BR9500033A - Processo para tratar uma porção predeterminada de um revestimento sobre um substrato de fororreceptor,e,processo e aparelho para remover uma cinta de material de revestimento - Google Patents

Processo para tratar uma porção predeterminada de um revestimento sobre um substrato de fororreceptor,e,processo e aparelho para remover uma cinta de material de revestimento

Info

Publication number
BR9500033A
BR9500033A BR9500033A BR9500033A BR9500033A BR 9500033 A BR9500033 A BR 9500033A BR 9500033 A BR9500033 A BR 9500033A BR 9500033 A BR9500033 A BR 9500033A BR 9500033 A BR9500033 A BR 9500033A
Authority
BR
Brazil
Prior art keywords
coating
fororeceptor
belt
treating
substrate
Prior art date
Application number
BR9500033A
Other languages
English (en)
Inventor
Eugene A Swain
Henry T Mastalski
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of BR9500033A publication Critical patent/BR9500033A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1438—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for directional control

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Laser Beam Processing (AREA)
BR9500033A 1994-01-06 1995-01-05 Processo para tratar uma porção predeterminada de um revestimento sobre um substrato de fororreceptor,e,processo e aparelho para remover uma cinta de material de revestimento BR9500033A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/178,166 US5424508A (en) 1994-01-06 1994-01-06 Laser ablation system

Publications (1)

Publication Number Publication Date
BR9500033A true BR9500033A (pt) 1995-10-03

Family

ID=22651465

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9500033A BR9500033A (pt) 1994-01-06 1995-01-05 Processo para tratar uma porção predeterminada de um revestimento sobre um substrato de fororreceptor,e,processo e aparelho para remover uma cinta de material de revestimento

Country Status (3)

Country Link
US (1) US5424508A (pt)
JP (1) JPH07284964A (pt)
BR (1) BR9500033A (pt)

