BR112012001352A2 - embalagem ou montagem de um componente - Google Patents

embalagem ou montagem de um componente

Info

Publication number
BR112012001352A2
BR112012001352A2 BR112012001352A BR112012001352A BR112012001352A2 BR 112012001352 A2 BR112012001352 A2 BR 112012001352A2 BR 112012001352 A BR112012001352 A BR 112012001352A BR 112012001352 A BR112012001352 A BR 112012001352A BR 112012001352 A2 BR112012001352 A2 BR 112012001352A2
Authority
BR
Brazil
Prior art keywords
packing
assembling
component
Prior art date
Application number
BR112012001352A
Other languages
English (en)
Inventor
Kate Stone
Original Assignee
Novalia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novalia Ltd filed Critical Novalia Ltd
Publication of BR112012001352A2 publication Critical patent/BR112012001352A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
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    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Led Device Packages (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Packaging Frangible Articles (AREA)
BR112012001352A 2009-07-22 2010-06-30 embalagem ou montagem de um componente BR112012001352A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0912742A GB2472047B (en) 2009-07-22 2009-07-22 Packaging or mounting a component
PCT/GB2010/051074 WO2011010118A1 (en) 2009-07-22 2010-06-30 Packaging or mounting a component

Publications (1)

Publication Number Publication Date
BR112012001352A2 true BR112012001352A2 (pt) 2016-03-15

Family

ID=41058364

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012001352A BR112012001352A2 (pt) 2009-07-22 2010-06-30 embalagem ou montagem de um componente

Country Status (7)

Country Link
US (1) US9070739B2 (pt)
EP (1) EP2457252B1 (pt)
JP (1) JP5536211B2 (pt)
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GB2472047B (en) 2011-08-10
US20120117797A1 (en) 2012-05-17
US9070739B2 (en) 2015-06-30
CN102473685B (zh) 2015-06-10
GB2472047A (en) 2011-01-26
CN102473685A (zh) 2012-05-23
EP2457252B1 (en) 2014-08-06
JP5536211B2 (ja) 2014-07-02
JP2012533901A (ja) 2012-12-27
WO2011010118A1 (en) 2011-01-27
GB0912742D0 (en) 2009-08-26

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