BR0115688A - Grade estampada com elemento de fixação - Google Patents

Grade estampada com elemento de fixação

Info

Publication number
BR0115688A
BR0115688A BR0115688-8A BR0115688A BR0115688A BR 0115688 A BR0115688 A BR 0115688A BR 0115688 A BR0115688 A BR 0115688A BR 0115688 A BR0115688 A BR 0115688A
Authority
BR
Brazil
Prior art keywords
grille
patterned
fastener
stamped
structural part
Prior art date
Application number
BR0115688-8A
Other languages
English (en)
Inventor
Inigo Felgueroso
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of BR0115688A publication Critical patent/BR0115688A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Motor Or Generator Frames (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
  • Slide Fasteners, Snap Fasteners, And Hook Fasteners (AREA)
  • Connection Of Plates (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

"GRADE ESTAMPADA COM ELEMENTO DE FIXAçãO". A invenção refere-se a uma grade estampada segundo o estado da técnica que precisa ser fixada por um ciclo de fabricação adicional em uma peça estrutural. Uma grade estampada(1) de acordo com a invenção apresenta pelo menos um elemento de fixação (5) e é fixada simultaneamente por ocasião da montagem sem outros meios de auxílio na peça estrutural (3).
BR0115688-8A 2000-11-30 2001-11-24 Grade estampada com elemento de fixação BR0115688A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10059419A DE10059419A1 (de) 2000-11-30 2000-11-30 Stanzgitter mit Befestigungselement
PCT/DE2001/004434 WO2002045471A1 (de) 2000-11-30 2001-11-24 Stanzgitter mit befestigungselement

Publications (1)

Publication Number Publication Date
BR0115688A true BR0115688A (pt) 2003-09-09

Family

ID=7665216

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0115688-8A BR0115688A (pt) 2000-11-30 2001-11-24 Grade estampada com elemento de fixação

Country Status (7)

Country Link
US (1) US7419408B2 (pt)
EP (1) EP1340416A1 (pt)
JP (1) JP4029037B2 (pt)
KR (1) KR100919385B1 (pt)
BR (1) BR0115688A (pt)
DE (1) DE10059419A1 (pt)
WO (1) WO2002045471A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10735900B1 (en) 2019-05-06 2020-08-04 Apple Inc. Ranging measurements for spatially-aware user interface of a mobile device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4430798A1 (de) * 1994-08-30 1996-03-07 Siemens Ag Stanzgitter zur Verbindung von elektrischen Bauelementen
DE3512161A1 (de) * 1985-04-03 1986-10-09 Paul Vahle GmbH & Co KG, 4708 Kamen Stromschienenhalter aus kunststoff
JPS6335261A (ja) 1986-07-30 1988-02-15 住友製薬株式会社 製剤投与器
JPH01146717A (ja) * 1987-12-02 1989-06-08 Amada Co Ltd 射出成形装置における製品取出し方法
WO1989005746A1 (en) * 1987-12-14 1989-06-29 Alfred Teves Gmbh Valve block aggregate
FR2651933B1 (fr) * 1989-09-08 1992-11-13 Ecia Equip Composants Ind Auto Moteur electrique a commutation electronique a structure perfectionnee.
DE4412319A1 (de) 1994-04-11 1995-10-12 Teves Gmbh Alfred Stromzuführungsanordnung für einen Elektromotor mit vier Bürsten
US5876237A (en) * 1994-05-11 1999-03-02 Molex Incorporated Electrical connector
DE19629643C2 (de) * 1996-07-23 2000-05-04 Kostal Leopold Gmbh & Co Kg Bauteileträger
DE19707709C1 (de) 1997-02-26 1998-04-16 Siemens Ag Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel
DE10007263A1 (de) * 1999-02-19 2000-08-24 Whitaker Corp Anordnung zur Befestigung von Leiterbahnebenen auf einer Montageplatte, Montageplatte für zumindest eine Leiterbahnebene und Verwendung einer Anordnung und einer Montageplatte
JP2000299911A (ja) * 1999-04-13 2000-10-24 Yazaki Corp 電気接続箱
DE19922819A1 (de) * 1999-05-19 2000-11-23 Zahnradfabrik Friedrichshafen Verfahren zur horizontalen Montage einer Steckdose

Also Published As

Publication number Publication date
DE10059419A1 (de) 2002-06-13
JP2004515068A (ja) 2004-05-20
US7419408B2 (en) 2008-09-02
JP4029037B2 (ja) 2008-01-09
US20040219844A1 (en) 2004-11-04
WO2002045471A1 (de) 2002-06-06
EP1340416A1 (de) 2003-09-03
KR20030059284A (ko) 2003-07-07
KR100919385B1 (ko) 2009-09-29

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: CONFORME ARTIGO 10O DA RESOLUCAO 124/06, CABE SER ARQUIVADO REFERENTE AO NAO RECOLHIMENTO DA 8A, 9AE 10A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2144 DE 07/02/2012.