BR9007983A - Sujeicao para componentes eletronicos a serem esfriados - Google Patents

Sujeicao para componentes eletronicos a serem esfriados

Info

Publication number
BR9007983A
BR9007983A BR909007983A BR9007983A BR9007983A BR 9007983 A BR9007983 A BR 9007983A BR 909007983 A BR909007983 A BR 909007983A BR 9007983 A BR9007983 A BR 9007983A BR 9007983 A BR9007983 A BR 9007983A
Authority
BR
Brazil
Prior art keywords
subjection
cooled
electronic components
electronic
components
Prior art date
Application number
BR909007983A
Other languages
English (en)
Portuguese (pt)
Inventor
Werner Hofmeister
Michael Wittenauer
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of BR9007983A publication Critical patent/BR9007983A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
BR909007983A 1990-01-25 1990-12-22 Sujeicao para componentes eletronicos a serem esfriados BR9007983A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19904002060 DE4002060A1 (de) 1990-01-25 1990-01-25 Halterung fuer zu kuehlende elektronische bauelemente
PCT/DE1990/000990 WO1991011897A1 (de) 1990-01-25 1990-12-22 Halterung für zu kühlende elektronische bauelemente

Publications (1)

Publication Number Publication Date
BR9007983A true BR9007983A (pt) 1992-12-01

Family

ID=6398701

Family Applications (1)

Application Number Title Priority Date Filing Date
BR909007983A BR9007983A (pt) 1990-01-25 1990-12-22 Sujeicao para componentes eletronicos a serem esfriados

Country Status (6)

Country Link
EP (1) EP0511965A1 (de)
JP (1) JPH05504444A (de)
AU (1) AU6918791A (de)
BR (1) BR9007983A (de)
DE (1) DE4002060A1 (de)
WO (1) WO1991011897A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9113009U1 (de) * 1991-10-19 1993-02-18 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe für elektronische Steuergeräte
JP3564130B2 (ja) * 1992-09-14 2004-09-08 サイテク・テクノロジー・コーポレーシヨン ハイブリッド金属/複合構造体のガルバニック分解の減少
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
US6674164B1 (en) 1999-04-26 2004-01-06 Aerovironment, Inc. System for uniformly interconnecting and cooling
US7190589B2 (en) 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
JP5267412B2 (ja) * 2009-10-07 2013-08-21 株式会社デンソー 冷媒冷却型両面冷却半導体装置
CN106535543A (zh) * 2017-01-05 2017-03-22 科蒂斯技术(苏州)有限公司 控制器晶体管的固定装置
DE102022123568A1 (de) 2022-09-15 2024-03-21 Eberspächer Catem Gmbh & Co. Kg Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3331207A1 (de) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe fuer elektronische steuergeraete
US4669028A (en) * 1986-02-18 1987-05-26 Ncr Corporation Heat sink for solid state devices connected to a circuit board
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors

Also Published As

Publication number Publication date
EP0511965A1 (de) 1992-11-11
DE4002060A1 (de) 1991-08-01
AU6918791A (en) 1991-08-21
WO1991011897A1 (de) 1991-08-08
JPH05504444A (ja) 1993-07-08

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