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US5601737A (en) * 1993-07-27 1997-02-11 Matsushita Electric Works, Ltd. Surface treating process involving energy beam irradiation onto multilayered conductor parts of printed circuit board
US5496985A (en) * 1994-04-01 1996-03-05 Xerox Corporation Laser ablation nozzle
US5662762A (en) * 1995-07-07 1997-09-02 Clover Industries, Inc. Laser-based system and method for stripping coatings from substrates
US6130404A (en) * 1997-03-03 2000-10-10 Itt Automotive, Inc. Electro-optical removal of plastic layer bonded to a metal tube
US6191384B1 (en) * 1998-05-05 2001-02-20 Tapematic S.P.A. Apparatus for trimming dye coated on a recordable disc substrate and related method
US6461442B1 (en) 1999-11-29 2002-10-08 Xerox Corporation Process for removing a strip of coating material
US6476353B2 (en) 2000-01-26 2002-11-05 Js Chamberlain & Assoc. Laser surface finishing apparatus and method
US6494965B1 (en) * 2000-05-30 2002-12-17 Creo Products Inc. Method and apparatus for removal of laser ablation byproducts
US6666927B2 (en) * 2001-04-30 2003-12-23 Intel Corporation Vacuum debris removal system for an integrated circuit manufacturing device
US20060138104A1 (en) * 2001-05-25 2006-06-29 Devore Paul W Fuel cell and liquid container sealant removal system
DE60335238D1 (de) * 2002-01-04 2011-01-20 Parker Hannifin Corp Zylinder mit optischer erfassungsvorrichtung und verfahren
US7552671B2 (en) * 2002-01-04 2009-06-30 Parker-Hannifin Corporation Cylinder with fiber optical position sensing device and method
KR100985744B1 (ko) * 2002-03-14 2010-10-06 히다치 조센 가부시키가이샤 레이저 가공기에 있어서의 광학부품으로의 부착오염방지방법 및 장치
US20040004063A1 (en) * 2002-07-08 2004-01-08 Merdan Kenneth M. Vertical stent cutting process
ATE327071T1 (de) * 2003-03-05 2006-06-15 Trumpf Werkzeugmaschinen Gmbh Kühl- und/oder spüllanze einer laserbearbeitungsmaschine und verfahren zum absaugen von partikeln, gasen oder dämpfen bei einer laserbearbeitung
JP4766874B2 (ja) * 2004-01-14 2011-09-07 臼井国際産業株式会社 樹脂被覆金属管の樹脂層の除去方法
WO2006076817A1 (en) * 2005-01-21 2006-07-27 Empa, Eidgenössische Materialprüfungs- Und Forschungsanstalt Laser ablation analysis in a spinning carrier gas
JP4640165B2 (ja) * 2005-12-26 2011-03-02 富士ゼロックス株式会社 電子写真感光体の製造方法
US20070199930A1 (en) * 2006-02-22 2007-08-30 Mecco Partnership, Llc Laser marking system
JP5302036B2 (ja) * 2009-02-10 2013-10-02 本田技研工業株式会社 円筒状ワーク切断装置
DE102012217082B4 (de) * 2012-09-21 2016-06-16 Trumpf Laser Gmbh Laserbearbeitungskopf mit einer Ringdüse
US10307864B2 (en) * 2013-12-13 2019-06-04 Avonisys Ag Methods and systems to keep a work piece surface free from liquid accumulation while performing liquid-jet guided laser based material processing
DE102014113323A1 (de) * 2014-09-16 2016-03-17 BMA Automation GmbH Verfahren und Vorrichtung zur Entfernung einer Kunststoffbeschichtung von einem Lebensmittellaib
DE102015208157B4 (de) 2015-05-04 2017-06-14 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Schneidgasdüse und Laserschneidverfahren mit verschiebbarer Ventilhülse zum Einstellen der Strömungscharakteristik
KR102070310B1 (ko) * 2019-06-12 2020-01-28 (주)플루토 자동차 부품용 인덕터 레이저 용접장치
CN110592583A (zh) * 2019-10-24 2019-12-20 江苏点金激光科技有限公司 一种激光熔覆工作头保护装置
JP7396865B2 (ja) * 2019-11-13 2023-12-12 ファナック株式会社 レーザ溶接装置
CA3171873A1 (en) * 2020-02-28 2021-09-02 Newtech Llc Surface modification of solder paste stencils
JP2022538202A (ja) * 2020-05-22 2022-09-01 フン リ，チャン 大気圧プラズマ発生装置を用いた円筒状及び環状の被処理物の表面処理システム及び方法
WO2024076321A1 (en) * 2022-10-07 2024-04-11 Coşkunöz Kalip Maki̇na Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇ A cleaning system to prevent liquid metal embrittlement in the welding area and a welding method using this cleaning system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4671848A (en) * 1984-12-17 1987-06-09 General Laser, Inc. Method for laser-induced removal of a surface coating
JPH01162583A (ja) * 1987-12-18 1989-06-27 Olympus Optical Co Ltd レーザ加工方法
DE3801068A1 (de) * 1988-01-15 1989-07-27 Maho Ag Verfahren und vorrichtung zum abtragen mittels gebuendelter energiestrahlen
US4877644A (en) * 1988-04-12 1989-10-31 Amp Incorporated Selective plating by laser ablation
JP2784224B2 (ja) * 1989-10-30 1998-08-06 三田工業株式会社 ドラム端部の塗膜除去方法および装置
US5164567A (en) * 1991-04-08 1992-11-17 The United States Of America As Represented By The United States Department Of Energy Laser cutting with chemical reaction assist
JPH0534934A (ja) * 1991-08-02 1993-02-12 Canon Inc 電子写真感光体およびその製造方法
US5278386A (en) * 1992-09-21 1994-01-11 Ford Motor Company System and method for selectively machining a D.C. motor
US5356081A (en) * 1993-02-24 1994-10-18 Electric Power Research Institute, Inc. Apparatus and process for employing synergistic destructive powers of a water stream and a laser beam

Also Published As

Publication number Publication date
JPH07284964A (ja) 1995-10-31
US5424508A (en) 1995-06-13

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Legal Events

Date Code Title Description
FF Decision: intention to grant
FG9A Patent or certificate of addition granted
B24H Lapse because of non-payment of annual fees (definitively: art 78 iv lpi)
B24F Patent annual fee: publication cancelled

Free format text: ANULADA A PUBLICACAO CODIGO 24.8 NA RPI NO 2256 DE 01/04/2014 POR TER SIDO INDEVIDA.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE AS 17A, 18A, 19A E 20A ANUIDADES.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2605 DE 08-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.