1160985A (zh) 1997-10-01
TW365105B (en) 1999-07-21
TW404150B (en) 2000-09-01
US5933349A (en) 1999-08-03
SG94693A1 (en) 2003-03-18
JPH1022695A (ja) 1998-01-23
GB2308682A (en) 1997-07-02

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]