BR112014005863A2 - alumínio zincado - Google Patents

alumínio zincado

Info

Publication number
BR112014005863A2
BR112014005863A2 BR112014005863A BR112014005863A BR112014005863A2 BR 112014005863 A2 BR112014005863 A2 BR 112014005863A2 BR 112014005863 A BR112014005863 A BR 112014005863A BR 112014005863 A BR112014005863 A BR 112014005863A BR 112014005863 A2 BR112014005863 A2 BR 112014005863A2
Authority
BR
Brazil
Prior art keywords
galvanized aluminum
galvanized
aluminum
Prior art date
Application number
BR112014005863A
Other languages
English (en)
Inventor
Cong Truong Hieu
Jiang Taixiang
Li Xianyao
Original Assignee
Monnaie Royale Canadienne/Royal Canadian Mint
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monnaie Royale Canadienne/Royal Canadian Mint filed Critical Monnaie Royale Canadienne/Royal Canadian Mint
Publication of BR112014005863A2 publication Critical patent/BR112014005863A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C21/00—Coins; Emergency money; Beer or gambling coins or tokens, or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
BR112014005863A 2011-09-13 2012-09-11 alumínio zincado BR112014005863A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161534334P 2011-09-13 2011-09-13
US201161534654P 2011-09-14 2011-09-14
PCT/CA2012/050645 WO2013037071A1 (en) 2011-09-13 2012-09-11 Zincating aluminum

Publications (1)

Publication Number Publication Date
BR112014005863A2 true BR112014005863A2 (pt) 2017-04-04

Family

ID=47882500

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014005863A BR112014005863A2 (pt) 2011-09-13 2012-09-11 alumínio zincado

Country Status (11)

Country Link
US (1) US9540735B2 (pt)
EP (1) EP2756116B1 (pt)
JP (1) JP2014530293A (pt)
KR (1) KR20140078662A (pt)
CN (1) CN103946427A (pt)
BR (1) BR112014005863A2 (pt)
CA (1) CA2848347C (pt)
ES (1) ES2586820T3 (pt)
MX (1) MX355419B (pt)
RU (1) RU2610811C9 (pt)
WO (1) WO2013037071A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040312A1 (en) * 2013-03-15 2016-02-11 United Technologies Corporation Sacrificial coating and procedure for electroplating aluminum on aluminum alloys
US20150101935A1 (en) * 2013-10-14 2015-04-16 United Technologies Corporation Apparatus and method for ionic liquid electroplating
US10105798B2 (en) 2015-11-05 2018-10-23 Honeywell International Inc. Surface improvement of additively manufactured articles produced with aluminum alloys
KR102471172B1 (ko) * 2016-06-03 2022-11-25 후루카와 덴끼고교 가부시키가이샤 표면 처리재 및 그 제조 방법 및 표면 처리재를 이용하여 형성한 부품
DE102017125096B4 (de) * 2017-10-26 2022-05-19 Hanon Systems Verfahren zum Herstellen eines Scrollverdichters und mit dem Verfahren hergestellter Scrollverdichter
WO2019176466A1 (ja) 2018-03-15 2019-09-19 三菱電機株式会社 半導体装置、電力変換装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3196886A (en) * 1962-07-25 1965-07-27 David C Brown Non-spillable nail polish applicator
ZA833074B (en) * 1983-05-06 1984-01-31 Alcan Int Ltd Zincating aluminium
CA1219708A (en) * 1984-05-01 1987-03-31 Michael J.H. Ruscoe Aureate coins, medallions and tokens
CA2013639C (en) 1990-04-02 1998-06-23 Mitsuhiro Yasuda Electroplated blank for coins, medallions and tokens
US5151167A (en) 1990-06-21 1992-09-29 Royal Canadian Mint Coins coated with nickel, copper and nickel and process for making such coins
CA2019568C (en) 1990-06-21 1998-11-24 Hieu C. Truong Coins coated with nickel, copper and nickel and process for making such coins
US5139886A (en) * 1990-06-21 1992-08-18 Royal Canadian Mint Coins coated with nickel, copper and nickel
JPH0535963A (ja) * 1991-07-26 1993-02-12 Yagiken:Kk ゲーム機用コインおよびその製造法
RU2100489C1 (ru) * 1993-01-21 1997-12-27 Государственный научно-исследовательский институт гражданской авиации Способ получения покрытия на деталях из алюминиевых сплавов
RU2082837C1 (ru) * 1993-12-14 1997-06-27 Орловская государственная сельскохозяйственная академия Способ подготовки поверхности деталей из алюминия и его сплавов перед нанесением гальванопокрытий
US6080447A (en) * 1998-05-14 2000-06-27 Enthone-Omi, Inc. Low etch alkaline zincate composition and process for zincating aluminum
US6656606B1 (en) * 2000-08-17 2003-12-02 The Westaim Corporation Electroplated aluminum parts and process of production
JP2004134310A (ja) * 2002-10-15 2004-04-30 Nippon Light Metal Co Ltd 耐食導電性皮膜を有する金属材及びその製造方法
US6790265B2 (en) * 2002-10-07 2004-09-14 Atotech Deutschland Gmbh Aqueous alkaline zincate solutions and methods
JP2007254866A (ja) * 2006-03-24 2007-10-04 Dowa Holdings Co Ltd アルミニウムまたはアルミニウム合金素材のめっき前処理方法
JP4538490B2 (ja) * 2007-11-26 2010-09-08 上村工業株式会社 アルミニウム又はアルミニウム合金上の金属置換処理液及びこれを用いた表面処理方法
CN101498013A (zh) * 2009-01-07 2009-08-05 嘉兴中科亚美合金技术有限责任公司 氨基磺酸镀镍液和镀镍方法
DK2495067T3 (da) * 2009-10-26 2014-07-07 Neomax Materials Co Ltd Beklædningsmateriale med et af en nikkel-magnesium-legering dannet bindelegeringslag

