BR8102489A - Processo para preparacao de resinas vazaveis transparentes - Google Patents

Processo para preparacao de resinas vazaveis transparentes

Info

Publication number
BR8102489A
BR8102489A BR8102489A BR8102489A BR8102489A BR 8102489 A BR8102489 A BR 8102489A BR 8102489 A BR8102489 A BR 8102489A BR 8102489 A BR8102489 A BR 8102489A BR 8102489 A BR8102489 A BR 8102489A
Authority
BR
Brazil
Prior art keywords
transparent
liquid
resins
casting
preparation
Prior art date
Application number
BR8102489A
Other languages
English (en)
Portuguese (pt)
Inventor
H Denk
U Reeh
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR8102489A publication Critical patent/BR8102489A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Organic Insulating Materials (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Polyurethanes Or Polyureas (AREA)
BR8102489A 1980-04-25 1981-04-24 Processo para preparacao de resinas vazaveis transparentes BR8102489A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803016103 DE3016103A1 (de) 1980-04-25 1980-04-25 Verfahren zur herstellung transparenter geissharze

Publications (1)

Publication Number Publication Date
BR8102489A true BR8102489A (pt) 1982-01-05

Family

ID=6100999

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8102489A BR8102489A (pt) 1980-04-25 1981-04-24 Processo para preparacao de resinas vazaveis transparentes

Country Status (7)

Country Link
US (1) US4365052A (OSRAM)
EP (1) EP0039017B1 (OSRAM)
JP (1) JPS56167724A (OSRAM)
AT (1) ATE15213T1 (OSRAM)
BR (1) BR8102489A (OSRAM)
DE (2) DE3016103A1 (OSRAM)
GB (1) GB2074579B (OSRAM)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4555450A (en) * 1979-08-28 1985-11-26 Goodyear Aerospace Corporation Moisture-resistant transparent mercaptan compositions
DE3764975D1 (de) * 1986-01-17 1990-10-25 Ciba Geigy Gmbh Haertbare gemische auf basis von diglycidylverbindungen und metallkomplexverbindungen.
US4683281A (en) * 1986-06-23 1987-07-28 Ashland Oil, Inc. Organophosphite accelerators for epoxide curing
JP2792722B2 (ja) * 1990-07-16 1998-09-03 三菱電機株式会社 半導体発光装置
ATE150593T1 (de) * 1992-10-14 1997-04-15 Ibm Gekapselte, lichtemittierende diode und kapselungsverfahren
US5414293A (en) * 1992-10-14 1995-05-09 International Business Machines Corporation Encapsulated light emitting diodes
US5516727A (en) * 1993-04-19 1996-05-14 International Business Machines Corporation Method for encapsulating light emitting diodes
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP1441395B9 (de) 1996-06-26 2012-08-15 OSRAM Opto Semiconductors GmbH Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US6613247B1 (en) 1996-09-20 2003-09-02 Osram Opto Semiconductors Gmbh Wavelength-converting casting composition and white light-emitting semiconductor component
DE19936605A1 (de) * 1999-08-04 2001-02-15 Osram Opto Semiconductors Gmbh Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken
CA2397570C (en) * 2000-01-14 2012-10-16 Abb Power T & D Company Inc. Transparent epoxy structures
TWI226357B (en) 2002-05-06 2005-01-11 Osram Opto Semiconductors Gmbh Wavelength-converting reaction-resin, its production method, light-radiating optical component and light-radiating semiconductor-body
JP4718200B2 (ja) * 2005-02-14 2011-07-06 株式会社ネオス ジカルボン酸及びその塩
US20090129053A1 (en) * 2006-01-12 2009-05-21 Luminoso Photoelectric Technology Co. Light-enhanced element
TWI485202B (zh) * 2009-11-30 2015-05-21 日本化藥股份有限公司 Hardened resin composition and hardened product thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340212A (en) * 1961-11-09 1967-09-05 Minnesota Mining & Mfg Electrical insulating resin composition of epoxy resin, acid-terminated polyester and stannous octoate
US3336251A (en) * 1964-05-14 1967-08-15 Shell Oil Co Rapid curing fluidized bed coating composition
US3477971A (en) * 1966-10-06 1969-11-11 Shell Oil Co Rapid curing fluidized bed coating composition having improved flexibility
NL6614122A (OSRAM) * 1966-10-07 1968-04-08
CH546806A (de) * 1968-08-15 1974-03-15 Dow Chemical Co Verfahren zur herstellung von kunstharzformkoerpern.
US3689444A (en) * 1971-04-23 1972-09-05 Celanese Coatings Co Latent catalysts for one-component epoxy resin/anhydride compositions
BE791129A (fr) * 1971-11-10 1973-05-09 Ciba Geigy Melanges durcissables a chaud a base de resines epoxydiques
US4013987A (en) * 1975-08-22 1977-03-22 Westinghouse Electric Corporation Mica tape binder
DE2642465C3 (de) * 1976-09-21 1981-01-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung einer VerguBmasse

Also Published As

Publication number Publication date
US4365052A (en) 1982-12-21
EP0039017A2 (de) 1981-11-04
JPS6254336B2 (OSRAM) 1987-11-14
EP0039017A3 (en) 1982-07-21
EP0039017B1 (de) 1985-08-28
GB2074579A (en) 1981-11-04
DE3171986D1 (en) 1985-10-03
ATE15213T1 (de) 1985-09-15
JPS56167724A (en) 1981-12-23
GB2074579B (en) 1983-11-16
DE3016103A1 (de) 1981-10-29

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Legal Events

Date Code Title Description
MM Lapse due to non-payment of fees (art. 50)