BR9007983A - Sujeicao para componentes eletronicos a serem esfriados - Google Patents
Sujeicao para componentes eletronicos a serem esfriadosInfo
- Publication number
- BR9007983A BR9007983A BR909007983A BR9007983A BR9007983A BR 9007983 A BR9007983 A BR 9007983A BR 909007983 A BR909007983 A BR 909007983A BR 9007983 A BR9007983 A BR 9007983A BR 9007983 A BR9007983 A BR 9007983A
- Authority
- BR
- Brazil
- Prior art keywords
- subjection
- cooled
- electronic components
- electronic
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19904002060 DE4002060A1 (de) | 1990-01-25 | 1990-01-25 | Halterung fuer zu kuehlende elektronische bauelemente |
PCT/DE1990/000990 WO1991011897A1 (de) | 1990-01-25 | 1990-12-22 | Halterung für zu kühlende elektronische bauelemente |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9007983A true BR9007983A (pt) | 1992-12-01 |
Family
ID=6398701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR909007983A BR9007983A (pt) | 1990-01-25 | 1990-12-22 | Sujeicao para componentes eletronicos a serem esfriados |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0511965A1 (de) |
JP (1) | JPH05504444A (de) |
AU (1) | AU6918791A (de) |
BR (1) | BR9007983A (de) |
DE (1) | DE4002060A1 (de) |
WO (1) | WO1991011897A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9113009U1 (de) * | 1991-10-19 | 1993-02-18 | Robert Bosch Gmbh, 7000 Stuttgart | Baugruppe für elektronische Steuergeräte |
JP3564130B2 (ja) * | 1992-09-14 | 2004-09-08 | サイテク・テクノロジー・コーポレーシヨン | ハイブリッド金属/複合構造体のガルバニック分解の減少 |
US5309979A (en) * | 1993-06-08 | 1994-05-10 | Delco Electronics Corp. | Self clamping heat sink assembly |
US6674164B1 (en) | 1999-04-26 | 2004-01-06 | Aerovironment, Inc. | System for uniformly interconnecting and cooling |
US7190589B2 (en) | 2004-10-19 | 2007-03-13 | Cinch Connectors, Inc. | Electronic control enclosure |
JP5267412B2 (ja) * | 2009-10-07 | 2013-08-21 | 株式会社デンソー | 冷媒冷却型両面冷却半導体装置 |
CN106535543A (zh) * | 2017-01-05 | 2017-03-22 | 科蒂斯技术(苏州)有限公司 | 控制器晶体管的固定装置 |
DE102022123568A1 (de) | 2022-09-15 | 2024-03-21 | Eberspächer Catem Gmbh & Co. Kg | Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3331207A1 (de) * | 1983-08-30 | 1985-03-07 | Robert Bosch Gmbh, 7000 Stuttgart | Baugruppe fuer elektronische steuergeraete |
US4669028A (en) * | 1986-02-18 | 1987-05-26 | Ncr Corporation | Heat sink for solid state devices connected to a circuit board |
US4872089A (en) * | 1988-12-19 | 1989-10-03 | Motorola Inc. | Heat sink assembly for densely packed transistors |
-
1990
- 1990-01-25 DE DE19904002060 patent/DE4002060A1/de not_active Withdrawn
- 1990-12-22 JP JP50118691A patent/JPH05504444A/ja active Pending
- 1990-12-22 WO PCT/DE1990/000990 patent/WO1991011897A1/de not_active Application Discontinuation
- 1990-12-22 EP EP19910900725 patent/EP0511965A1/de not_active Withdrawn
- 1990-12-22 BR BR909007983A patent/BR9007983A/pt unknown
- 1990-12-22 AU AU69187/91A patent/AU6918791A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP0511965A1 (de) | 1992-11-11 |
DE4002060A1 (de) | 1991-08-01 |
AU6918791A (en) | 1991-08-21 |
WO1991011897A1 (de) | 1991-08-08 |
JPH05504444A (ja) | 1993-07-08 |
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