Also Published As

Publication number Publication date
JP2014530293A (ja) 2014-11-17
CN103946427A (zh) 2014-07-23
RU2610811C2 (ru) 2017-02-15
ES2586820T3 (es) 2016-10-19
EP2756116B1 (en) 2016-05-18
WO2013037071A1 (en) 2013-03-21
US9540735B2 (en) 2017-01-10
RU2610811C9 (ru) 2017-04-10
MX355419B (es) 2018-04-18
CA2848347C (en) 2019-07-02
EP2756116A4 (en) 2015-06-17
MX2014002884A (es) 2014-06-23
KR20140078662A (ko) 2014-06-25
CA2848347A1 (en) 2013-03-21
RU2014113212A (ru) 2015-10-20
US20140205856A1 (en) 2014-07-24
EP2756116A1 (en) 2014-07-23
WO2013037071A8 (en) 2013-06-13

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Legal Events

Date Code Title Description
B15I Others concerning applications: loss of priority

Free format text: PERDA DAS PRIORIDADES US 61/534,654 E US 61/534,334 REIVINDICADAS NO PCT/CA2012/050645, CONFORME AS DISPOSICOES PREVISTAS NA LEI 9.279 DE 14/05/1996 (LPI) ART. 16 7O, ITEM 28 DO ATO NORMATIVO 128/97 E NO ART. 29 DA RESOLUCAO INPI-PR 77/2013. ESTA PERDA SE DEU PELO FATO DE O DEPOSITANTE CONSTANTE DA PETICAO DE REQUERIMENTO DO PEDIDO PCT (MONNAIE ROYALE CANADIENNE/ROYAL CANADIAN MINT) SER DISTINTO DAQUELES QUE DEPOSITARAM A PRIORIDADE REIVINDICADA E NAO APRESENTOU DOCUMENTO COMPROBATORIO DE CESSAO DENTRO DO PRAZO DE 60 DIAS A CONTAR DA DATA DA ENTRADA DA FASE NACIONAL, CONFORME AS DISPOSICOES PREVISTAS NA LEI 9.279 DE 14/05/1996 (LPI) ART. 16 6O, ITEM 27 DO ATO NORMATIVO 128/97 E NO ART. 2

B12F Appeal: other appeals
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2507 DE 22/01/2019.